• Title/Summary/Keyword: Printed materials

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Impact of different agitation methods on smear layer cleaning of mesial canals with accentuated curvature

  • Abel Teves Cordova;Murilo Priori Alcalde;Michel Espinosa Klymus;Leonardo Rigoldi Bonjardim;Rodrigo Ricci Vivan;Marco Antonio Hungaro Duarte
    • Restorative Dentistry and Endodontics
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    • v.49 no.2
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    • pp.12.1-12.10
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    • 2024
  • Objectives: This study evaluated the impact of different methods of irrigant agitation on smear layer removal in the apical third of curved mesial canals of 3 dimensionally (D) printed mandibular molars. Materials and Methods: Sixty 3D-printed mandibular second molars were used, presenting a 70° curvature and a Vertucci type II configuration in the mesial root. A round cavity was cut 2 mm from the apex using a trephine of 2 mm in diameter, 60 bovine dentin disks were made, and a smear layer was formed. The dentin disks had the adaptation checked in the apical third of the teeth with wax. The dentin disks were evaluated in environmental scanning electron microscope before and after the following irrigant agitation methods: G1(PIK Ultrasonic Tip), G2 (Passive Ultrasonic Irrigation with Irrisonic- PUI), G3 (Easy Clean), G4 (HBW Ultrasonic Tip), G5 (Ultramint X Ultrasonic tip), and G6 (conventional irrigation-CI) (n = 10). All groups were irrigated with 2.5% sodium hypochlorite and 17% ethylenediaminetetraacetic acid. Results: All dentin disks were 100% covered by the smear layer before treatment, and all groups significantly reduced the percentage of the smear layer after treatment. After the irrigation protocols, the Ultra-X group showed the lowest coverage percentage, statistically differing from the conventional, PIK, and HBW groups (p < 0.05). There was no significant difference among Ultramint X, PUI-Irrisonic, and Easy Clean (p > 0.05). None of the agitation methods could remove the smear layer altogether. Conclusions: Ultramint X resulted in the most significant number of completely clean specimens.

Suitability and Readability Assessment of Printed Educational Materials on Hypertension (고혈압 교육 인쇄물의 적합성 및 이독성 평가)

  • Lee, Tae-Wha;Kang, Soo-Jin;Kim, Hye-Hyun;Woo, So-Ra;Kim, Sin-Hye
    • Journal of Korean Academy of Nursing
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    • v.41 no.3
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    • pp.333-343
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    • 2011
  • Purpose: The aim of this study was to assess the suitability and readability of printed educational materials for patients with hypertension in Korea. Methods: A total of 33 written educational materials related to hypertension were collected from public health centers, hospitals, and internet web site. Among them, we analyzed 19 materials which fit the inclusion criteria: leaflets (n=9), booklets (n=3), and guide book (n=7). Two trained nurses evaluate the materials using suitability assessment tool (SAM; Doak, Doak, & Root, 1996) and graded lexical items for teaching Korean (Kim, 2003). Results: Overall, 14 (73.7%) of 19 materials scored adequate, and 5 (26.3%) scored inadequate. On the average, the education materials contained 36.1% to 50.5% of 1st grade reading level words and 12.9% to 21.6% of 4th grade level and over. Conclusion: The reading level of the materials was higher than a 6th grade reading level. It is proposed that the written educational materials should be developed by health professionals according to suitability and quality by taking the target group's literacy capacity into consideration.

Structural Optimization of 3D Printed Composite Flight Control Surface according to Diverse Topology Shapes (다양한 위상 형상에 따른 3D 프린트 복합재료 조종면의 구조 최적화)

  • Myeong-Kyu Kim;Nam Seo Goo;Hyoung-Seock Seo
    • Composites Research
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    • v.36 no.3
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    • pp.211-216
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    • 2023
  • When designing ships and aircraft structures, it is important to design them to satisfy weight reduction and strength. Currently, studies related to topology optimization using 3D printed composite materials are being actively conducted to satisfy the weight reduction and strength of the structure. In this study, structural analysis was performed to analyze the applicability of 3D printed composite materials to the flight control surface, one of the parts of an aircraft or unmanned aerial vehicle. The optimal topology shape of the flight control surface for the bending load was analyzed by considering three types (hexagonal, rectangular, triangular) of the topology shape of the flight control surface. In addition, the bending strength of the flight control surface was analyzed when four types of reinforcing materials (carbon fiber, glass fiber, high-strength high-temperature glass fiber, and kevlar) of the 3D printed composite material were applied. As a result of comparing the three-point bending test results with the finite element method results, it was confirmed that the flight control surface with hexagonal topology shape made of carbon fiber and Kevlar had excellent performance. And it is judged that the 3D printed composite can be sufficiently applied to the flight control surface.

Effect of Post-Annealing Condition on the Peel Strength of Screen-printed Ag Film and Polyimide Substrate (후속 열처리조건이 스크린 프린팅 Ag 박막과 폴리이미드 사이의 필강도에 미치는 영향)

  • Bae, Byung-Hyun;Lee, Hyeonchul;Son, Kirak;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.2
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    • pp.69-74
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    • 2017
  • Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

Effects of Bonding Conditions on Mechanical Strength of Sn-58Bi Lead-Free Solder Joint using Thermo-compression Bonding Method (열압착 접합 조건에 따른 경·연성 인쇄회로기판 간 Sn-58Bi 무연솔더 접합부의 기계적 특성)

  • Choi, Ji-Na;Ko, Min-Kwan;Lee, Sang-Min;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.2
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    • pp.17-22
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    • 2013
  • We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

Electroless Plated Copper Thin Film for Metallization on Printed Circuit Board : Neutral Process (인쇄회로기판상의 금속 배선을 위한 구리 도금막 형성 : 무전해 중성공정)

  • Cho, Yang-Rae;Lee, Youn-Seoung;Rha, Sa-Kyun
    • Korean Journal of Materials Research
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    • v.23 no.11
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    • pp.661-665
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    • 2013
  • We investigated the characteristics of electroless plated Cu films on screen printed Ag/Anodized Al substrate. Cu plating was attempted using neutral electroless plating processes to minimize damage of the anodized Al substrate; this method used sodium hypophosphite instead of formaldehyde as a reducing agent. The basic electroless solution consisted of $CuSO_4{\cdot}5H_2O$ as the main metal source, $NaH_2PO_2{\cdot}H_2O$ as the reducing agent, $C_6H_5Na_3O_7{\cdot}2H_2O$ and $NH_4Cl$ as the complex agents, and $NiSO_4{\cdot}6H_2O$ as the catalyser for the oxidation of the reducing agent, dissolved in deionized water. The pH of the Cu plating solutions was adjusted using $NH_4OH$. According to the variation of pH in the range of 6.5~8, the electroless plated Cu films were coated on screen printed Ag pattern/anodized Al/Al at $70^{\circ}C$. We investigated the surface morphology change of the Cu films using FE-SEM (Field Emission Scanning Electron Microscopy). The chemical composition of the Cu film was determined using XPS (X-ray Photoelectron Spectroscopy). The crystal structures of the Cu films were investigated using XRD (X-ray Diffraction). Using electroless plating at pH 7, the structures of the plated Cu-rich films were typical fcc-Cu; however, a slight Ni component was co-deposited. Finally, we found that the formation of Cu film plated selectively on PCB without any lithography is possible using a neutral electroless plating process.