• 대한전자공학회논문지SD
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• 제38권3호
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• pp.211-219
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• 2001

본 논문에서는 RFID를 위한 읽기 전용 CMOS 트랜스폰더를 one-chip으로 설계하였다. 리더에서 공급되는 자기장으로부터 트랜스폰더 칩의 전원을 공급하기 위한 전파정류기를 NMOS 트랜지스터를 사용하여 설계하였으며, 데이터 저장 소자로는 64비트의 ROM을 사용하였다. 메모리에 저장되어 있는 ID 코드는 Manchester 코딩되어 front-end 임피던스 변조 방식으로 리더에 전송된다. 임피던스 변조를 위한 감폭회로로는 리더와 트랜스폰더 사이의 거리가 변해도 일정한 감폭율을 갖는 새로운 감폭회로를 사용하였다. 설계된 회로는 0.65㎛ 2-poly, 2-metal CMOS 공정을 사용하여 IC로 제작되었다. 칩 면적은 0.9㎜×0.4㎜이다. 측정 결과 설계된 트랜스폰더 IC는 인식거리 내에서 약 20∼25%의 일정한 감폭율을 보이며, 125㎑의 RF에 대해 3.9kbps의 데이터 전송속도를 보인다. 트랜스폰더 칩의 전력소모는 읽기 모드시 약 100㎼이다. 인식거리는 약 7㎝이다.

• 한국정보기술응용학회:학술대회논문집
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• 한국정보기술응용학회 2005년도 6th 2005 International Conference on Computers, Communications and System
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• pp.191-194
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• 2005

In this paper the platform system for IEEE 802.15.4 Low Rate WPAN is designed and fabricated. IEEE 802.15.4 Low Rate WP AN system serves the functions and realization of home-area network. According to the IEEE 802.15.4 standard, there are two modes, One is BPSK modulation in 868/915MHz frequency band. The other is O-QPSK modulation in 2.45GHz frequency band. In this paper we implemented the platform system mounted in one PCB board in 868/915MHz frequency band of IEEE 802.15.4 Low Rate WPAN system. We measured that the platform system which consists of digital part and RF part has good performance. Also RF part is realized by design and fabrication of the RF transceiver IC. The key issue is to make the platform system which provides the function of Low Rate WPAN system to meet the requirement of IEEE 802.15.4 standards.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2006년도 하계종합학술대회
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• pp.133-134
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• 2006

In this paper the platform system for IEEE 802.15.4 Low Rate WPAN is designed and fabricated. IEEE 802.15.4 Low Rate WPAN system serves the functions and realization of home-area network. According to the IEEE 802.15.4 standard, there are two modes, One is BPSK modulation in 868/915MHz frequency band. The other is O-QPSK modulation in 2.45GHz frequency band. In this paper we implemented the platform system mounted in one PCB board in 868/915MHz frequency band of IEEE 802.15.4 Low Rate WPAN system. We measured that the platform system which consists of digital part and RF part has good performance. Also RF part is realized by design and fabrication of the RF transceiver IC. The key issue is to make the platform system which provides the function of Low Rate WPAN system to meet the requirement of IEEE 802.15.4 standards.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.149-167
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• 2004

Passive components are indispensable in the design and development of microchips for high-frequency applications. Inductors in particular are used frequently in radio frequency (RF) IC's such as low-noise amplifiers and oscillators. This paper gives a broad overview on the on-chip spiral inductors. The design concept and modeling approach of the typical square-shaped spiral inductor are first addressed. This is followed by the discussions of advanced structures for the enhancement of inductor performance. Research works reported in the literature are summarized to aid the understanding of the recent development of such devices.

• ETRI Journal
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• 제21권4호
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• pp.1-8
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• 1999

Thick metal 0.8${\mu}m$ CMOS technology on high resistivity substrate(RF CMOS technology) is demonstrated for the L-band RF IC applications, and we successfully implemented it to the monolithic 900 MHz and 1.9 GHz CMOS LNAs for the first time. To enhance the performance of the RF circuits, MOSFET layout was optimized for high frequency operation and inductor quality was improved by modifying the technology. The fabricated 1.9 GHz LNA shows a gain of 15.2 dB and a NF of 2.8 dB at DC consumption current of 15mA that is an excellent noise performance compared with the offchip matched 1.9 GHz CMOS LNAs. The 900 MHz LNA shows a high gain of 19 dB and NF of 3.2 dB despite of the performance degradation due to the integrating of a 26 nH inductor for input match. The proposed RF CMOS technology is a compatibel process for analog CMOS ICs, and the monolithic LNAs employing the technology show a good and uniform RF performance in a five inch wafer.

