• Journal of the Semiconductor & Display Technology
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• v.21 no.4
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• pp.45-49
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• 2022

Through Silicon Via (TSV) is a technology that interconnects chips through silicon vias. TSV technology can achieve shorter distance compared to wire bonding technology with excellent electrical characteristics. Due to this characteristic, it is currently being used in many fields that needs faster communication speed such as memory field. However, there is performance degradation issue on TSV technology due to the parasitic capacitance. To deal with this problem, in this study, the parasitic capacitance with TSV design factors is analyzed using commercial tool. TSV design factors were set in three categories: size, aspect ratio, pitch. Each factor was set by dividing the range with TSV used for memory and package. Ansys electronics desktop 2021 R2.2 Q3D was used for the simulation to acquire parasitic capacitance data. DOE analysis was performed based on the reaction surface method. As a result of the simulation, the most affected factors by the parasitic capacitance appeared in the order of size, pitch and aspect ratio. In the case of memory, each element interacted, and in the case of package, it was confirmed that size * pitch and size * aspect ratio interact, but pitch * aspect ratio does not interact.

• Applied Chemistry for Engineering
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• v.35 no.2
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• pp.96-99
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• 2024

A sintering paste for bonding copper plates was synthesized using Cu formate nanofibers on Cu microparticles, mixed with formic acid. Copper oxide nanofibers of 10 ㎛ grown at 400 ℃ on Cu microparticles on the surface were transformed into copper formate nanofibers through the mixing of formic acid. Compared to Cu bulk particles or nanoparticles, Cu formate on Cu microparticles decomposed into metallic Cu at a lower temperature of 210 ℃, facilitating the sintering of copper paste. The growth of nanofiber on Cu microparticles allowed for an increase in the reaction rate of formation to copper formate, aggregating surface area, and decomposition rate of copper formate, resulting in fast sintering.

• Journal of the Korea Organic Resources Recycling Association
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• v.31 no.1
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• pp.35-45
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• 2023

In this study, the sludge formation in the wastewater drain from the advanced packaging process mechanisms are revealed as well as the key factors, materials, and sludge prevention methods using surfactant. Compared with that of conventional packaging process, advanced packaging process employ similar process to the semiconductor fabrication process, and thus many processes may generate wastewater. In specific, a large amount of wastewater may generate during the carrier wafer bonding, photo, development, and carrier wafer debonding processes. In order to identify the key factors for the formation of sludge during the advanced packaging process, six types of chemicals including bonding glue, HMDS, photoresist (PR), PR developer, debonding cleaner, and water are utilized and mixing evaluation is assessed. As a result, it is confirmed that the black solid sludge is formed, which is originated by the sludge seed formation by hydrolysis/dehydration reaction of HMDS and sludge growth via hydrophobic-hydrophobic binding with sludge seed and PR. For the sludge prevention investigation, three surfactants of CTAB, PEG, and shampoo are mixed with the key materials of sludge, and it is confirmed that the sludge formations are successfully suppressed. The underlying mechanism behind the sludge formation is that the carbon tails of the surfactant bind to PR with hydrophobic-hydrophobic interaction and inhibit the reaction with HMDS-based slurry seeds to prevent the sludge formation. In this regard, it is expected that various problems like clogging in drains and pipes during the advanced packaging process may effectively solve by the injection of surfactants into the drains.

• Korean Journal of Materials Research
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• v.11 no.7
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• pp.556-561
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• 2001

