• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 춘계 학술발표강연 및 논문개요집
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• pp.133-133
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• 2002

• 한국전기전자재료학회논문지
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• 제32권3호
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• pp.201-206
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• 2019

This report constitutes the first demonstration in Korea of single-crystal lateral gallium oxide ($Ga_2O_3$) as a metal-oxide-semiconductor field-effect-transistor (MOSFET), with a breakdown voltage in excess of 480 V. A Si-doped channel layer was grown on a Fe-doped semi-insulating ${\beta}-Ga_2O_3$ (010) substrate by molecular beam epitaxy. The single-crystal substrate was grown by the edge-defined film-fed growth method and wafered to a size of $10{\times}15mm^2$. Although we fabricated several types of power devices using the same process, we only report the characterization of a finger-type MOSFET with a gate length ($L_g$) of $2{\mu}m$ and a gate-drain spacing ($L_{gd}$) of $5{\mu}m$. The MOSFET showed a favorable drain current modulation according to the gate voltage swing. A complete drain current pinch-off feature was also obtained for $V_{gs}<-6V$, and the three-terminal off-state breakdown voltage was over 482 V in a $L_{gd}=5{\mu}m$ device measured in Fluorinert ambient at $V_{gs}=-10V$. A low drain leakage current of 4.7 nA at the off-state led to a high on/off drain current ratio of approximately $5.3{\times}10^5$. These device characteristics indicate the promising potential of $Ga_2O_3$-based electrical devices for next-generation high-power device applications, such as electrical autonomous vehicles, railroads, photovoltaics, renewable energy, and industry.

• 한국군사과학기술학회지
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• 제24권3호
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• pp.317-327
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• 2021

Low Frequency Active Sonobuoy(hereinafter referred to as LFAS) are being developed in Korea in consideration of compatibility with existing overseas sonobuoys, and a communication device for acoustic signals receiving and operating control of LFAS has been developed. The communication device needs to verify compatibility with the existing Sonobuoy, and for this purpose, the standardized Sonobuoy communication protocol was applied. The communication device is designed/manufactured to transmit the acoustic signal received in real time from the Sonobuoy through VHF band RF communication to the data processing device, and transmit CFS/CSG commands for operation control to the Sonobuoy through UHF band RF communication. In order to verify the manufactured communication device, the communication status and performance were verified by interlocking test through Ultra Electronics' PASS-II equipment and domestically developed electronic device of Sonobuoy. In addition, operability was verified through environmental tests, water tanks, and marine operations. In the future, the communication device of sonobuoy can be used for verification of the Sonobuoy developed in Korea.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권7호
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• pp.308-314
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• 2005

The 2 GHz film bulk acoustic wave resonator(FBAR), one of the most necessary device of the next generation mobile communication system, consisted of solidly mounted resonator(SMR) structure using Brags reflector, was researched in this paper The FBAR applied SiO$_{2}$ and W had large difference of the acoustic impedance to reflector Al to electrode and ZnO to piezoelectric layer. Specially, the FBAR applied the two-step deposition method to improve the c-axis orientation and increase reproducibility of the fabrication device had good performance. The electrical properties of plasma such as impedance, resistance, reactance, $V_{pp},\;I{pp}$, VSWR and phase difference of voltage and current, was analyzed and measured by RF sensor with the variable experiment process factors such as gas ratio, RF power and base vacuum level about concerning the thickness, c-axis orientation, adhesion and roughness. The FBAR device about the optimum condition resulted reflection loss(S$_{11}$) of -17 dB, resonance frequency of 1.93 GHz, electric-mechanical coefficient(k$_{eff}$) of 2.38 $\%$ and Qualify factor of 580. It was seen better qualify than the common dielectric filter at present and expected on business to the filter device of 2 GHz bandwidth with the MMIC technology.

