• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.11
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• pp.29-34
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• 2004

This paper reports the RF dispersion and linearity characteristics of unpassivated AlGaN/InGaN/GaN high electron-mobility transistors (HEMTs) grown by molecular beam epitaxy (MBE). The devices with a 0.5 ${\mu}{\textrm}{m}$ gate-length exhibited relatively good DC characteristics with a maximum drain current of 730 mA/mm and a peak g$_{m}$ of 156 mS/mm. Highly linear characteristic was observed by relatively flat DC transconductance (g$_{m}$) and good inter-modulation distortion characteristics, which indicates tight channel carrier confinement of the InGaN channel. Little current collapse in pulse I-V and load-pull measurements was observed at elevated temperatures and a relatively high power density of 1.8 W/mm was obtained at 2 GHz. These results indicate that current collapse related with surface states will not be a power limiting factor for the AlGaN/InGaN HEMTs.

• Electrical & Electronic Materials
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• v.8 no.1
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• pp.77-82
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• 1995

PTCR(Positive Temperature Coefficient of Resistivity) thermistor in thin film BaTiO$_{3}$ system was prepared by using radio frequency(13.56 MHz) and DC magnetron sputter equipment. Polycrystalline, surface structure, and R-T(Resistivity-Temperature) characteristics of the specimens were measured by X-ray diffraction(D-Max3, Rigaku, Japan), SEM(Scanning Electron Microscopy: M.JSM84 01, Japan), and insulation resistance measuring system (Keithley 719), respectively. Thin films characteristics of the thermistor showed different properties depending on the substrate even with the same sputtering condition. The thin film formed on the A1$_{2}$O$_{3}$ substrate showed a good crystalline and a low resistivity at below curie point. However, the thin films prepared on slide glass and Si wafer were amorphous. The thicknesses of the three samples prepared under the same process conditions were 700[.angs.], 637.75[.angs.], and 715[.angs.], respectively.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.1470-1472
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• 2002

3원계 51wt%Ni-4lwt%Cr-8wt%Si 합금 타겟을 가지고 DC/RF 마그네트론 스퍼터를 이용하여 박막저항을 제조하였고, 낮은 저항온도계수(TCR)를 가지는 박막을 만들기 위해 제조공정의 변화에 따른 박막의 미세구조와 전기적인 특성을 조사하였다. 스퍼터링 제조공정 변수로써 DC/RF Power, 반응압력, 기판온도를 변화시켰고, 제조된 박막은 공기중에서 $400[^{\circ}C]$까지 열처리 하였다. 반응압력을 감소시킴에 따라 TCR값은 감소하였고, 기판온도 및 열처리 온도의 증가에 따라 TCR값도 증가하였다. 또한, 비저항은 DC Power에서 $172[{\mu}{\Omega}cm]$, RF인 경우에는 $209[{\mu}{\Omega}cm]$을 나타내었고, 각각 +52, $-25[ppm/^{\circ}C]$의 TCR값을 나타냈다. 이와 같은 결과로부터 제조공정을 변화시킴에 따라 면저항 및 저항온도계수의 제어가 가능함을 알 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.389-389
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• 2011

Transparent conductive oxide (TCO) 박막은 디스플레이 및 태양전지 등 광범위한 분야에서 적용되고 있으며, 특히 indium tin oxide (ITO)는 낮은 전기적 저항과 우수한 광투과도를 가지고 있어서 이미 많은 분야에 적용되고 있다. 본 연구는 RF와 DC를 혼용한 마그네트론 스퍼터링 공정을 활용하여 ITO 박막 특성 및 이를 활용한 유기태양전지 적용에 관한 것이다. UV-O3 처리된 glass 기판위에 thermal evaporation 방식으로 밀착력을 높이기 위하여 Cr을 5 nm 두께로 증착한 후 Al을 95 nm 증착하였다. 그 위에 스퍼터링 공정으로 ITO 박막을 In2O3:SnO2 target (10wt% SnO2)을 사용하여 1.0 mTorr의 공정압력(Ar:O2=30:1), 50W의 RF power 및 0.11kW의 DC power에서 50~250 nm의 두께로 증착하였다. ITO 박막의 결정구조 및 표면 형상은 x-ray diffraction (XRD) 및 scanning electron microscope (SEM)을 사용하여 분석하였으며, 전기적 특성은 four-point probe법으로 비저항값을 측정하였다. 또한 높은 광변환효율을 가지는 태양전지 제작을 위하여, 다양한 두께의 ITO 박막을 사용하여 ITO/ZnO/P3HT:PCBM/PEDOT/Ag 구조의 유기태양전지를 제작하여 소자 특성을 최적화 하였다.

