Journal of Korean Society for Quality Management (품질경영학회지)
- Volume 25 Issue 1
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- Pages.135-141
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- 1997
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- 1229-1889(pISSN)
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- 2287-9005(eISSN)
A Test on Quality Improvement of Printed Circuit Board Using Mold Compensation
금형보정을 이용한 PCB 품질향상에 관한 실험
Abstract
The Copper-Clad Laminate (CCL) is a main electronic component of specialtype printed circuit boards (PCBs) such as Silver Through Hole PCB. This CCL should have high reliability under the aging test, and usually the test is done at a higher temperature (110-
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