• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.59-64
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• 2021

System-in-package (SIP) technology using heterogeneous integration is becoming the key of next-generation semiconductor packaging technology, and the development of low temperature Cu bonding is very important for high-performance and fine-pitch SIP interconnects. In this study the low temperature Cu bonding and the anti-oxidation effect of copper using porous Ag nanolayer were investigated. It has been found that Cu diffuses into Ag faster than Ag diffuses into Cu at the temperatures from 100℃ to 200℃, indicating that solid state diffusion bonding of copper is possible at low temperatures. Cu bonding using Ag nanolayer was carried out at 200℃, and the shear strength after bonding was measured to be 23.27 MPa.

• Applied Chemistry for Engineering
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• v.18 no.6
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• pp.568-574
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• 2007

Crack-free dried gel monoliths of the composition $Li_2O1{\cdot}7Al_2O_3{\cdot}8.6SiO_2$ have been prepared as a precursor of transparent glass-ceramic by the hydrolysis and polycondensation of mixed metal alkoxides in solutions containing N,N-dimethylformamide as the drying control chemical additive, alcohols, and water. It was investigated that activation energy for gelation according to the variation of water concentration ranged from 13 to 14 kcal/mol. Only when the amount of water for gelation was 3 times higher than the stoichiometric amount, monolithic dry gels were successfully prepared after drying at $70{\sim}75^{\circ}C$ and at a rate of 0.1~0.3%/h. The specific surface area, the pore volume, the average pore diameters of dried gel at $180^{\circ}C$ were about $239.40m^2/g$, 0.001~0.03 mL/g, and $145.62{\AA}$, respectively. It showed that the dried monolithic gel had a porous body. The DTA curve had the first exothermic peak around $800^{\circ}C$ and the 2nd peak around $980^{\circ}C$, which may correspond to crystallization of the gel.

• Journal of the Mineralogical Society of Korea
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• v.28 no.2
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• pp.147-163
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• 2015

Chemical and mineralogical properties of coal ash samples from the nine thermal power plants of Korea were investigated to acquire basic data for estimating the potential of rare metal recovery. Chemical compositions of coal ash were consistent with those of average shale and foreign coal ashes. However, there were small differences between the metal contents of domestic anthracitic and imported bituminous coal ashes. Unburned coal particles were much abundant in the ash of domestic anthracitic coal. Chalcophile elements were relatively enriched in the fly ash compared to bottom ash. Silicate glass was the major component of coal ash with minor minerals such as quartz, illite (muscovite), mullite, magnetite, lime, and anhydrite. Al and Si were the major components of the glass with varying contents of Ca, Fe, K, and Mg. Glass occurred in a form of porous sphere and irregular pumace-like grain often fused with iron oxide spheres or other glass grains. Iron oxide spheres were fine intergrowth of fast-grown iron oxide crystals in the matrix of silicate glass. Chemical, microstructural, and mineralogical properties would guide successful rare metal recovery from coal ash.

• Applied Chemistry for Engineering
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• v.16 no.4
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• pp.527-532
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• 2005

Ionic polymer metal composites (IPMC) are soft polymeric smart materials having large displacement at low voltage in air and water. The polymeric electrolyte actuator consists of a thin and porous membrane and metal electrodes plated on both faces, in impregnation electro-plating method. The response and actuation of actuator are governed. Among many factors governing the activation and response of IPMC actuator, the surface electrode plays an important role. In this study, the well-designed modification of electrode surface was carried out in order to improve the chemical stability well as electromechanical characteristics of the IPMC actuator. We employed Ion Beam Assisted Deposition (IBAD) method to prepare the topologically homogeneous thin surface electrode. After roughing the surface of Nafion membrane in order to get a larger surface area, the IPMC was prepared by impregnation for electro-plating and re- coating on the surface through traditional chemical deposition, followed by an additional surface treatment with high conductive metals with IBAD. It was observed that our IPMC specimen shows the enhanced surface electrical properties as well as the improved actuation and response characteristics under applied electric field.

• Applied Chemistry for Engineering
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• v.33 no.1
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• pp.11-16
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• 2022

Metal-organic frameworks (MOFs) are porous materials with nano-sized pores. The degree of gas adsorption and pore size can be controlled according to types of metal ions and organic ligands. Many studies have been conducted on MOFs in the fields of gas storage and separation, and gas sensors. For rapid and quantitative gas adsorption/desorption analyses, it is necessary to form various MOF structures in uniform films on a sensor surface. In this review, some of representative direct methods for uniformly synthesizing MOFs such as MIL-53 (Al), ZIF-8, and Cu-BDC from anodized aluminum oxide, zinc oxide nanorods, and copper thin films, respectively on the surface of a microresonator are highlighted. In addition, the operation principle of quartz crystal microbalance and microcantilever, which are representative microresonators, and the interpretation of signals that change when gas is adsorbed to MOFs are covered. This is intended to enhance the understanding of gas adsorption/desorption analysis of MOFs using microresonators.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.3
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• pp.576-583
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• 2018

Silicon carbide is considered to be a potentially useful material for high-temperature electronic devices, as its band gap is larger than that of silicon and the p-type and/or n-type conduction can be controlled by impurity doping. Particularly, porous n-type SiC ceramics fabricated from ${\beta}-SiC$ powder have been found to show a high thermoelectric conversion efficiency in the temperature region of $800^{\circ}C$ to $1000^{\circ}C$. For the application of SiC thermoelectric semiconductors, their figure of merit is an essential parameter, and high temperature (above $800^{\circ}C$) electrodes constitute an essential element. Generally, ceramics are not wetted by most conventional braze metals,. but alloying them with reactive additives can change their interfacial chemistries and promote both wetting and bonding. If a liquid is to wet a solid surface, the energy of the liquid-solid interface must be less than that of the solid, in which case there will be a driving force for the liquid to spread over the solid surface and to enter the capillary gaps. Consequently, using Ag with a relatively low melting point, the junction of the porous SiC semiconductor-Ag and/or its alloy-SiC and/or alumina substrate was studied. Ag-20Ti-20Cu filler metal showed promise as the high temperature electrode for SiC semiconductors.

