• Title/Summary/Keyword: Process Patterns

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A Study on Detecting Changes in Injection Molding Process through Similarity Analysis of Mold Vibration Signal Patterns (금형 기반 진동 신호 패턴의 유사도 분석을 통한 사출성형공정 변화 감지에 대한 연구)

  • Jong-Sun Kim
    • Design & Manufacturing
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    • v.17 no.3
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    • pp.34-40
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    • 2023
  • In this study, real-time collection of mold vibration signals during injection molding processes was achieved through IoT devices installed on the mold surface. To analyze changes in the collected vibration signals, injection molding was performed under six different process conditions. Analysis of the mold vibration signals according to process conditions revealed distinct trends and patterns. Based on this result, cosine similarity was applied to compare pattern changes in the mold vibration signals. The similarity in time and acceleration vector space between the collected data was analyzed. The results showed that under identical conditions for all six process settings, the cosine similarity remained around 0.92±0.07. However, when different process conditions were applied, the cosine similarity decreased to the range of 0.47±0.07. Based on these results, a cosine similarity threshold of 0.60~0.70 was established. When applied to the analysis of mold vibration signals, it was possible to determine whether the molding process was stable or whether variations had occurred due to changes in process conditions. This establishes the potential use of cosine similarity based on mold vibration signals in future applications for real-time monitoring of molding process changes and anomaly detection.

The Usage Patterns of MCSs, and the Activation of Knowledge Management Processes for Corporate Innovations : Innovation Openness (경영통제시스템의 이용 행태에 따른 지식경영 과정들의 활성화와 제조기업 혁신 : 혁신의 공개성)

  • Choe, Jong-Min;Bae, Seong-Ho
    • Korean Management Science Review
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    • v.34 no.3
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    • pp.43-60
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    • 2017
  • This study empirically examined the differences in degrees of product or process innovations according to the activation forms of all knowledge management (KM) processes (i.e., socialization, internalization, externalization, and combination), which are influenced by the usage patterns of management control systems (MCS)(i.e., interactive and diagnostic usage patterns). We empirically investigated and identified the links among usage patterns of MCS, the activation forms of KM processes, and the kinds of innovation promoted. Under high competitive conditions, it was found that the interactive usage of MCS is relatively more preferred and enhanced. However, when environmental uncertainty is high, it was shown that the diagnostic use of MCS is more emphasized. Thus, it is evident that the use patterns of MCS are determined by environmental conditions. From the results of this study, it was suggested that under high interactive use of MCS, the activation of socialization and internalization is more enhanced than the facilitation of externalization. It was also observed that when both interactive and diagnostic usage of MCS are high, KM processes are more activated and strengthened. The results indicated that under high activation of KM processes, product innovation as well as process innovation are more frequently occurred. Finally, the results of this study suggested that according to the levels of innovation openness, major innovations are more frequently occurred and promoted than minor innovations.

Pattern Discovery by Genetic Algorithm in Syntactic Pattern Based Chart Analysis for Stock Market

  • Kim, Hyun-Soo
    • The Journal of Information Systems
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    • v.3
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    • pp.147-169
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    • 1994
  • This paper present s a pattern generation scheme from financial charts. The patterns constitute knowledge which consists of patterns as the conditional part and the impact of the pattern as the conclusion part. The patterns in charts are represented in a syntactic approach. If the pattern elements and the impact of patterns are defined, the patterns are synthesized from simple to the more highly credible by evaluating each intermediate pattern from the instances. The overall process is divided into primitive discovery by Genetic Algorithms and pattern synthesis from the discovered primitives by the Syntactic Pattern-based Inductive Learning (SYNPLE) algorithm which we have developed. We have applied the scheme to a chart : the trend lines of stock price in daily base. The scheme can generate very credible patterns from training data sets.

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Patterns recognition via artificial neural network systems

  • Sugisaka, M.;Sagara, S.;Ueno, S.
    • 제어로봇시스템학회:학술대회논문집
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    • 1990.10b
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    • pp.929-932
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    • 1990
  • This paper considers the problem of patterns recognition using the artificial neural network systems. The artificial neural network systems provide an effective tool for classifying patterns and/or characters by learning them in a certain repeated hashion. The mechanism of the learning process and the structure of neural network systems used are main concerns in the accurate and fast classification of the patterns which are slightly different each other. The neural network system employed in this study has three layers structure which is composed of input, intermidiate, and output layers. Our main concern is to develope an effective learning mechanism how to learn the patterns fastly and accurately. The experimental study performed shows that there exists an effective learning method to get higher recognition ratio in classifying the several different patterns by artificial neural network system constructed.

