• Journal of Computing Science and Engineering
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• v.5 no.2
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• pp.131-140
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• 2011

Different cores typically share the last-level cache in a multi-core processor. Threads running on different cores may interfere with each other. Therefore, the multi-core worst-case execution time (WCET) analyzer must be able to safely and accurately estimate the worst-case inter-thread cache interference. This is not supported by current WCET analysis techniques that manly focus on single thread analysis. This paper presents a novel approach to analyze the worst-case cache interference and bounding the WCET for threads running on multi-core processors with shared L2 instruction caches. We propose to use an interference matrix to model inter-thread interference, on which basis we can calculate the worst-case inter-thread cache interference. Our experiments indicate that the proposed approach can give a worst-case bound less than 1%, as in benchmark fib-call, and an average 16.4% overestimate for threads running on a dual-core processor with shared-L2 cache. Our approach dramatically improves the accuracy of WCET overestimatation by on average 20.0% compared to work.

• Journal of the Korea Society of Computer and Information
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• v.16 no.6
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• pp.1-10
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• 2011

In designing multi-core processors, interconnection delay is one of the major constraints in performance improvement. To solve this problem, the 3-dimensional integration technology has been adopted in designing multi-core processors. The 3D multi-core architecture can reduce the physical wire length by stacking cores vertically, leading to reduced interconnection delay and reduced power consumption. However, the power density of 3D multi-core architecture is increased significantly compared to the traditional 2D multi-core architecture, resulting in the increased temperature of the processor. In this paper, the floorplan methods which change the forms of vertical placement of the core and the level-2 cache are analyzed to solve the thermal problems in 3D multi-core processors. According to the experimental results, it is an effective way to reduce the temperature in the processor that the core and the level-2 cache are stacked adjacently. Compared to the floorplan where cores are stacked adjacently to each other, the floorplan where the core is stacked adjacently to the level-2 cache can reduce the temperature by 22% in the case of 4-layers, and by 13% in the case of 2-layers.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.5
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• pp.143-149
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• 2020

Currently, a multi-core processor is mainly used as a central processing unit of a computer system, and a high-performance out-of-order processor is adopted as each core to maximize system performance. The early out-of-order execution processor with Tomasulo algorithm aimed at floating-point instructions, and it took several cycles to execute by the use of complex structures such as reorder buffer and reservation station. However, in order for the processor to properly utilize out-of-order execution and increase the throughput of instructions, it must operate in a fully pipelined manner. In this paper, a fully pipelined out-of-order processor with speculative execution is designed with VHDL and verified with GHDL. As a result of the simulation, a program composed of ARM instructions is successfully performed.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.270-273
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• 2012

In this paper, I present the design of Operational Flight Programs(OFPs) on a Multi-Core based Mission Computer(MC) for the optimized performance of the OFPs on Multi-Core based MC. The program assigned as tasks on Multi-Core environment can be scheduled by designing with the use of OpenMp, which is the standard for parallel programming. This paper also describes the differences between Multi-Core Program(MCP) on the technique and Single-Core Program(SCP) in terms of performance aspect. The new proposed design technique is applied to the Integrated Up-Front Control OFP(IUFC OFP) on General Processor Module where Multi-Core based. This paper describes the Multi-Core design technique for the optimized performance of the IUFC OFP, which display and control flight data(Navigation, Communication, Identification Friend or Foe) to pilot.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.927-930
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• 2003

In this paper, a design of processor IP for TCP/IP protocol stack is described. The processor consists of input and output buffer memory with dual bank structure, 32-bit RISC microprocessor core, DMA unit with on-the-fly checksum capability. To handle the various modes of TCP/IP protocol, hardware and software co-design approach is used rather than the conventional state machine based design. To eliminate delay time due to the data transfer and checksum operation, DAM module which can execute the checksum operation on-the-fly along with data transfer operation is adopted. By programming the on-chip code ROM of RISC processor differently. the designed stack processor can support the packet format conversion operations required in the various TCP/IP protocols.