• Transactions on Electrical and Electronic Materials
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• v.14 no.2
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• pp.67-70
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• 2013

In this study, we changed the input parameters (gas mixing ratio, RF power, DC bias voltage, and process pressure), and then monitored the effect on TiN etch rate and selectivity with $SiO_2$. When the RF power, DC-bias voltage, and process pressure were fixed at 700 W, - 150 V, and 15 mTorr, the etch rate of TiN increased with increasing $CF_4$ content from 0 to 20 % in $CF_4$/Ar plasma. The TiN etch rate reached maximum at 20% $CF_4$ addition. As RF power, DC bias voltage, and process pressure increased, all ranges of etch rates for TiN thin films showed increasing trends. The analysis of x-ray photoelectron spectroscopy (XPS) was carried out to investigate the chemical reactions between the surfaces of TiN and etch species. Based on experimental data, ion-assisted chemical etching was proposed as the main etch mechanism for TiN thin films in $CF_4$/Ar plasma.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.7 no.4
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• pp.86-96
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• 2008

In this paper, a new broadband rectenna is presented for the wireless transmission of microwave power. The new broadband rectenna element is based on a new printed monopole broadband antenna with size reduction using surface current distribution and a new broadband stub bandpass filter with suppression of second harmonics. A RF-to-DC conversion efficiency of 80% using a 270 ohm load resistor is obtain at 2.45 GHz. Also, a conversion efficiency of above 50 % is maintained from 1.8 GHz to 2.8 GHz.

• Current Photovoltaic Research
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• v.10 no.1
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• pp.28-32
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• 2022

We investigated the optical and electrical characteristics of ITO/Ag/ITO (IAI) 3-layer thin films prepared by using RF/DC sputtering. To measure the thickness of all thin film samples, we used scanning electron microscopy. As a function of Ag thickness we characterized the optical transmittance and sheet resistance of the IAI samples by using UV-Visible spectroscopy and Hall measurement system, respectively. While the thickness of both ITO thin films in the 3-layered IAI samples were fixed at 50 nm, we varied Ag layer thickness in the range of 0 nm to 11 nm. The optical transmittance and sheet resistance of the 3-layered IAI thin films were found to vary strongly with the thickness of Ag film in the ITO (50 nm)/Ag(t₀)/ITO (50 nm) thin film. For the best transparent conducting oxide (TCO) electrode, we obtained a 3-layered ITO (50 nm)/Ag (t₀ = 8.5 nm)/ITO (50 nm) that showed an avrage optical transmittance, AVT = 90.12% in the visible light region of 380 nm to 780 nm and the sheet resistance, R_□ = 7.24 Ω/□.

• Journal of the Korean institute of surface engineering
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• v.55 no.6
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• pp.308-318
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• 2022

The surface modification and treatment using thermal plasma were reviewed in academic fields. In general, thermal plasma is generated by direct current (DC) and radiofrequency (RF) power sources. Thermal spray coating, a typical commercial process using thermal plasma, is performed by DC thermal plasma, whereas other promising surface modifications have been reported and developed using RF thermal plasma. Beyond the thermal spray coating, physical and chemical surface modifications were attempted widely. Superhydrophobic surface treatment has a very high industrial demand particularly. Besides, RF thermal plasma system for large-area film surface treatment is being developed. Thermal plasma is especially suitable for the surface modification of low-dimensional nanomaterial (e.g., nanotubes) by utilizing high temperature and rapid quenching. It is able to synthesize and modify nanomaterials simultaneously in a one-pot process.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.8 no.7
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• pp.1429-1435
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• 2004

In this work, high performance broadband amplifier MMIC including all the matching and biasing components, and electrostatic discharge (ESD) protection circuit was developed for K/Ka band applications. Therefore, external biasing or matching components were not required for the operation of the MMIC. STO (SrTiO3) capacitors were employed to integrate the DC biasing components on the MMIC, and miniaturized LC parallel ESD protection circuit was integrated on MMIC, which increased ESD breakdown voltage from 10 to 300 V. A pre-matching technique and RC parallel circuit were used for the broadband design of the amplifier MMIC. The amplifier MMIC exhibited good RF performances and good stability in a wide frequency range. The chip size of the MMICs was $1.7{\pm}0.8$ mm2.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.393-394
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• 2008

This paper presents a new method to extract the substrate resistance by fitting current-dependent base resistance of parasitic BJT without a complex RF extraction method. The extracted substrate resistance values using the new method match well with those using the RF one, verifying the accuracy of the proposed DC technique.