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http://dx.doi.org/10.9708/jksci.2011.16.6.001

Analysis on the Temperature of 3D Multi-core Processors according to Vertical Placement of Core and L2 Cache  

Son, Dong-Oh (School of Electronics and Computer Engineering, Chonnam National University)
Ahn, Jin-Woo (School of Electronics and Computer Engineering, Chonnam National University)
Park, Jae-Hyung (School of Computer Engineering and Information Technology, University of Ulsan)
Kim, Jong-Myon (School of Computer Engineering and Information Technology, University of Ulsan)
Kim, Cheol-Hong (School of Computer Engineering and Information Technology, University of Ulsan)
Publication Information
Journal of the Korea Society of Computer and Information / v.16, no.6, 2011 , pp. 1-10 More about this Journal
Abstract
In designing multi-core processors, interconnection delay is one of the major constraints in performance improvement. To solve this problem, the 3-dimensional integration technology has been adopted in designing multi-core processors. The 3D multi-core architecture can reduce the physical wire length by stacking cores vertically, leading to reduced interconnection delay and reduced power consumption. However, the power density of 3D multi-core architecture is increased significantly compared to the traditional 2D multi-core architecture, resulting in the increased temperature of the processor. In this paper, the floorplan methods which change the forms of vertical placement of the core and the level-2 cache are analyzed to solve the thermal problems in 3D multi-core processors. According to the experimental results, it is an effective way to reduce the temperature in the processor that the core and the level-2 cache are stacked adjacently. Compared to the floorplan where cores are stacked adjacently to each other, the floorplan where the core is stacked adjacently to the level-2 cache can reduce the temperature by 22% in the case of 4-layers, and by 13% in the case of 2-layers.
Keywords
multi-core processor; 3D integrated circuits; temperature; floorplan;
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