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Bonding Method and Packaging of High Temperature RFID Tag  

Choi, Eun-Jung ((재)광양만권 u-IT 연구소)
Yoo, Dea-Won ((재)광양만권 u-IT 연구소)
Byun, Jong-Hun ((재)광양만권 u-IT 연구소)
Ju, Dae-Keun ((재)광양만권 u-IT 연구소)
Sung, Bong-Gun ((재)광양만권 u-IT 연구소)
Cho, Byung-Lok (순천대학교)
Publication Information
The Journal of Korean Institute of Communications and Information Sciences / v.35, no.1B, 2010 , pp. 62-67 More about this Journal
Abstract
Our research group has investigated that RFID tag packaging development and RFID tag flip chip bonding method influences on the industry-environmental customized RFID tag development that has applications to various industry environmental conditions. RFID tag flip chip bonding is consisting with wire bonding, ultrasonic bonding, heat plate bonding, and laser bonding and those methods are also depending on the different RFID tag development. Our research data shows that, among the various industrial environments such as an extremely high temperature, cryogenic, high-humidity, flexible, high-durable, development of RFID tag in an extremely high temperature is inappropriate for laser bonding method, converting of heat energy as absorbing light energy or heat plate bonding method of straight heat transferring manner, on the other hand, is suitable for wire bonding method which directly connect bump to pattern using wire.
Keywords
RFID Tag; RFID Tag Packaging; Flip Chip Bonding; High Temperature; Wire Bonding; Laser Bonding;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
연도 인용수 순위
1 M. Ward and R. V. Kranenburg, "RFID: Frequency, Standards, Adoption and Innovation", JISC Techhology and Standards Watch May 2006.
2 강혜운, 최영재, 남성호, 이석우, 최현종, "ACF를 이용한 Flip-Chip 본딩 공정에서의 공정조건 최적화", 한국정밀공학회논문지, pp.531-532 2008.
3 류광현, 조상우, 남기중, "레이저 접합 방법을 이용한 RFID tag 생산시스템", 한국정밀공학회논문지, pp.43-44 2008.
4 최영재, 김광민, 최병열, 최현종, 이석우, "Flip Chip 형상에 따른 ACF 본딩 특성 분석", 한국정밀공학외논문지 pp.519-520, 2008.
5 이준식, 김정한, 김목순, 이종현, "RFID tag의 제작 공정에서 비등방 전도성 접착제를 사용한 flip chip bonding 조건의 영향", 한국용접접합학회논문지, pp.223-226 2007.
6 J. Banks, M. Pachano, L. Thompson, and D. Hanny, RFID Applied, John Wiley and Sons 2007.
7 지식경제부, "IT 부품용 이방성 도전 접속제 (ACF)" 2009.