• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.23 no.1
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• pp.1-7
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• 2017

The recognition rate of RFID system is made a big difference by the selection of tag type and performance of reader, packing materials and the attachment location of tag and the recognition of angle according to the above factors. Water content is the most effective factor among the various elements that affected to the recognition of RFID as the center. Therefore, the purpose of this study was to measure the RFID recognition rate per water content, the distance recognition rate of RFID tag, the RFID tag and the recognition rate by contact area. In analysis of recognition rate according to water content, 100% of recognition was possible when food product contained 0~25% moisture. However, when water content was over than 30%, recognition rate was declined less than 95%. The recognition rate between RFID tag according to water content was higher when distance was over than 0.3 cm. In the recognition rate about the contact area of RFID tag according to water content, the recognition rate was declined when the contact area becomes wider.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.1B
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• pp.62-67
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• 2010

Our research group has investigated that RFID tag packaging development and RFID tag flip chip bonding method influences on the industry-environmental customized RFID tag development that has applications to various industry environmental conditions. RFID tag flip chip bonding is consisting with wire bonding, ultrasonic bonding, heat plate bonding, and laser bonding and those methods are also depending on the different RFID tag development. Our research data shows that, among the various industrial environments such as an extremely high temperature, cryogenic, high-humidity, flexible, high-durable, development of RFID tag in an extremely high temperature is inappropriate for laser bonding method, converting of heat energy as absorbing light energy or heat plate bonding method of straight heat transferring manner, on the other hand, is suitable for wire bonding method which directly connect bump to pattern using wire.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.3
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• pp.211-221
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• 2023

This study was conducted as a basic study for the selection of tags suitable for logistics management in the palletized unit-load unit and the development of various technologies to activate the palletized unit-load shipment of agricultural products through local APCs. Three types of passive RFID tags of UHF 900 MHz and one type of active RFID tag of 2.4 GHz band designed and manufactured through this study were used to analyze the receiving strength according to the tag's attachment location and distance of the palletized unit-load of agricultural products. In the passive RFID tag, there was a large difference in receiving strength by the tag's attachment location and a large amount of data loss depending on the distance within 30 m, whereas, in the active RFID tag, it was superior to the passive tags in terms of both receiving strength and data loss. Therefore, active tags are desirable from the perspective of multiple identification of warehouses with large spaces in relation to the application of RFID tags for palletized unit-loads of agricultural products, but the development of low-power technologies such as software wakeup power management as well as hardware to minimize battery power consumption is necessary.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.507-515
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• 2012

Recently RFID(Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve productivity and reliability. This study is performed on FMEA, reliability at development level and analysis failure mode through environment and mechanical test. Robust design is applied to search the optimized condition of factor and RFID tag packaging should be satisfied with high MTTF.

• The monthly packaging world
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• s.202
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• pp.62-69
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• 2010

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.6
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• pp.923-931
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• 2013

RFID (Radio Frequency Identification), which is a kind of the electronic tag, is a wireless access device using the radio frequency for recognizing the ID information. It has a variety of application such as the bus card, gate access card, distribution industry, and management of construction materials. The performance and size of RFID depend on the penetrability, recognition ratio, memory size, multi tag recognition, external pollution dust, and exterior impact, and RFID requires the packaging to protect itself considered above factors. Recently, RFID is diversely employed to effectively manage construction materials and the RFID packaging, which is robust to the external impact, is required to attach RFID on construction materials. In this paper, we propose the construction material RFID packaging designed to be robust for the external impact and to be practicable for change of the broken RFID. For the change of RFID, we separate the cast and body of the packaging. Also, we present the detail drawing for the proposed construction material RFID packaging and implement the performance evaluation of the packaging manufactured using 3D printer.

• The monthly packaging world
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• s.209
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• pp.78-82
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• 2010

• The monthly packaging world
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• s.177
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• pp.115-119
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• 2008

• The monthly packaging world
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• no.6 s.182
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• pp.60-72
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• 2008

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.14 no.1
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• pp.15-22
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• 2008

The excitement over radio frequency identification (RFID) technology has gained momentum in the last five years, with a diversification in the range of applications. Besides academic research into radio frequency identification (RFID) has proliferated over the last few years, however there is much to be desired on Packaging industry. In this paper, we present a literature reviews of researches of RFID system on Packaging, especially focused on RFID system standardization into packaging. There is not any packaging standard or guidance about tag locations, classification with the materials and so on. Therefore it hampers reduction of the distribution costs on political and corporate sides, and lack consistency of applying RFID system. The main focus of this review paper is to establish a constituency about legislating RFID system standard on packaging. It is hoped that the review will be a good resource for future research in order to applly RFID system to Packaging industry effectively.