• Journal of the Chungcheong Mathematical Society
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• v.21 no.3
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• pp.371-376
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• 2008

Let $P(M,G,{\pi})=:P$ be a principal fibre bundle with structure Lie group G over a base manifold M. In this paper we get the following facts: 1. The tangent bundle TG of the structure Lie group G in $P(M,G,{\pi})=:P$ is a Lie group. 2. The Lie algebra ${\mathcal{g}}=T_eG$ is a normal subgroup of the Lie group TG. 3. $TP(TM,TG,{\pi}_*)=:TP$ is a principal fibre bundle with structure Lie group TG and projection ${\pi}_*$ over base manifold TM, where ${\pi}_*$ is the differential map of the projection ${\pi}$ of P onto M. 4. for a Lie group $H,\;TH=H{\circ}T_eH=T_eH{\circ}H=TH$ and $H{\cap}T_eH=\{e\}$, but H is not a normal subgroup of the group TH in general.

• Journal of the Korean Mathematical Society
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• v.55 no.3
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• pp.553-574
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• 2018

In this paper, we study harmonic maps and biharmonic maps on the principal G-bundle in Kobayashi and Nomizu and also the warped product $P=M{\times}_fF$ for a $C^{\infty}$(M) function f on M studied by Bishop and O'Neill, and Ejiri.

• Communications of the Korean Mathematical Society
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• v.14 no.1
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• pp.211-216
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• 1999

We study the anti-linear involutions on a real algebraic vector bundle with bundle with a compact real algebraic group action.

• Journal of the Chungcheong Mathematical Society
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• v.33 no.3
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• pp.365-374
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• 2020

Given a noncompact semisimple Lie group G and its maximal compact Lie subgroup K such that the right multiplication of each element in K gives an isometry on G, consider a principal bundle G → G/K, which is a Riemannian submersion. We study the infinitesimal holonomy isometries. Given a closed curve at eK in the base space G/K, consider the holonomy displacement of e by the horizontal lifting of the curve. We prove that the correspondence is continuous.

• Bulletin of the Korean Mathematical Society
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• v.33 no.3
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• pp.477-480
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• 1996

Let $\pi : Z \longrightarrow Y$ be a fiber bundle where Y and Z are compact Riemannian manifolds without boundary. We are primarily interested in the case where $\pi$ is a Riemannian submersion with minimal fibers; this is the case, for example, where Z is the sphere bundle of some vector bundle over Y or where Z is a principal bundle over Y.

• Journal of Korea Multimedia Society
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• v.16 no.2
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• pp.160-168
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• 2013

In this paper an algorithm that represents shape sequences with moving frames parallel along the sequences are developed. According to Levi-Civita connection, it is not easy to measure the variation of the vector fields on non-Euclidean spaces without tools to parallel transport them. Thus, parallel transport of the vector fields along the shape sequences is implemented using the theories of principal frame bundle and analyzed via extensive simulation.

• Bulletin of the Korean Mathematical Society
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• v.36 no.4
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• pp.649-654
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• 1999

We consider the forgetful map from the group of equivariant self equivalences to the group of non-equivariant self equivalences. A sufficient condition for this forgetful map being a monomorphism is obtained. Several examples are given.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.342-346
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• 2009

Forming characteristics for the bundle extrusion of Cu-Ti bimetal wires are investigated, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion for pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.

• Kyungpook Mathematical Journal
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• v.31 no.1
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• pp.25-34
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• 1991

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.393-397
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• 2005

A process map has been developed, which can identify the process conditions for weak mechanical bonding at the contact surface during the direct extrusion of a Cu-Ti bimetal wire bundle. Bonding mechanism between Cu and Ti is assumed as a cold pressure welding. Then, the plastic deformation at the contact zone causes mechanical bonding and a new bonding criterion fur pressure welding is developed as a function of the principal stretch ratio and normal pressure at the contact surface by analyzing micro local extrusion at the contact zone. The averaged deformation behavior of Cu-Ti bimetal wire is adopted as a constitutive behavior at a material point in the finite element analysis of Cu-Ti wire bundle extrusion. Various process conditions for bundle extrusions are examined. The deformation histories at the three points, near the surface, in the middle and near the center, in the cross section of a bundle are traced and the proposed new bonding criterion is applied to predict whether the mechanical bonding at the Cu-Ti contact surface happens. Finally, a process map for the direct extrusion of Cu-Ti bimetal wire bundle is proposed.