• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2016.10a
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• pp.527-530
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• 2016

This paper presents curvature-compensated reference circuits operating under low-voltage condition and achieving low-power consumption with $0.35-{\mu}m$ standard CMOS process. The proposed circuit can operate under less than 1-V supply voltage by using MOS transistors operating in weak-inversion region. The simulation results shows a low temperature coefficient by using the proposed curvature compensation technique. It generates a graph-shape temperature characteristic that looks like a sine curve, not a bell-shape characteristic presented in other published BGRs without curvature compensation. The proposed circuits operate with 0.9-V supply voltage. First, the voltage reference circuit consumes 176nW power and the temperature coefficient is $26.4ppm/^{\circ}C$. The current reference circuit is designed to operate with 194.3nW power consumption and $13.3ppm/^{\circ}C$ temperature coefficient.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.6A
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• pp.634-639
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• 2006

In this paper an MMIC 2-stage power amplifier is designed and fabricated for 5GHz wireless LAN applications using $0.5{\mu}m$ gate length PHEMT transistors. The PHEMT gate width is optimized in order to meet the linearity and efficiency of the MMIC power amplifier. The $0.5{\mu}m\times600{\mu}m$ PHEMT for the drive stage and $0.5{\mu}m\times3000{\mu}m$ PHEMT for the amplification stage are the optimized sizes to achieve more than 25dBc of third order IMD at the power level of 3dB back-off from the input P1dB and more than 22dBm output power under a supply voltage of 3.3V. The two-stage MMIC power amplifier is designed to be used for the both of HIPERLAN/2 and IEEE 802.11a because of its broadband characteristics. The fabricated PHEMT MMIC power amplifier exhibits a 20.1dB linear power gain, a maximum 22dBm output power, a 24% power added efficiency under 3.3V supply voltage. The input and output on-chip matching circuits are included on a chip of $1400\times1200{\mu}m^2$.

• Journal of KIISE:Computer Systems and Theory
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• v.27 no.7
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• pp.684-694
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• 2000

For designing circuits for low power systems, the capacitance is an important factor for the power dissipation. Since the capacitance of a gate is proportional to the area of the gate, we can reduce the total power consumption of a circuit by reducing the total area of gates, where total area is a simple sum of all gate areas in the circuit. To reduce the total area, transistor resizing can be used. While resizing transistors, inserting buffer in the proper position can help reduce the total area. In this paper we propose two methods for concurrent transistor sizing and buffer insertion. One method uses template window simulation and the other uses extrapolation. Experimental results show that concurrent transistor sizing with buffer insertion achieved 10-20% more reduction of the total area than when it was done without buffer insertion and template window simulation is more efficient than extrapolation.

• Korean Journal of Materials Research
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• v.27 no.11
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• pp.590-596
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• 2017

We demonstrated a CNT synaptic transistor by integrating 6,6-phenyl-C61 butyric acid methyl ester(PCBM) molecules as charge storage molecules in a polyimide(PI) dielectric layer with carbon nanotubes(CNTs) for the transistor channel. Specifically, we fabricated and compared three different kinds of CNT-based synaptic transistors: a control device with $Al_2O_3/PI$, a single PCBM device with $Al_2O_3/PI:PCBM$(0.1 wt%), and a double PCBM device with $Al_2O_3/PI:PCBM$(0.1 wt%)/PI:PCBM(0.05 wt%). Statistically, essential device parameters such as Off and On currents, On/Off ratio, device yield, and long-term retention stability for the three kinds of transistor devices were extracted and compared. Notably, the double PCBM device exhibited the most excellent memory transistor behavior. Pulse response properties with postsynaptic dynamic current were also evaluated. Among all of the testing devices, double PCBM device consumed such low power for stand-by and its peak current ratio was so large that the postsynaptic current was also reliably and repeatedly generated. Postsynaptic hole currents through the CNT channel can be generated by electrons trapped in the PCBM molecules and last for a relatively short time(~ hundreds of msec). Under one certain testing configuration, the electrons trapped in the PCBM can also be preserved in a nonvolatile manner for a long-term period. Its integrated platform with extremely low stand-by power should pave a promising road toward next-generation neuromorphic systems, which would emulate the brain power of 20 W.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.38 no.3
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• pp.205-210
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• 2001

In this paper, a novel compound mode logic based on the advantage of both CMOS logic and pass-transistor logic(PTL) is proposed. From the experimental results, the power-delay products of the compound mode logic is about 22% lower than that of the conventional CMOS logic, when we design a full adder. With the proposed logic, a high performance 32$\times$32-bit multiplier has been fabricated with 0.6um CMOS technology. It is composed of an improved sign select Booth encoder, an efficient data compressor based on the compound mode logic, and a 64-bit conditional sum adder with separated carry generation block. The Proposed 32$\times$32-bit multiplier is composed of 28,732 transistors with an active area of 1.59$\times$1.68 mm2 except for the testing circuits. From the measured results, the multiplication time of the 32$\times$32-bit multiplier is 9.8㎱ at a 3.3V power supply, and it consumes about 186㎽ at 100MHz.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.2
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• pp.323-329
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• 2002

