• Title/Summary/Keyword: RF-plasma

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The Evolution of Preferred Orientation and Morphology of NiO Thin Films under Variation of Plasma gas and RF Sputtering Power (플라즈마 가스와 RF 파워에 따른 NiO 박막의 우선배향성 및 표면형상 변화)

  • Ryu Hyun-Wook;Choi Gwang-Ryo;Noh Whyo-Sup;Park Yong-Ju;Kwon Yong;Park Jin-Seong
    • Korean Journal of Materials Research
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    • v.14 no.2
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    • pp.121-125
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    • 2004
  • Nickel oxide (NiO) thin films were deposited on Si(100) substrates at room temperature by RF magnetron sputtering from a NiO target. The effects of plasma gas and RF power on the crystallographic orientation and surface morphology of the NiO films were investigated. X-ray diffraction (XRD), field emission scanning electron microscopy (FE-SEM) and atomic force microscopy (AFM) were employed to characterize the deposited film. It was found that the type of plasma gases affected the crystallographic orientation, deposition rate, surface morphology, and crystallinity of NiO films. Highly crystalline NiO films with (100) orientation were obtained when it was deposited under Ar atmosphere. On the other hand, (l11)-oriented NiO films with poor crystallinity were deposited in $O_2$. Also, the increase in RF power resulted in not only higher deposition rate, larger grain size, and rougher surface but also higher crystallinity of NiO films.

Electrical Variable Capacitor based on Symmetrical Switch Structure for RF Plasma System (대칭적인 스위치 구조 기반 RF 플라즈마 시스템 적용 전기적 가변 커패시터)

  • Min, Juhwa;Chae, Beomseok;Kim, Hyunbae;Suh, Yongsug
    • The Transactions of the Korean Institute of Power Electronics
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    • v.24 no.3
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    • pp.161-168
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    • 2019
  • This study introduces a new topology to decrease the voltage stress experienced by a 13.56 MHz electrical variable capacitor (EVC) circuit with an asymmetrical switch structure applied to the impedance matching circuit of a radio frequency (RF) plasma system. The method adopts a symmetrical switch structure instead of an asymmetrical one in each of the capacitor's leg in the EVC circuit. The proposed topology successfully reduces voltage stress in the EVC circuit due to the symmetrical charging and discharging mode. This topology can also be applied to the impedance matching circuit of a high-power and high-frequency RF etching system. The target features of the proposed circuit topology are investigated via simulation and experiment. Voltage stress on the switch of the EVC circuit is successfully reduced by more than 40%.

Enhanced Performance of the OLED with Plasma Treated ITO and Plasma Polymerized Methyl Methacrylate Buffer Layer (ITO 플라즈마 표면처리와 ppMMA 버퍼층으로 제작한 OLED의 발광특성)

  • Lim Jae-Sung;Shin Paik-Kvun
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.1
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    • pp.30-33
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    • 2006
  • Transparent indium tin oxide (ITO) anode surface was modified using $O_3$ Plasma and organic ultrathin buffer layers were deposited on the ITO surface using 13.56 MHz RF plasma polymerization technique. The EL efficiency, operating voltage and lifetime of the organic light-emitting device (OLED) were investigated in order to study the effect of the plasma surface treatment and role of plasma polymerized organic ultrathin buffer layer. Poly methylmethacrylate (PMMA) layers were plasma polymerized on the ITO anode as buffer layer between anode and hole transport layer (HTL). The plasma polymerization of the organic ultrathin layer were carried out at a homemade capacitive-coupled RF plasma equipment. N,N'-diphenyl-N,N'(3- methylphenyl)-1,1'-diphenyl-4,4'-diamine (TPD) as HTL, Tris(8-hydroxyquinolinato) Aluminum $(Alq_3)$ as both emitting layer (EML)/electron transport layer (ETL), and aluminum layer as cathode were deposited using thermal evaporation technique. Effects of the plasma surface treatment of ITO and plasma polymerized buffer layers on the OLED performance were discussed.

The Effects of Substrate Temperature on Properties of Carbon Nanotube Films Deposited by RF Plasma CVD (RF Plasma CVD법에 의해 증착된 카본나노튜브(CNT)의 특성에 대한 기판 온도의 영향)

  • Kim, Dong-Sun
    • Korean Chemical Engineering Research
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    • v.46 no.1
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    • pp.50-55
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    • 2008
  • Carbon Nanotube (CNT) films were deposited with varying deposition temperature by RF plasma CVD on Fe catalysts deposited onto $SiO_2$ films grown thermally on the silicon wafer using $C_2H_2$ and $H_2$ gases. The Fe catalysts on silicon oxide film were made by RF magnetron sputtering. The grounded grid mesh cover on the substrate holder was used for depositing CNT thin films with high purity. The surface morphologies and chemical structure of deposited CNT films were characterized using SEM, Raman, XPS and TEM. It was observed that deposited CNTs films were carbon fiber type having Bamboo-like multiwall structure and CNT film grown at $600^{\circ}C$ was more dense than that at $550^{\circ}C$, but become less dense at $650^{\circ}C$.