• 전기학회논문지
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• 제62권8호
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• pp.1125-1131
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• 2013

Wireless power transmission technology has been studied variety. Recently, wireless power transmission technology used by resonance and magnetic induction field is applied to various fields. However, magnetic resonance and inductive coupling are have drawbacks - power transmission distance is short. Microwave transmission and accept techniques have been developed to overcome short distance. However, improvement in efficiency is required. This paper, propose a high-efficiency microwave energy acceptor IC(EAIC). Suggested EAIC is consists of RF-DC converter and DC-DC converter. Wide Input power range is -15 dBm ~ 20 dBm. And output voltage is boosted up to 5.5 V by voltage boost-up circuit. EAIC can keep the output voltage constant. Available efficiency of RF-DC converter is 95.5 % at 4 dBm input. And DC-DC efficiency is 94.79 % at 1.1 mA load current. Fully EAIC efficiency is 90.5 %.

• 한국컴퓨터산업학회논문지
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• 제3권3호
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• pp.369-382
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• 2002

교통정체의 증가로 의하여 지불수단에 관한 관심이 증가되고 있다. 또한, 전자화폐 지불에 대한 수많은 프로젝트가 진행되고 있다. 교통시스템은 정보처리, 통신, 제어, 전자 등 다양한 첨단기술들로 구성되며 이러한 기술들을 교통관련에 접목함으로서 더욱 안전한 인명구조 및 시간과 경비절감을 더욱 효율적으로 추구할 수가 있다. 특히, 운전자의 차량소통을 위해 접촉식으로 제공하는 시스템과 이로 인해 야기되는 문제점들을 해결하기 위한 제어에 관련된 전자화폐 시스템을 연구하였다. 이 논문에서는 전자지불 개념을 ATM방식으로 도입하여 요구사항을 반영하고 기존에 개발되어 사용하고 있는 동전투입방식을 재구성하여 전체 통합하여 새로운 ITS개발에 사용하는 일련의 과정을 정리하였다. 그 결과 기존방식보다 차량대기속도 및 평균주행속도가 15%에서 40% 가량 개선됨을 확인할 수가 있었다. 특히 이런 개념은 국내ITS 개발의 특수상황에 적용하여 큰 효과를 얻을 수 있을 것으로 기대한다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.2105-2107
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• 2004

In this study, Spiral inductors on the $SiO_2$/Si(100) substrate were fabricated by the magnetron sputtering method. Cu thin film with the thickness of 2 ${\mu}m$ was deposited on the substrate. Also we fabricated square inductors through the wet chemical etching technique. The inductors are completely specified by the turn width and the spacing between spirals. Both the width and spacing between spirals were varied from 10 to 60 ${\mu}m$ and from 20 to 70 ${\mu}m$, respectively. Inductance and Q factor dependent on the RF frequency were investigated to analyze performance of inductor arrays. Also, We recommend that the reasonable Q-factors, spec's turns and thickness of the coil for inductors cab be set to be ideal condition.

• 디지털산업정보학회논문지
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• 제18권4호
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• pp.47-54
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• 2022

In this paper, MEMS embedded system design implemented the sensor events via analyzing the characteristics that dynamically happened to an abnormal status in power IoT environments in order to guarantee a maintainable operation. We used three kinds of tools in this paper, at first Bluetooth Low Energy (BLE) technology which is a suitable protocol that provides a low data rate, low power consumption, and low-cost sensor applications. Secondly LSM6DSOX, a system-in-module containing a 3-axis digital accelerometer and gyroscope with low-power features for optimal motion. Thirdly BM1422AGMV Digital Magnetometer IC, a 3-axis magnetic sensor with an I2C interface and a magnetic measurable range of ±120 uT, which incorporates magneto-impedance elements to detect the magnetic field when the current flowed in the power devices. The proposed MEMS system was developed based on an nRF5340 System on Chip (SoC), previously compared to the standalone embedded system without bluetooth technology via mobile App. And also, MEMS embedded system with BLE 5.0 technology broadcasted the MEMS system status to Android mobile server. The experiment results enhanced the performance of MEMS system design by combination of sensors, BLE technology and mobile application.

• 대한전자공학회논문지SD
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• 제46권9호
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• pp.68-73
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• 2009

본 논문은 CMOS RF 집적 회로 측정 시 측정 회로의 디지털 실시간 제어를 위한 직렬 주변 인터페이스 회로의 풀커스팀(Full Custom) 방식 CMOS 집적 회로 구현과 이의 구동 소프트웨어의 개발에 관하여 기술하였다. 개발된 SPI는 제어하고자 하는 회로의 복잡도에 따라 필요한 어드레스 (Address)의 크기를 쉽게 확장 또는 축소 할 수 있는 구조로 설계 되었고 이의 구동 소프트웨어도 이에 따라 쉽게 재구성할 수 있도록 설계되었다. 따라서, 본 SPI는 다양한 종류의 CMOS RF 집적회로 설계 시 요구되는 복잡도에 따라 최적의 구조로 효과적으로 변경할 수 있도록 구성되었으며 검증대상 RF회로를 효율적으로 검증할 수 있는 장점이 있다. 설계된 재구성형 SPI는 $0.13{\mu}m$ CMOS 공정으로 제작되었으며 동일 칩에 제작된 2.7GHz CMOS RF 분수형 주파수 합성기를 통하여 성공적 검증되었다.