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Mumerical Anlysis of light Scattering Patterns for Measurement of Roughmess(I) (표면 거칠기 광산란 패턴의 컴퓨터 수치 분석 (I))

  • 임동열;김승우
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.16 no.2
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    • pp.267-280
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    • 1992
  • This paper describes a numerical analysis of the light scattering patterns of roughness profiles. This analysis was based upon the light scattering theory developed by Beckmann. In the analysis, the roughness profile was regarded as a profile whose irregularities depend on the production process and the shape of cutting tool. Generally, waviness of an actual surface seriously distorts the scattered pattern of roughness profile. In order to avoid the effects of waviness of actual surfaces, several theoretically calculated scattering patterns, instead of actual scattering patterns, were used to analyze the scattering patterns of typical engineering roughness profiles. The characteristics of the light scattering patterns for five model surfaces were studied.

Void Defects in Composite Titanium Disilicide Process (복합 티타늄실리사이드 공정에서 발생한 공극 생성 연구)

  • Cheong, Seong-Hwee;Song, Oh-Sung
    • Korean Journal of Materials Research
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    • v.12 no.11
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    • pp.883-888
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    • 2002
  • We investigated the void formation in composite-titanium silicide($TiSi_2$) process. We varied the process conditions of polycrystalline/amorphous silicon substrate, composite $TiSi_2$ deposition temperature, and silicidation annealing temperature. We report that the main reason for void formation is the mass transport flux discrepancy of amorphous silicon substrate and titanium in composite layer. Sheet resistance in composite $TiSi_2$ without patterns is mainly affected by silicidation rapid thermal annealing (RTA) temperature. In addition, sheet resistance does not depend on the void defect density. Sheet resistance with sub-0.5 $\mu\textrm{m}$ patterns increase abnormally above $850^{\circ}C$ due to agglomeration. Our results imply that $sub-750^{\circ}C$ annealing is appropriate for sub 0.5 $\mu\textrm{m}$ composite X$sub-750_2$ process.

Web-log Process Mining Analysis for Improving Utilization of University Homepage (대학 홈페이지 활용도 향상을 위한 웹 로그 프로세스마이닝 분석)

  • Lee, Yong Uook;Choi, Sang Hyun
    • Journal of Information Technology Applications and Management
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    • v.21 no.4
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    • pp.51-64
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    • 2014
  • The purpose of operating the main homepage of University is to provide the related information about University resources to site visitors. In this study, we analyze website browsing patterns and extract characteristics of users in order to improve its utilization. The access log files to main homepage were used to analyze the browsing patterns and converted to process log files adaptable to a process mining tool, ProM. Finally we provide useful information about user friendly homepage design and suggest plans for improving its utilization to website operators.

Effect of a Multi-Step Gap-Filling Process to Improve Adhesion between Low-K Films and Metal Patterns

  • Lee, Woojin;Kim, Tae Hyung;Choa, Yong-Ho
    • Korean Journal of Materials Research
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    • v.26 no.8
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    • pp.427-429
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    • 2016
  • A multi-step deposition process for the gap-filling of submicrometer trenches using dimethyldimethoxysilane (DMDMOS), $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by plasma enhanced chemical vapor deposition (PECVD) is presented. The multi-step process consisted of pre-treatment, deposition, and post-treatment in each deposition step. We obtained low-k films with superior gap-filling properties on the trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on inter metal dielectric (IMD) and shallow trench isolation (STI) processes for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universally for other chemical vapor deposition systems.

Overlay And Side-lobe Suppression in AttPSM Lithography Process for An Metal Layer (AttPSM을 사용하는 Metal Layer 리토그라피공정의 Overlay와 Side-lobe현상 방지)

  • 이미영;이흥주
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.07a
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    • pp.18-21
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    • 2002
  • As the mask design rules get smaller, the probability of the process failure becomes higher due to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method is applied with the rule based optical proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design nile is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

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Rule-based OPC for Side-lobe Suppression in The AttPSM Metal Layer Lithography Process (AttPSM metal layer 리토그라피공정의 side-lobe억제를 위한 Rule-based OPC)

  • Lee, Mi-Young;Lee, Hoong-Joo;Seong, Young-Sub;Kim, Hoon
    • Proceedings of the IEEK Conference
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    • 2002.06b
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    • pp.209-212
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    • 2002
  • As the mask design rules get smaller, the probability of the process failure becomes higher doc to the narrow overlay margin between the contact and metal interconnect layers. To obtain the minimum process margin, a tabbing and cutting method Is applied with the rule based optical\ulcorner proximity correction to the metal layer, so that the protection to bridge problems caused by the insufficient space margin between the metal layers can be accomplished. The side-lobe phenomenon from the attenuated phase shift mask with the tight design rule is analyzed through the aerial image simulation for test patterns with variation of the process parameters such as numerical aperture, transmission rate, and partial coherence. The corrected patterns are finally generated by the rules extracted from the side-lobe simulation.

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