Chemical Structure of Ozonized Waste Cooking Oil and Wood Bonding Strengths of Reaction Products with pMD |
Kang, Chan-Young
(Dept. of Forest Science, Konkuk University)
Lee, Eung-Su (Dept. of Forest Science, Konkuk University) Ryu, Jae-Yun (Wood R&D Lab., Wood Process & Products Distribution Center, National Forestry Cooperatives Federation) Lee, Hyun-Jong (Dept. of Forest Science, Konkuk University) Seo, Jun-Won (Dept. of Wood Science & Engineering, College of Forestry, Oregon State University) Park, Heon (Dept. of Forest Science, Konkuk University) |
1 | Nevin, C. S. and B. F. Moser. 1963, Vinyl oil Monomer - vicinal methacryloxy hydroxy soy oils, Journal of Applied Polymer Science 7: 1853-1855. DOI |
2 | Kang, E. C. and H. Park. 2007. Curing behavior of urea-formaldehyde resin modified with cooking waste oil-based pMDI prepolymer and its influence on particleboard properties. Forest Prod. J. 57(6): 51-58. |
3 | Marcinko, J. J., S. Devathala., P. L. Rinaldi, and S. Bao. 1998. Investigating the molecular and bulk dynamics of PMDI/wood and UF/wood composites. Forest Prod. J. 48(6): 81-84. |
4 | Narine, S. S., J. Yue, and X. Kong. 2007. Production of polyols from Canola oil and their chemical identification and physical properties, J Amer Oil Chem Soc 84: 173-179. DOI |
5 | 유영삼, 최진림, 서준원, 박헌. 2006. 콩기름 이용을 위한 지방산-글리세롤-PMDI와 요소수지 혼용 접착제가 접착성능에 미치는 영향. 목재공학 34(4): 31-36. 과학기술학회마을 |
6 | 유영삼, 이현종, 이택준, 박헌. 2008. 오존산화 처리한 콩기름을 이용한 변성 pMDI 접착제의 화학구조 및 접착력 변화. 목재공학 36(4): 37-43. |
7 | 유영삼, 이현종, 이택준, 박헌. 2009. 오존산화 콩기름의 구조분석 및 이를 이용한 변성 pMDI 접착제의 중량비에 따른 접착력 변화. 목재공학 37(1): 56-64. 과학기술학회마을 |
8 | Adams, A. D. 1980. Emulsifiable MDI isocyanate binder for particleboard and wafweboard. Proceedings of 14th Washington State University International Symposium on Particleboard., T. M. Maloney, Ed., Washington State Univ., Pullman, WA pp. 195-205. |
9 | Gunstone, F. D. 1993. The study of natural epoxy oils and epoxidized vegetable oils by nuclear magnetic resonanace spectroscopy. Journal of the American Oil Chemistry Society 70: 1139-1144. DOI |