• 한국산학기술학회논문지
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• 제15권5호
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• pp.3093-3099
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• 2014

최근 그래픽 프로세서, 멀티미디어 프로세서, 음성처리 프로세서 등에서 부동소수점이 주로 사용된다. 한편 C, Java 등 고급언어에서는 단정도실수와 배정도실수를 사용하고 있다. 본 논문에서는 32비트 곱셈기를 사용하여 배정도실수의 역수를 계산하는 알고리즘을 제안한다. 배정도실수 가수를 상위 부분과 하위 부분으로 나누고, 상위 부분의 역수를 골드스미스 알고리즘으로 계산하고, 이를 초기값으로 하여 배정도실수의 역수를 계산하는 알고리즘을 제안한다. 제안한 알고리즘은 입력값에 따라서 곱셈 횟수가 다르므로, 평균 곱셈 횟수를 계산하는 방식을 유도하고, 여러 크기의 근사 역수 테이블에서 평균곱셈 횟수를 계산한다.

• 한국산업정보학회논문지
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• 제18권6호
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• pp.31-37
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• 2013

최근 그래픽 프로세서, 멀티미디어 프로세서, 음성처리 프로세서 등에서 부동소수점이 주로 사용된다. C, Java 등 고급언어에서는 단정도실수와 배정도실수를 사용하고 있다. 본 논문에서는 32 비트 곱셈기를 사용하여 배정도실수의 역수를 계산하는 알고리즘을 제안한다. 배정도 실수 가수를 상위 부분과 하위 부분으로 나누고, 상위 부분의 역수를 뉴턴-랍손 알고리즘으로 계산한다. 그리고 이를 초기값으로 하여 배정도실수의 역수를 계산한다. 제안한 알고리즘은 입력값에 따라서 곱셈 횟수가 다르므로, 평균 곱셈 횟수를 계산하는 방식을 유도하고, 여러 크기의 근사 역수 테이블에서 평균 곱셈 횟수를 계산한다.

• Journal of Information Processing Systems
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• 제18권3호
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• pp.293-301
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• 2022

Direction of arrival (DOA) estimation of space signals is a basic problem in array signal processing. DOA estimation based on the multiple signal classification (MUSIC) algorithm can theoretically overcome the Rayleigh limit and achieve super resolution. However, owing to its inadequate real-time performance and accuracy in practical engineering applications, its applications are limited. To address this problem, in this study, a DOA estimation algorithm with high parallelism and precision based on an analysis of the characteristics of complex matrix eigenvalue decomposition and the coordinate rotation digital computer (CORDIC) algorithm is proposed. For parallel and single precision, floating-point numbers are used to construct an orthogonal identity matrix. Thus, the efficiency and accuracy of the algorithm are guaranteed. Furthermore, the accuracy and computation of the fixed-point algorithm, double-precision floating-point algorithm, and proposed algorithm are compared. Without increasing complexity, the proposed algorithm can achieve remarkably higher accuracy and efficiency than the fixed-point algorithm and double-precision floating-point calculations, respectively.

• 한국정밀공학회지
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• 제32권11호
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• pp.983-988
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• 2015

This paper details a new ultra-precise turning method for increasing surface quality, "Multi Point B Axis Control Method." Machined surface error is minimized by the compensation machining process, but the process leaves residual chip marks and surface roughness. This phenomenon is unavoidable in the diamond turning process using existing machining methods. However, Multi Point B axis control uses a small angle (< $1^{\circ}$) for the unused diamond edge for generation of ultra-fine surfaces; no machining chipping occurs. It is achieved by compensated surface profiling via alignment of the tool radial center on the center of the B axis rotation table. Experimental results show that a diamond turned surface using the Multi Point B axis control method achieved P-V $0.1{\mu}m$ and Ra 1.1nm and these ultra-fine surface qualities are reproducible.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1312-1314
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• 2004

This paper proposes a new simplification algorithm that simplifies reconstructed polygonal mesh from 3D point set considering an original point set. Previous method computes error using mesh information, but it makes to increase error of difference between an original and a simplified model by reason of implementation of simplification. Proposed method simplifies a reconstructed model using an original point data, we acquire a simplified model similar an original. We show several simplified results to demonstrate the usability of our methods.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.155-156
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.141-142
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• 2011

• 전기학회논문지
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• 제60권7호
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• pp.1434-1437
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• 2011

Precision measurement of silicon wafer resistivity has been using single-configuration Four-Point Probe(FPP) method. This FPP method have to applying sample size, shape and thickness correction factor for a probe pin spacing to precision measurement of silicon wafer. The deference for resistivity measurement values applied correction factor and not applied correction factor was about 1.0 % deviation. The sample size, shape and thickness correction factor for a probe pin spacing have an effects on precision measurement for resistivity of silicon wafer.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.901-904
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• 2002

The cutting thickness of ultra-precision machining is generally very small, only a few micrometer or even down to the order of a flew manometer. In such case, a basic understanding of the mechanism on the micro-machining process is necessary to produce a high quality surface. When machining at very small depths of cut, metal flow near a rounded tool edge become important. In this paper a finite element analysis is presented to calculate the stagnation point on the tool edge or critical depth of cut below which no cutting occurs. From the simulation, the effects of the cutting speed on the critical depths of cut were calculated and discussed. Also the transition of the stagnation point according to the increase of the depths of cut was observed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 추계학술대회 논문집
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• pp.293-294
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• 2007