References
- Yates, W. D., 1988, "Reliability Advisor Expert System," Aerospace and Electronics Conference, Vol. 4, pp. 1346-1348.
- Bieda, J., 1992, "A Product-cycle Cost-analysis Process and Its Application to the Automotive Environment," Reliability and Maintainability Symposium, pp. 422-425.
- MIL-STD, 1995, MIL-STD-883, Military Standards, USA.
- Wagner, U., Franz, J., and Schweiker, M., 2001, "Mechanical Reliability of MEMS-structures under Shock Load," Microelectronics and Reliability, Vol. 41, No. 9-10, pp. 1657-1662. https://doi.org/10.1016/S0026-2714(01)00173-1
- McCluskey, P., 2002, "Design for Reliability of Microelectro- mechanical Systems," Electronic Components and Technology Conference, pp. 760-762.
- Muller, F. R., Wagner, U., and Bernhard, W., 2002, "Reliability of MEMS- A Methodical Approach," Microelectronics Reliability, Vol. 42, No. 9-11, pp. 1771-1776. https://doi.org/10.1016/S0026-2714(02)00229-9
- Khanna, P. K., Bhatnagar, S. K., and Gust, W., 1999, "Analysis of Packaging and Sealing Techniques for Microelectronics Modules and Recent Advances," Microelectronic International, Vol. 16, No. 2, pp. 8-12.
- Finn, J., 1995, Electronic Component Reliability, John Wiley, USA, pp. 21-153.
- Davy, J. G., 1975, "Calculation for Leak Rates of Hermetic Packages," IEEE Transactions on PARTS Hybrids and packaging, Vol. 11, No. 3, pp. 177-189. https://doi.org/10.1109/TPHP.1975.1135069
- Stanley R., 1980, "A Rapid Cycle Method for Gross Leak Testing With the Helium Leak Detector," IEEE Transactions on Components Hybrids and Manufacturing Technology, Vol. 3, No. 4, pp. 564-570. https://doi.org/10.1109/TCHMT.1980.1135652
- Richard, K., and Traeger, 1977, "Non-hermeticity of Polymeric Lid Sealants," IEEE Transactions on parts, Hybrids, and packaging, Vol. 13, No. 2, pp. 147-152. https://doi.org/10.1109/TPHP.1977.1135193
- Hal, G., 2000, Hermeticity of Electronic Packages, William Andrew Publishing, LLC, Norwich, New York.
- Yiping, W., 2004, "RFID Tag Manufacturing," Global SMT & Packaging, Vol. 4, No. 6, pp. 4-7.
- An, B., Cai, X. H., and Chu, H. B., 2007, "Flex Reliability of RFID Inlays Assembled by Anisotropic Conductive Adhesive," 9th Int'l IEEE CPMT Symp on High Density Design, Packaging and Microsystem Integration, pp. 60-63.
- Imhoff, A. C., 1999, "Packaging Technologies for RFICs: Current Status and Future Trends," IEEE Radio Frequency Integrated Circuits Symposium, pp. 7-10.
- Kim, S. K., and Lim, E. M., 2011, "Dynamic Leliability of Board Level by Changing the Design Parameters of Flip Chips," Korean Society of Manufacturing Technology Engineers, Vol. 20, No. 5, pp. 559-563.