We prepared a new a SOS(silicon-on-silicide) wafer pair which is consisted of Si(100)/1000$\AA$-NiSi Si (100) layers. SOS can be employed in MEMS(micro- electronic-mechanical system) application due to low resistance of the NiSi layer. A thermally evaporated $1000\AA$-thick Ni/Si wafer and a clean Si wafer were pre-mated in the class 100 clean room, then annealed at $300~900^{\circ}C$ for 15hrs to induce silicidation reaction. SOS wafer pairs were investigated by a IR camera to measure bonded area and probed by a SEM(scanning electron microscope) and TEM(transmission electron microscope) to observe cross-sectional view of Si/NiSi. IR camera observation showed that the annealed SOS wafer pairs have over 52% bonded area in all temperature region except silicidation phase transition temperature. By probing cross-sectional view with SEM of magnification of 30,000, we found that $1000\AA$-thick uniform NiSi layer was formed at the center area of bonded wafers without void defects. However we observed debonded area at the edge area of wafers. Through TEM observation, we found that $10-20\AA$ thick amourphous layer formed between Si surface and NiSix near the counter part of SOS. This layer may be an oxide layer and lead to degradation of bonding. At the edge area of wafers, that amorphous layer was formed even to thickness of $1500\AA$ during annealing. Therefore, to increase bonding area of Si NiSi ∥ Si wafer pairs, we may lessen the amorphous layers.

• Journal of the Korean Wood Science and Technology
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• v.38 no.4
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• pp.316-322
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• 2010

The research attempted to develop a wood adhesive based on waste cooking oil, using ozonification technology for the chemical structure modification. The waste cooking oil (WCO) was reacted with $O_3$ for different times; 1 h, 2 h, and 3 h. The chemical structure modifications of the ozonized WCOs were examined by Fourier transform Infrared (FT-IR) spectrum. The FT-IR spectrum of WCO had an absorbance peak at 3,010 $cm^{-1}$ that was the characteristic peak of the unsaturated double bonds. As ozone treatment time increased, the peak of the double bond was disappeared and carboxyl peak appeared at 1,700 $cm^{-1}$. Especially, the double bond of 3 hrs-ozonized WCO was vanished almost. In results of the dry bonding strengths of the 3 hrs-ozonized WCO mixed with polymeric methylene diphenyl diisocyanate (pMDI) were the strengths of weight ratio of 3hrs-ozonized WCO : pMDI, 1 : 0.5, 8.08 kgf/$cm^2$, 1 : 0.75, 9.53 kgf/$cm^2$ 1 : 1, 44.16 kgf/$cm^2$, 1 : 2, 58.08 kgf/$cm^2$, 1 : 3, 61.41 kgf/$cm^2$, and 1 : 4, 46.95 kgf/$cm^2$. Therefore, it was found that the optimum equivalent ratio was formed at the ratio of 1 : 2 or 1 : 3. Under wetting the bonding strength of 1 : 3 ratio was appeared higher than that of 1 : 2 ratio, while the results obtained from hot-water and cyclic boiling shear test were similar.

• Journal of the Korean Wood Science and Technology
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• v.35 no.3
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• pp.36-44
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• 2007

The purpose of this study was to investigate thermal stability, reactivity, and bonding strength of existing epoxy resin mixed with the epoxidized soybean oil (ESBO) in order to use soybean oil economically. In the dry shear test, the marked strengths showed $30.5kgf/cm^2$ at the ratio of ESBO to epoxy resin 9 : 1 and $6.2kgf/cm^2$ at the ratio 8 : 2. The bonding strengths of the others, except mixing ratios 2 : 8 and 1 : 9, exceeded the requirement of Korean plywood standard of $7.0kgf/cm^2$. In the wet shear test, the result was $5.8kgf/cm^2$ at the ratio 9 : 1. There were no thickness swelling and moisture absorption in the water resistance of the film. The value of activation energy, Tg (${\Delta}E$), by DSC analysis showed between $110^{\circ}C$ and $120^{\circ}C$ through all ratios. Epoxy in the epoxy resin fully reacted with the hardener (TETA), but it is difficult to decide that epoxys in the ESBO were reacted directly with the hardener from FT-IR analysis. As the mixing ratio of ESBO increased, the thermal stabilities dropped from TGA analysis. From the comprehensive view on the results of above experiments, it could be confirmed through experiments that the ESBO in the mixed adhesive of epoxy resin/ESBO played a role as an extending agent level of epoxy adhesive, and we were able to know that in order to utilize ESBO as an adhesive, a study should be performed on the condition of hardening, inducible of the hardening reaction.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.23 no.1
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• pp.31-36
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• 2013

