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Scalable AlGaN/GaN HEMTGs Model Including Thermal Effect  

김동기 (서울대학교 전기컴퓨터공학부)
김성호 (LG전자 CDMA 단말 연구소)
오재응 (한양대학교 전자컴퓨터공학부)
권영우 (서울대학교 전기컴퓨터공학부)
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Abstract
In this Paper, 2${\times}$100 $\mu\textrm{m}$ AlCaN/GaN HEMT's(on sapphire substrate) large signal model including thermal effect was extracted. An equation based empirical model was employed to make large signal model for convergence and high speed. Pulsed I-V measurement was performed to extract thermal resistance and capacitance. Power amplifiers with 9 mm and 15 mm AlCaN/GaN HEMTS were designed using scaled modeling results of 2${\times}$100 $\mu\textrm{m}$ device respectively. From comparisons between measured and simulated data, the model considering of thermal effects gave better agreement than without one. It demonstrates that thermal modeling must be performed for power amplifier that uses large size transistors.
Keywords
Thermal Resistance; Thermal Capacitance; Scaling; GaN HEMT; Power Amplifier; Pulsed I-V;
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