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http://dx.doi.org/10.9713/kcer.2016.54.1.108

A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication  

Cho, Sung Ki (School of Energy and Integrated Materials Engineering, Department of Energy and Chemical Engineering, Kumoh National Institute of Technology)
Kim, Jae Jeong (School of Chemical and Biological Engineering, Institute of Chemical Process, Seoul National University)
Publication Information
Korean Chemical Engineering Research / v.54, no.1, 2016 , pp. 108-113 More about this Journal
Abstract
A miniaturized lab-scale Cu plating cell for the metallization of electronic devices was fabricated and its deposit uniformity and profile were investigated. The plating cell was composed of a polypropylene bath, an electrolyte ejection nozzle which is connected to a circulation pump. In deposit uniformity evaluation, thicker deposit was found on the bottom and sides of substrate, indicating the spatial variation of deposit thickness was governed by the tertiary current distribution which is related to $Cu^{2+}$ transport. The surface morphology of Cu deposit inside photo-resist pattern was controlled by organic additives in the electrolyte as it led to the flatter top surface compared to convex surface which was observed in the deposit grown without organic additives.
Keywords
Printed Circuit Boards; Metallization; Electroplating; Plating Cell; Uniformity;
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Times Cited By KSCI : 3  (Citation Analysis)
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1 Andricacos, P. C., Uzoh, C., Dukovic, J., Horkans, J. and Deligianni, H., "Damascene Copper electroplating for chip interconnections," IBM J. Res. Dev., 42, 567-574(1998).   DOI
2 Kim, Y.-S., Shin, J., Kim, H.-I., Cho, J.-H., Seo H.-K., Kim., G.-S. and Shin, H.-S., "A Study of Copper Electroless Deposition on Tungsten Substrate," Korean Chem. Eng. Res., 43(4), 495-502(2005).
3 Kwon, O. J., Cho, S. K. and Kim, J. J., "Electrochemical Metallization Processes for Copper and Silver Metal Interconnection," Korean Chem. Eng. Res., 47(2), 141-149(2009).
4 Kim, M. J. and Kim, J. J., "Electroplating for the Fabrication of Copper Interconnection in Semiconductor Devices," Korean Chem. Eng. Res., 52(1), 26-39(2014).   DOI
5 Mehdizadeh, S., Dukovic, J. O., Andricacos, P. C. and Romankiw, L. T., "The Influence of Lithographic Patterning on Current Distribution: A Model for Microfabrication by Electrodeposition," J. Electrochem. Soc., 139, 78-91(1992).   DOI
6 Mehdizadeh, S., Dukovic, J., Andricacos, P. C., Romankiw, L. T. and Cheh, H. Y., "The Influence of Lithographic Distribution in Electrodeposition: Experimental Study and Mass-Transfer Effects," J. Electrochem. Soc., 140, 3497-3505(1993).   DOI
7 Kondo, K., Fukui, K., Uno, K. and Shinohara, K., "Shape Evolution of Electrodeposited Copper Bumpstitle," J. Electrochem. Soc., 143, 1880-1886(1996).   DOI
8 Kondo, K. and Fukui, K., "Current Evolution of Electrodeposited Copper Bumps with Photoresist Angle," J. Electrochem. Soc., 145, 840-844(1998).   DOI
9 Kondo, K., Tanaka, Z., and Monden, T., "Shape Evolution of Electrodeposited Bumps with Additive," Electrochim. Acta, 44, 3691-3696(1999).   DOI
10 Hayashi, K., Fukui, K., Tanaka, Z. and Kondo, K., "Shape Evolution of Electrodeposited Bumps into Deep Cavities," J. Electrochem. Soc., 148, C145-C148(2001).   DOI
11 Subramanian, V. R. and White, R. E., "Simulating Shape Changes during Electrodeposition: Primary and Secondary Current Distribution," J. Electrochem. Soc., 149, C498-C505(2002).   DOI
12 Kim, B. and Ritzdorf, T., "Electrical Waveform Mediated Throughmask Deposition of Solder Bumps for Wafer Level Packaging," J. Electrochem. Soc., 151, C342-C347(2004).   DOI
13 Luo, J. K., Chu, D. P., Flewitt, A. J., Spearing, S. M., Fleck, N. A. and Milne, W. I., "Uniformity Control of Ni Thin-Film Microstructures Deposited by Through-Mask Plating," J. Electrochem. Soc., 152, C36-C41(2005).   DOI
14 Jenq, S. N., Wan, C. C. and Wang, Y. Y., "The Influence of Selfassembled Disulfide Additive on the Pattern Shape by Cu Electrodeposition Through Mask," J. Electroanal. Chem., 609, 68-74(2007).   DOI
15 Denn, M. M., Process fluid mechanics, Prentice-Hall, 1990, p. 112.
16 Dukovic, J. O., "Feature-Scale Simulation of Resist Patterned Electrodeposition," IBM J. Res. Dev., 37, 125-141(1993).   DOI
17 Moffat, T. P., Bonevich, J. E., Huber, W. H., Stanishevsky, A., Kelly, D. R., Stafford, G. R. and Josell, D., "Superconformal Electrodeposition of Copper in 500-90 nm Features," J. Electrochem. Soc., 147, 4524-4535(2000).   DOI
18 Newman, J. S., Electrochemical Systems, Prentice-Hall, Englewood Cliffs, New Jersey, 2nd ed., 1991, p. 331.
19 Moffat, T. P., Wheeler, D., Edelstein, M. D. and Josell, D., "Superconformal Film Growth: Mechanism and Quantification," IBM J. Res. Dev., 49, 19-36(2005).   DOI