• Korean Chemical Engineering Research
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• 제54권1호
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• pp.108-113
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• 2016

A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.

• 품질경영학회지
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• 제25권1호
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• pp.135-141
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• 1997

The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-$150^{\circ}C$) than the normal. Then, this test condition of high temperature may cause such quality problems as hole eccentricity and reduction of distance between part holes. After measuring the CCL shrinkage affected by temperature, the correction factor of a press mold was a, pp.ied to solve these problems. The results showed that the tolerance of hole pitch(${\pm}$$100{\mu}m$) was satisfactory and the internal and external failure costs were reduced by 55%.

• 한국신뢰성학회지:신뢰성응용연구
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• 제9권3호
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• pp.259-274
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• 2009

Printed circuit boards for RAM are widely used in modern electronics such as computers, artificial satellites and consumer durables. They are exposed to a very diverse environment and consists of many complicated components and therefore needs careful approach to the enhancement and assessment of reliability of the item. In this article reliability standards for PCBs for RAM are established in terms of quality certification tests and failure rate tests.

• 한국생산제조학회지
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• 제26권4호
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• pp.371-377
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• 2017

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

• 한국안전학회지
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• 제30권4호
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• pp.32-38
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• 2015

In this paper, we analyzed the vehicle fire accidents due to damage of vehicle's electrical components, which is applied to a vehicle. In recent development of electrical components technology, approximately 40% of vehicle manufacturing parts have applied electronic circuit technology. Phenomenon such deterioration of insulating performance or electric breakdown on the vehicle's electrical components and printed circuit boards(PCBs) resulted from moisture, contamination and aging due to repetitive operations, lead to the vehicle fire. Therefore, the application of electrical components with adequate electric capacity for vehicle and usage of molding techniques using a non-combustible materials to shut off the oxygen should be applied in order to prevent vehicle fire due to damage of the electrical components and PCBs.

• 한국안전학회지
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• 제28권3호
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• pp.51-55
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• 2013

The purpose of this study is to find the causes of malfunctions and defective operation of printed circuit boards(PCBs) built into home refrigerators to perform power saving functions. This study performed an electrostatic test of a PCB built-in using an Auto Triggering system; lightning and impulse tests using an LSS-15AX; and an impulse test using an INS-400AX. From the analysis of a secondarily developed product, it was found that electrostatic discharge(ESD) caused more malfunctions and defective operations than electric overstress(EOS) due to overvoltage. As a result of increasing the condenser capacity of the PCB circuit, withstanding voltage was increased to 7.4 kV. In addition, this study changed the power saving mode and connected a varistor to the #2 pin of an IC chip. As a result, the system consisting of all specimens of a finally developed product was operated stably with an applied voltage of less than 10 kV. This study found it necessary to perform quality control at the manufacturing stage in order to reduce the occurrence of electrostatic accidents to IC chips built into a PCB.

• 제어로봇시스템학회논문지
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• 제3권4호
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• pp.406-414
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• 1997

A real-time inspection system is developed using line scan cameras. Several improved algorithms are proposed for real-time detection of defects in this automated inspection system. The major improved algorithms include the preprocessing, the threshold decision, and the clustering algorithms. The preprocessing algorithms are for exact binarization and the threshold decision algorithm is for fast detection of defects in 1-D binary images. The clustering algorithm is also developed for fast classifying of the defects. The system is applied to PCBs(Printed Circuit Boards) inspection. The typical defects in PCBs are pits, dent, wrinkle, scratch, and black spots. The results show that most defects are detected and classified successfully.

• 한국자원리싸이클링학회:학술대회논문집
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• 한국자원리싸이클링학회 2005년도 추계정기총회 및 제26회 학술발표대회 고분자리싸이클링기술 특별심포지엄
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• pp.304-307
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• 2005

Printed circuit boards (PCBs) of the printer are composed of various organic and inorganic compounds as well as metals and alloys. This study was conducted to recover valuable metals from used PCBS by physical separation and leaching. The PCBs was crushed, sieved, classified by zig zag classifier and magnetic constituents were removed by the magnetic separation. The non-magnetic constituents of sizes between 1.2 and 0.6 mm especially containing high quantity of Cu (e.g. 83% on metal base and 31% on total base) were used for the leaching experiment. The effect of the nature and concentration of acids and reaction temperature were investigated. The Cu leaching rate to 98.5% in 2M nitric acid, pulp density 100g/L, $90^{\circ}C$, 300rpm, 1hr leaching.

• Journal of Radiation Protection and Research
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• 제45권1호
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• pp.35-44
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• 2020

Background: Cadmium zinc telluride (CZT) is a promising material because of a high detection efficiency, good energy resolution, and operability at room temperature. However, the cost of CZT dramatically increases as its size increases. In this study, to achieve a large effective volume with relatively low cost, an array structure comprised of individual virtual Frisch-grid CZT detectors was proposed. Materials and Methods: The prototype consisted of 2 × 2 CZTs, a holder, anode and cathode printed circuit boards (PCBs), and an application-specific integrated circuit (ASIC). CZTs were used and the non-contacting shielding electrode method was applied for virtual Frisch-grid effect. An ASIC was used, and the holder and the PCBs were fabricated. In the current system, because the CZTs formed a common cathode, a total of 5 channels were assigned for data processing. Results and Discussion: An experiment using ¹³⁷Cs at room temperature was conducted for 10 minutes. Energy and timing information was acquired and the depth of interaction was calculated by the timing difference between the signals of both electrodes. Based on obtained three-dimensional position information, the energy correction was carried out, and as a result the energy spectra showed the improvements. In addition, a Compton image was reconstructed using the iterative method. Conclusion: The virtual Frisch-grid CZT detector based on the array structure was developed and the energy spectra and the Compton image were successfully acquired.

• 전기학회논문지
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• 제63권12호
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• pp.1716-1721
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• 2014

In this paper, a study on automation method for the circuit/EM (Electro-Magnetic) simulation is carried out to analyze effectively the SI/PI (Signal Integrity/Power Integrity) issues which occur on circuits and/or PCBs (Printed Circuit Boards). For the automation of the circuit/EM simulation, algorithms performing each process of the SI/PI analysis automatically (such as ports setup, circuit definition and SI/PI evaluation) are developed; thereby automation system for the SI/PI analysis is constructed with the algorithms. The automation of the circuit/EM simulation is accomplished in the environment of the C/S (Client/Server) architecture in order to reduce resources such as high cost computers demanded for the SI/PI analysis. The automation method for the SI/PI analyses proposed in this paper reduces effort, time, and cost spent on the environment setup for simulation and the SI/PI analysis process. In addition, the proposed method includes automation of the documenting process, which organizes, records and displays the SI/PI analysis results automatically for users.