대면적 Capacitively Coupled Plasma에서 Multi power feeding에 따른 Plasma uniformity 변화

  • Yu, Gwang-Ho;Na, Byeong-Geun;Yu, Dae-Ho;Kim, Eun-Ae;Jang, Hong-Yeong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.471-471
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    • 2010
  • 대면적 디스플레이나 태양전지를 만들기 위해 식각 공정에 주로 이용되는 capacitively coupled plasma 장비의 크기에 대한 관심이 높아지고 있다. 특히, RF power를 사용함에 따라 높은 주파수로 올라갈수록 전극에 발생하는 standing wave effect로 인해 챔버 안의 전자기장의 세기가 균일하지 않고 그로 인해 plasma의 밀도 역시 균일하지 않다.[1] 이러한 plasma의 non-uniformity를 전극에 들어가는 power의 feeding 방법을 바꿔 가면서 해결해 보려고 하였다. ($0.48\;m\;{\times}\;0.48\;m$)크기의 사각전극과 50 MHz의 RF power를 사용하였다. plasma의 분포는 ion probe를 통해 살펴 보았다.

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Enhanced Adhesion of Tire Cords via Argon Etching and Acetylene Plasma Polymerization (아르곤 에칭과 아세틸렌 플라즈마 중합에 의한 타이어 코드의 접착성 향상연구)

  • H. M. Kang;Kim, R. K.;T. H. Yoon
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 1999.11a
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    • pp.36-39
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    • 1999
  • Steel tire cords were coated via RF Plasma Polymerization of acetylene in order to enhance adhesion to rubber compounds. Adhesion of tire cords was measured by TACT as a function of plasma polymerization and argon etching conditions such as power, treatment time and chamber pressure. Tested tire cords were analysed by SEM to elucidate the adhesion mechanism. The highest adhesion values were obtained with argon etching condition at 90W, 10min, 30mtorr followed by acetylene plasma polymerization condition at 10W, 30sec., 30mtorr. In SEM analysis, the plasma polymerized tire cord at the optimized condition showed 100% rubber coverage as observed from brass-plated steel tire cords.

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Physical and electrical properties of a-C:H deposited by RF-PECVD (RF-PECVD에 의해 증착된 a-C:H 박막의 물리적 및 전기적 특성 분석)

  • 김인준;김용탁;최원석;윤대호;홍병유
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.296-300
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    • 2002
  • Thin films of Hydrogenated amorphous carbon(a-C:H) are generally exhibited by high electrical resistivities from 10$^2$ to 10$\^$16/ Ω$.$cm, resulting in an interesting material for high power, high temperature MIS devices applications. The hydrogenated amorphous carbon(a-C:H) films were deposited on silicon and glass using an rf plasma enhanced CVD method. The resultant film properties were evaluated in the respect of material based on r.f. power variation. The hydrogenated amorphous carbon(a-C:H) films of thickness ranging from 30 to 50 m were deposited at the pressure of 1 ton with the mixture of methane and hydrogen. We have used rf-IR( courier transform IR) and AFM(Atomic force microscopy) for determining physical properties and current-voltage(I-V) measurement for electrical Properties.

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Impact of DPN on Deep Nano-technology Device Employing Dual Poly Gate (Nano-technology에 도입된 Dual Poly Gate에서의 DPN 공정 연구)

  • Kim, Chang-Jib;Roh, Yong-Han
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.4
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    • pp.296-299
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    • 2008
  • The effects of radio frequency (RF) source power for decoupled plasma nitridation (DPN) process on the electrical properties and Fowler-Nordheim (FN) stress immunity of the oxynitride gate dielectrics for deep nano-technology devices has been investigated. With increase of RF source power, the threshold voltage (Vth) of a NMOS transistor(TR) decreased and that of a PMOS transistor increased, indicating that the increase of nitrogen incorporation in the oxynitride layer due to higher RF source power induced more positive fixed charges. The improved off-current characteristics and wafer uniformity of PMOS Vth were observed with higher RF source power. FN stress immunity, however, has been degenerated with increasing RF source power, which was attributed to the increased trap sites in the oxynitride layer. With the experimental results, we could optimize the DPN process minimizing the power consumption of a device and satisfying the gate oxide reliability.

Development of Liquid Stub and Phase Shifter

  • Wang, Son-Jong;Yoon, Jae-Sung;Hong, Bong-Guen
    • Nuclear Engineering and Technology
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    • v.33 no.2
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    • pp.201-208
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    • 2001
  • The high power RF transmission line components are required for transmitting MW level RF power continuously in RF heating and current drive system which heat the plasma and produce plasma current in fusion reactor The liquid stub and phase shifter is proposed as the superior to the conventional stub and phase shifter. Experimental results show that they are reliable and easy to operate compared to the conventional stub and phase shifter. There is no distortion of reflected power during the raising of the liquid level. RF breakdown voltage is over 40kV. Temperature increment of the liquid is expected not to be severe. These results verify that the liquid stub and phase shifter can be used reliably in the high power continuous RF facilities.

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