• 한국진공학회:학술대회논문집
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• 한국진공학회 2002년도 제23회 학술발표회 초록집
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• pp.172-173
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• 2002

• 자원환경지질
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• 제52권3호
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• pp.243-250
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• 2019

본 연구는 정부의 R&D 정책 변화에 선제적으로 대응하고 한국지질자원연구원에서 수립된 KIGAM R&D 기획 프로세스의 한계점으로 지적된 부분을 보완하기 위해 시작하였다. 기존 연구 문헌을 통해서 다양한 R&D 기획 프로세스에 대해 알아보았고, 인터뷰를 통해 각 기관별 특성 및 신규 R&D 기획 방법에 대해 분석하였다. 그 결과 환경분석, 수요발굴방법, 과제 구성 및 선정방법 세 가지 측면에서 결론 및 시사점을 도출하였다. 환경분석의 경우 전체적인 Mega Trend 분석을 하면서 기술 시장 별 Trend 분석을 강화해야 하고, 수요발굴방법의 경우 도전적이고 구체적인 목표 설정을 통해 수요를 찾아내야 한다. 또한 과제 구성 및 선정의 경우 융합연구과제, 중소기업지원, 자원분석, 장기과제 선정 등 여러 가지 시사점을 도출 할 수 있었다. 도출 된 시사점은 향후 한국지질자원연구원의 신규 R&D 기획 프로세스에 사용될 것이다.

• 한국전자거래학회지
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• 제4권2호
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• pp.177-196
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• 1999

The current process of weapon system R&D has lots of problems that the phase is complex, the concept of integration and/or connection of related data is laked and don't be digitalized. To solve these problems we should establish the R&D CALS system and to do this, analysis the R&D process is necessary. In this paper, We suggested weapon system R&D CALS concept and model, and analysed R&D process with ARIS Toolset and proposed the new R＆D process and operation scenarios with CALS concept.

• 한국기술혁신학회:학술대회논문집
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• 한국기술혁신학회 2001년도 춘계학술대회:발표자료
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• pp.369-385
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• 2001

A R&D project evaluation method has been applied for the national nuclear R&D projects in a developing-country setting. In the methodology, Saaty's analytic hierarchy process model is used to evaluate and rank of the selected nuclear R&D project which have a wide range of objectives and characteristics. The criteria used for evaluation related specifically to the Korea's evaluation needs and culture, and they are weighted according to their relative importance as perceived by the evaluator of the R&D project. As a real-world case of evaluation, we elicited and reproduced the evaluation process of the nuclear R&D projects which is going under the research process. As the results of the paper suggests, the methodology can be applied to the evaluation of the R&D projects and has much potential.

• 산업경영시스템학회지
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• 제33권1호
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• pp.17-23
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• 2010

The corporate R&D(Research and Development) has a primary role of new product development and its potential is the most crucial factor to estimate corporate future value. However, its systemic inadequacies and inefficiencies, the shorten product life-cycle to satisfy customer needs, the global operations by outsourcing strategy, and the reduction of product cost, are starting to expose to R&D business processes. The three-phased execution strategy for R&D innovation is introduced to establish master plan for new R&D model. From information technology point of view, PLM(Product Life-cycle Management) is one of the business total solutions in product development area. It is not a system, but the strategic business approach that collaboratively manage the product from beginning stage to end of life in all business areas PLM functions and capabilities are usually used as references to re-design new R&D process. BPA(Business Process Assessment) and 5DP(Design Parameters) in PI6sigma developed by Samsung SDS Consulting division are introduced to establish R&D master plan and re-design process respectively. This research provides a case study for R&D process innovation. How process assessment and PMM(Process Maturity Model) can be applied in business processes, and also it explains process re-design by 5DP method.