• 한국진공학회지
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• 제20권5호
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• pp.345-355
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• 2011

GaAs나 InP 기반의 high electron mobility transistor (HEMT) 소자들은 우수한 마이크로파 및 밀리미터파 주파수 특성 및 이에 따른 우수한 저잡음 특성을 가지고 있다. GaAs 기판 위에 점진적으로 성장된 메타몰픽(Metamorphic) HEMTs (MHEMTs)는 InP 기판 위에 성정한 HEMT에 비해 비용 측면에서 커다란 장점을 가지고 있다. 본 논문에서는 이러한 MHEMT의 DC/RF 소신호 특성을 예측하기 위하여 InAlAs/InGaAs/GaAs MHEMT 소자들의 DC/RF 소신호 주파수 특성을 시뮬레이션하였다. 2차원 소자 시뮬레이터의 hydrodynamic 전송 모델을 사용하여 $In_{0.52}Al_{0.48}As/In_{0.53}Ga_{0.47}As$ 이종접합 구조를 갖는 제작된 0.1-${\mu}m$ ${\Gamma}$-게이트 MHEMT 소자에 대하여 파라미터 보정 작업을 수행한 후, MHEMT 소자들에 대해 DC 특성 및 RF 소신호 주파수 특성을 시뮬레이션하고 실험 데이터와 비교 분석하였다. 또한, 게이트 리세스 구조에 따른 MHEMT 소자들의 DC/RF 특성을 시뮬레이션하고 비교 분석하였다.

• Journal of Advanced Marine Engineering and Technology
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• 제38권3호
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• pp.302-311
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• 2014

본 연구에서는 소형화된 투명 플렉시블 무선통신소자 구현을 위해, 주기적 구조를 가지는 fishbone 형태의 전송선로를 PES (polyether sulfone) 박막상에 제작하였으며, 이에 관한 RF 특성을 고찰하였다. 그 결과에 의하면, PES 박막상에 제작된 fishbone 형태의 전송선로는 종래의 코프레너선로에 비해 단파장특성을 보여주었으며, 구체적으로 50 GHz에서 선로파장은 2.23 mm으로, 종래의 코프레너 선로의 56.6%이다. 삽입손실 측정결과에 의하면 fishbone 형태의 전송선로는 50 GHz 까지의 주파수 범위에서 1.31 dB보다 낮은 저손실특성을 보여주었다. 대역폭 추출결과에 의하면, PES 박막상의 fishbone 형태의 전송선로는 통과대역이 608 GHz인 광대역 특성을 보였다. PES 박막상의 fishbone 형태의 전송선로의 특성임피던스는 기존의 주기적 구조와는 달리 매우 적은 주파수 의존성을 나타내었으며, 이로 인해 광대역의 전송선로 및 광대역 분포형 수동소자에 이용될 수 있음을 알 수 있었다.

• 한국정보통신학회논문지
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• 제16권3호
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• pp.416-423
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• 2012

Ansoft HFSS와 Serenade를 사용하여, 적층형 저역통과필터(LPF)와 RF 다이오드 스위치를 설계하였다. RF diode switch의 등가회로를 참고한 시뮬레이션은 송신모드 (Transmit mode)일 때 다이오드를 인덕터(Inductor)로 등가 회로화 하였고, 수신모드(Receive mode) 일때는 다이오드를 커패시터(Capacitor)로 변환하여 시뮬레이션 하였다. 적측형 RF diode 설계는 소자 와 수축률 변화를 고려하여 수행하였다.

• 전자공학회지
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• 제29권9호
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• pp.1020-1020
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology trends in the near future.

• 전자공학회지
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• 제29권9호
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• pp.18-30
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology and from them forecasts technology trends in the near future.

• 전자공학회논문지D
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• 제35D권11호
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• pp.62-69
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• 1998

Hot carrier 스트레스후의 RF-nMOSFET의 DC 및 RF 특성열화를 분석하기 위해 기존의 열화 모델을 적용하였다. 드레인전류 열화보다 차단주파수 열화가 심하였으며 RF-nMOSFET의 열화변화율 n과 열화변수 m은 기존의 bulk MOSFET의 것과 같았다. Multi-finger 게이트 소자에서 finger수가 많을수록 열화가 적게 된 것은 큰 소스/드레인의 저항과 포화전압에 의한 것임을 알 수 있었다. 스트레스의 후의 RF성능 저하는 g/sub m/과 C/sub gd/의 감소와 g/sub ds/의 증가에 의한 것임을 알 수 있었다. 기판전류를 측정하므로 RF소자의 DC 및 RF특성 열화를 예견할 수 있었다.