This paper describes an efficient error-compensation technique for designing a low-error truncated Booth multiplier which produces an N-bit output from a two's complement multiplication of two N bit inputs by eliminating the N least-significant bits. Applying the proposed method, a truncated Booth multiplier for area-efficient and low-power applications has been designed, and its performance(truncation error, area) was analyzed. Since the truncated Booth multiplier does not have about half the partial product generators and adders, it results an area reduction of about 35％, compared with no-truncated parallel multipliers. Error analysis shows that the proposed approach reduces the average truncation error by approximately 60％, compared with conventional methods. A 16-b$\times$16-b truncated Booth multiplier core is designed on full-custom style using 0.35-${\mu}{\textrm}{m}$ CMOS technology. It has 3,000 transistors on an area of 330-${\mu}{\textrm}{m}$$\times$262-${\mu}{\textrm}{m}$ and 20-㎽ power dissipation at 3.3-V supply with 200-MHz operating frequency.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.7
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• pp.705-711
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• 2003

In this Paper, 2${\times}$100 $\mu\textrm{m}$ AlCaN/GaN HEMT's(on sapphire substrate) large signal model including thermal effect was extracted. An equation based empirical model was employed to make large signal model for convergence and high speed. Pulsed I-V measurement was performed to extract thermal resistance and capacitance. Power amplifiers with 9 mm and 15 mm AlCaN/GaN HEMTS were designed using scaled modeling results of 2${\times}$100 $\mu\textrm{m}$ device respectively. From comparisons between measured and simulated data, the model considering of thermal effects gave better agreement than without one. It demonstrates that thermal modeling must be performed for power amplifier that uses large size transistors.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.38 no.2
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• pp.38-49
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• 2001

This paper presents a new voltage down converter(VDC) using charge and discharge current adjustment circuitry that provides high frequency application. This VDC consist of a common driving circuit and compensation circuits: 2 sensors and each driving transistors for controlling gate current of driving transistor. These sensors are operated as adaptive biasing method with high speed and low power consumption. This circuit is designed with a $0.62{\mu}m$ N well CMOS technology. In H-spice simulation results, internal voltage is bounded ( IV, +0.6V) in proposed circuitry when load current rapidly increases and decreases during Gns between 0 and $200m{\Lambda}$. And the recovery time of internal voltage is about 7ns and 10ns when load current increases and decreases respectively. That is fast better than common driving circuit. Total power consumption is about 1.2mW.

• Ceramist
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• v.21 no.2
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• pp.4-18
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• 2018

Lastly, neuromorphic computing chip has been extensively studied as the technology that directly mimics efficient calculation algorithm of human brain, enabling a next-generation intelligent hardware system with high speed and low power consumption. Three-terminal based synaptic transistor has relatively low integration density compared to the two-terminal type memristor, while its power consumption can be realized as being so low and its spike plasticity from synapse can be reliably implemented. Also, the strong electrical interaction between two or more synaptic spikes offers the advantage of more precise control of synaptic weights. In this review paper, the results of synaptic transistor mimicking synaptic behavior of the brain are classified according to the channel material, in order of silicon, organic semiconductor, oxide semiconductor, 1D CNT(carbon nanotube) and 2D van der Waals atomic layer present. At the same time, key technologies related to dielectrics and electrolytes introduced to express hysteresis and plasticity are discussed. In addition, we compared the essential electrical characteristics (EPSC, IPSC, PPF, STM, LTM, and STDP) required to implement synaptic transistors in common and the power consumption required for unit synapse operation. Generally, synaptic devices should be integrated with other peripheral circuits such as neurons. Demonstration of this neuromorphic system level needs the linearity of synapse resistance change, the symmetry between potentiation and depression, and multi-level resistance states. Finally, in order to be used as a practical neuromorphic applications, the long-term stability and reliability of the synapse device have to be essentially secured through the retention and the endurance cycling test related to the long-term memory characteristics.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.1
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• pp.101-105
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• 2024

4H-SiC power metal-oxide-semiconductor field effect transistors (MOSFETs) have been developed to achieve lower specific-on-resistance (R_on,sp), and the gate oxides have been thermally grown. The poor channel mobility resulting from the high interface trap density (D_it) at the SiO₂/4H-SiC interface significantly affects the higher switching loss of the power device. Therefore, the development of novel fabrication processes to enhance the quality of the SiO₂/4H-SiC interface is required. In this paper, NO post-oxidation annealing (POA) by using the conditions of N₂ diluted NO at a high temperature (1,300℃) is proposed to reduce the high interface trap density resulting from thermal oxidation. The NO POA is carried out in various NO ambient (0, 10, 50, and 100% NO mixed with 100, 90, 50, and 0% of high purity N₂ gas to achieve the optimized condition while maintaining a high temperature (1,300℃). To confirm the optimized condition of the NO POA, measuring capacitance-voltage (C-V) and current-voltage (I-V), and time-of-flight secondary-ion mass spectrometry (ToF-SIMS) are employed. It is confirmed that the POA condition of 50% NO at 1,300℃ facilitates the equilibrium state of both the oxidation and nitridation at the SiO₂/4H-SiC interface, thereby reducing the D_it.