• ETRI Journal
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• v.34 no.1
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• pp.44-54
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• 2012

Because of the intrinsic lack of internal-system observability and controllability in highly integrated multicore processors, very restricted access is allowed for the debugging of erroneous chip behavior. Therefore, the building of an efficient debug function is an important consideration in the design of multicore processors. In this paper, we propose a flexible on-chip debug architecture that embeds a special logic supporting the debug functionality in the multicore processor. It is designed to support run-stop-type debug functions that can halt and control the execution of the multicore processor at breakpoint events and inspect the possible causes of any errors. The debug architecture consists of the following three functional components: the core debug support block, the multicore debug support block, and the debug interface and control block. By embedding this debug infrastructure, the embedded processor cores within the multicore processor can be debugged simultaneously as well as independently. The debug control is performed by employing a JTAG-based scanning operation. We apply this on-chip debug architecture to build a debugger for a prototype multicore processor and demonstrate the validity and scalability of our approach.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.809-812
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• 2013

This paper realize power control embedded system with one master of Core-A 32-bit RISC processor and several slaves controling power with synchronized digital signals. Core-A platform provided by Dynalith Systems consists of Core-A processor, AMBA bus, SSRAM, AC97, DMA, UART, GPIO etc. Slave is made by both digital part and analog part. The former generates various power control patterns synchronized with master signal. The latter converts 220V power proportional to 4 bit digital signals. Design of Embedded system is executed in Flowrian2 of System Centroid Inc., in which software is cross-compiled and hardware is verified by simulation. Embedded system is implemented in FPGA board and CPLD chips as well as PCB board for analog power control.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.6
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• pp.1413-1421
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• 2014

This paper realize power control embedded system with one master of Core-A 32-bit RISC processor and several slaves controling power with synchronized digital signals. Core-A platform is consisted of Core-A processor, AMBA bus, SSRAM, AC97, DMA, UART, GPIO etc. Slave is made by both digital part and analog part. The former generates various power control patterns synchronized with master signal. The latter converts 220V power proportional to 4 bit digital signals. design of Embedded system is executed in Flowrian II, in which software is cross-compiled and hardware is verified by simulation. Embedded system is implemented in FPGA board and CPLD chips as well as PCB board for analog power control.

• Journal of the Institute of Convergence Signal Processing
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• v.13 no.1
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• pp.50-55
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• 2012

This paper proposes an optima] many-core processor architecture that meets the requirements of low power and high performance for different ultrasonic image resolutions in hand-held ultrasonic devices. To identify the optimal many-core architecture, seven different PE configurations are simulated for processing ultrasonic images in terms of execution performance and energy consumption. Experimental results indicate that the highest energy efficiencies are achieved at PEs=1,024, 64, and 256 for ultrasonic images at $256{\times}256$, $320{\times}240$, and $800{\times}480$ resolutions, respectively. In addition, the maximum area efficiencies are obtained at PEs=256 (for $256{\times}256$ and $800{\times}480$ image resolutions) and 64 (for $320{\times}240$ image resolution).

• Proceedings of the IEEK Conference
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• 2002.07b
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• pp.1296-1299
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• 2002

We implemented a CD signal processor operated on a CAV 48-speed CD-ROM drive into a VLSI. The CD signal processor is a mixed mode monolithic IC including servo-processor, data recovery, data-processor, and I-bit DAC. For servo signal processing, we included a DSP core, while, for CAV mode playback, we adopted a PLL with a wide recovery range. Data processor (DP) was designed to meet the yellow book specification.［2］So, the DP block consists of EFM demodulator, C1/C2 ECC block, audio processor and a block transferring data to an ATAPI chip. A modified Euclid's algorithm was used as a key equation solver for the ECC block To achieve the high-speed decoding, the RS decoder is operated by a pipelined method. Audio playability is increased by playing a CD-DA disc at the speed of 12X or 16X. For this, subcode sync and data are processed in the same way as main data processing. The overall performance of IC is verified by measuring a transfer rate from the innermost area of disc to the outermost area. At 48-speed, the operating frequency is 210 ㎒, and this chip is fabricated by 0.35 um STD90 cell library of Samsung Electronics.