Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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Comparisons of the Heat Dissipation Performances of MPCB and FPCB in LED Lights

LED조명에서 MPCB와 FPCB의 방열 성능 비교 연구

  • Shin, Sang-Muk (Course for Knowledge-based Technology(Opto-Nanotronics), Korea Polytechnic University) ;
  • Moon, Duk-Young (Course for Knowledge-based Technology(Opto-Nanotronics), Korea Polytechnic University) ;
  • Yoo, Kyung-Sun (Course for Knowledge-based Technology(Opto-Nanotronics), Korea Polytechnic University) ;
  • Hyun, Dong-Hoon (Course for Knowledge-based Technology(Opto-Nanotronics), Korea Polytechnic University)
  • Received : 2017.06.05
  • Accepted : 2017.06.21
  • Published : 2017.08.15
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Abstract

In this study, the heat dissipation performances of metal printed circuit boards (MPCBs) and flexible printed circuit boards (FPCBs) used in light-emitting diode (LED) lights were compared and analyzed by performing a heat dissipation simulation using a thermal flow analysis program. The results were summarized graphically. The temperature distribution of the MPCB was found to be better than that of the FPCB, indicating the better heat dissipation performance of the MPCB. For the two FPCB structures studied, we confirmed the LED temperature and temperature distribution by thermal flow analysis and found that for better overall heat dissipation performance, PCBs should preferably have an asymmetric structure. We confirmed the possibility of using FPCBs, which are characterized by a flexible structure, for LED lighting.

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References

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