Acetylated Cellulose Ether (ACE), cellulose-based amphiphilic polymer with hydrophilic and hydrophobic, was synthesized and investigated in terms of its solubility and wettability for organic solvents and water. Acetyl group was substituted to the cellulose ether in a hydrophilic polymer by esterification. As a result of FT-IR, the peak corresponding to the hydroxyl group decreased and carboxyl acid peak increased with increasing reaction time and temperature, which signified the increase in the degree of acetylation of the ACE. There were similar thermal decomposition behaviors before and after esterification reaction until $800^{\circ}C$ so that the reaction occurred without significant structural changes of cellulose backbones. The solubility parameter of the ACE had a range of 18.5~26.4, and its viscosity and turbidity were controlled according to the solubility parameter of organic solvents. The ACE showed the hydrophilicity because the contact angle of the ACE was higher than the cellulose ether. These results confirmed that the ACE had the hydrophobicity and hydrophilicity due to the ether which was glucosidic bonding between the glucose units and un-reacted hydroxyl functional groups in the ACE.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Korean Chemical Engineering Research
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• v.51 no.5
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• pp.531-535
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• 2013

The effect of heat-treatment temperature on the activity of catalysts was studied by investigating $N_2O$ decomposition reaction in Fe ion-supported BEA Zeolite. As a result of $N_2O$ decomposition reaction experiment, $N_2O$ decomposition activity significantly decreased as heat-treatment temperature of Fe/BEA catalyst increased. the shape and size of the particles of Fe/BEA catalyst following the rise of heat-treatment temperature did not display a significant change. But following the rise of the heat-treatment temperature, its surface area was significantly reduced. Also it was confirmed that as the heat-treatment temperature rose, the crystallization of ${\beta}$ structure was greatly reduced. And as heat-treatment temperature rose, while SiO structure either increased or did not exhibit much change, the structure of Fe bonded with lattice structure was speculated to decrease. From the stated results, it was concluded that the increase of heat-treatment temperature became the cause of the declined activity of catalysts by destruction of its ${\beta}$ structure of bonding aluminium and Fe atoms.

• Bulletin of the Korean Chemical Society
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• v.27 no.9
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• pp.1310-1314
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• 2006

Sulfur-substituted $LiMn_{0.9}Cr_{0.1}O_{2-x}S_x$ $(0\;\leq\;x\;\leq\;0.1)$ layered oxides have been prepared by solid state reaction under inert atmosphere. From powder X-ray diffraction analyses, all the present lithium manganates were found to be crystallized with monoclinic-layered structure. Electrochemical measurements clearly demonstrated that, in comparison with the pristine $LiMn_{0.9}Cr_{0.1}O_2$, the sulfur-substituted derivatives exhibit smaller discharge capacities for the entire cycle range but the recovery of discharge capacity after the initial several cycles becomes faster upon sulfur substitution. The effect of the sulfur substitution on the chemical bonding nature of $LiMn_{0.9}Cr_{0.1}O_{2-x}S_x$has been investigated using X-ray absorption spectroscopic (XAS) analyses at Mn and Cr K-edges. According to Mn K-edge XAS results, the trivalent oxidation state of manganese ion remains unchanged before and after the substitution whereas the local structure around manganese ions becomes more distorted with increasing the substitution rate of sulfur. On the other hand, the replacement of oxygen with sulfur has negligible influence on the local atomic arrangement around chromium ions, which is surely due to the high octahedral stabilization energy of $Cr^{+III} $ ions. Based on the present experimental findings, we have suggested that the decrease of discharge capacity upon sulfur substitution is ascribable to the enhanced structural distortion of $MnO_6$ octahedra and/or to the formation of covalent Li-S bonds, and the accompanying improvement of cyclability would be related to the depression of Mn migration and/or to the pillaring effect of larger sulfur anion.