• 산업공학
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• 제16권3호
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• pp.362-374
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• 2003

The major objective of this paper is to empirically examine the effect of process maturity on the performance of industrial R&D projects. Process maturity, a fundamental concept of the Capability Maturity Model developed by Software Engineering Institute, represents the essential of Total Quality Management (TQM). Based on literature, our research model constructs process maturity in terms of structured process, goal setting and controlling, metrics, and process learning; and links it to the R&D performance that consists of technical, commercial and managerial successes. The model also includes firm size as a moderator of different effects that process maturity may have across firms. Measures for process maturity are based on the best practices identified in literature. Data are obtained from 77 successful R&D projects carried out by Korean manufacturing firms. Multiple regression and t-test are used to test proposed hypotheses. Findings are as follows. (1) In the R&D process, process maturity partially contributes to the performance of R&D projects. More specifically, goal setting and controlling-related practices drive both technical and commercial successes, while process learning-related practices drive commercial success. In contrast, traditionally emphasized elements such as structured process or metrics are found not to be significant. (2) The degree of process maturity is significantly higher in large firms. (3) Process maturity impacts on commercial success in the case of large firms, whereas it does on technical success in the case of small firms. The results imply that the TQM principles are partially associated with R&D performance, and the nature of benefit from high maturity could vary according to firm size.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1406-1408
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• 2006

Plastic substrate for flexible TFT LCD is developed. The gas barrier, optical properties and conductivity in the substrate is improved through depositing silicon oxide/nitride layer and ITO layer, coating polymer layer on plastic film by sputtering process and wet coating process. The whole production process of the plastic substrate is guaranteed the productivity by using roll to roll process.

• Current Applied Physics
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• 제18권11호
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• pp.1447-1450
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• 2018

The electron spin resonance (ESR) detects point defect of the In-Ga-Zn oxide (IGZO) like singly ionized oxygen vacancies and excess oxygen, and get spin density as a parameter of defect state. So, we demonstrated the spin density measurement of the IGZO film with various deposition conditions and it has linear relationship. Moreover, we matched the spin density with the total BTS and the threshold voltage ($V_{th}$) distribution of the IGZO thin film transistors. The total BTS ${\Delta}V_{th}$ and the $V_{th}$ distribution were degraded due to the spin density increases. The spin density is the useful indicator to predict $V_{th}$ instability of IGZO TFTs.

• JSTS:Journal of Semiconductor Technology and Science
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• 제4권2호
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• pp.100-105
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• 2004

The influencing factors on the OPC (optical proximity correction) results are quantitatively analyzed using OPCed L/S patterns. ${\sigma}$ values of proximity variations are measured to be 9.3 nm and 15.2 nm for PR-A and PR-B, respectively. The effect of post exposure bake condition is assessed. 16.2 nm and 13.8 nm of variations are observed. Proximity variations of 11.6 nm and 15.2 nm are measured by changing the illumination condition. In order not to seriously deteriorate the OPC, these factors should be fixed after the OPC rules are extracted. Proximity variations of 11.4, 13.9, and 15.2 nm are observed for the mask mean-to-targets of 0, 2 and 4 nm, respectively. The decrease the OPC grid size from 1 nm to 0.5 nm enhances the correction resolution and the OCV is reduced from 14.6 nm to 11.4 nm. The enhancement amount of proximity variations are 9.2 nm corresponding to 39% improvement. The critical dimension (CD) uniformity improvement for adopting the small grid size is confirmed by measuring the CD uniformity on real SRAM pattern. CD uniformities are measured 9.9 nm and 8.7 nm for grid size of 1 nm and 0.5 nm, respectively. 22% improvement of the CD uniformity is achieved. The decrease of OPC grid size is shown to improve not only the proximity correction, but also the uniformity.

• 한국재료학회지
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• 제1권2호
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• pp.77-85
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• 1991

LPCVD(Low Pressure Chemical Vapor Deposition) System을 이용하여 여러가지 증착 변수에 따른 실리콘 박막의 표면형상에 대해 고찰하였다. 중착압력, 중착온도, 반응기체의 유속에 따라 증착층의 표면형상이 큰 변화를 나타냈으며, 증착압력과 반응기체의 유속이 증가할수록 유효면적이 최대가 되는 증착온도가 증가하였다. 이러한 실험결과는 안정한 핵의 생성률이 최대가 될때 유효표면적이 최대가 된다는 가정으로부터 유도된 식과 일치하는 결과를 나타냈다.