• Analytical Science and Technology
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• v.19 no.4
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• pp.301-308
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• 2006

Pitch-coated anatase $TiO_2$ typed was prepared by $CCl_4$ solvent mixing method with different mixing ratios. Since the carbon layers derived from pitch on the $TiO_2$ particles were porous, the pitch-coated $TiO_2$ sample series showed a good adsorptivity and photo decomposition activity. The BET surface area depends on the pitch contents, which was made by changing the mixing ratios of the pitch with the raw $TiO_2$. The SEM results present to the characterization of porous texture on the pitch-coated $TiO_2$ sample and pitch distributions on the surfaces for all the materials used. From XRD data, a weak and broad carbon peak of graphene with pristine anatase peaks were observed in the X-ray diffraction patterns for the pitch-coated $TiO_2$. The EDX spectra show the presence of C, O and S with strong Ti peaks. Most of these samples are richer in carbon and major Ti metal than any other elements. Finally, the excellent photocatalytic activity of pitchcoated $TiO_2$ with Uv/Vis spectra between absorbance and time could be attributed to the homogeneous coated pitch on the external surface by $CCl_4$ solvent method.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.37-41
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• 2012

The wafer level stacking with Cu-to-Cu bonding becomes an important technology for high density DRAM stacking, high performance logic stacking, or heterogeneous chip stacking. Cu CMP becomes one of key processes to be developed for optimized Cu bonding process. For the ultra low-k dielectrics used in the advanced logic applications, Ti barrier has been preferred due to its good compatibility with porous ultra low-K dielectrics. But since Ti is electrochemically reactive to Cu CMP slurries, it leads to a new challenge to Cu CMP. In this study Ti barrier/Cu interconnection structure has been investigated for the wafer level 3D integration. Cu CMP wafers have been fabricated by a damascene process and two types of slurry were compared. The slurry selectivity to $SiO_2$ and Ti and removal rate were measured. The effect of metal line width and metal density were evaluated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.301-301
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• 2003

In current study, Nanocomposites are reinforced with carbon nanofiber, carbon nanotube and SiC, etc. Since the nano reinforcements have the excellent mechanical, thermal and electrical properties compared with that of existing composites, it has lately attracted considerable attention in the various areas. Cu have been widely used as signal transmission materials for electrical electronic components owing to its high electrical conductivity. However, it's size have been limited to small ones due to its poor mechanical properties. Until now, strengthening of the copper alloy was obtained either by the solid solution and precipitation hardening by adding alloy elements or the work hardening by deformation process. Adding the alloy elements lead to reduction of electrical conductivity. In this aspect, if carbon nanofiber is used as reinforcement which have outstanding mechanical strength and electric conductivity, it is possible to develope Cu matrix nanocomposite having almost no loss of electric conductivity. It is expected to be innovative in electric conducting material market. The unidirectional alignment of carbon nanofiber is the most challenging task developing the cooer matrix composites of high strength and electric conductivity. In this study, the unidirectional alignment of carbon nanofibers which is used reinforced material are controlled by drawing process and align mechanism as well as optimized drawing process parameter are verified via numerical analysis. The materials used in this study were pure copper and the nanofibers of 150nm in diameter and of 10∼20$\mu\textrm{m}$ in length. The materials have been tested and the tensile strength was 75MPa with the elongation of 44% for the copper. it is assumed that carbon nanofiber behave like porous elasto-plastic materials. Compaction test was conducted to obtain constitutive properties of carbon nanofiber Optimal parameter for drawing process was obtained by analytical and numerical analysis considering the various drawing angles, reduction areas, friction coefficient, etc. The lower drawing angles and lower reduction areas provides the less rupture of co tube is noticed during the drawing process and the better alignment of carbon nanofiber is obtained.

• Korean Journal of Materials Research
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• v.14 no.9
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• pp.634-641
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• 2004

The photocatalytic performance of $TiO_2$ thin films coated on porous alumina balls using various aqueous $TiOCl_2$ solutions as starting precursors, to which 1.0 $mol\%$ transition metal ($Ni^{2+},\;Cr^{3+},\;Fe^{3+},\;Nb^{3+},\;and\;V^{5+}$) chlorides had been already added, has been investigated, together with characterizations for $TiO_2$ sols synthesized simultaneously in the same autoclave through hydrothermal method. The synthesized $TiO_2$ sols were all formed with an anatase phase, and their particle size was between several nm and 30 nm showing ${\zeta}-potential$ of $-25{\sim}-35$ mV, being maintained stable for over 6 months. However, the $TiO_2$ sol added with Cr had a much lower value of -potential and larger particle sizes. The coated $TiO_2$ thin films had almost the same shape and size as those of the sol. The pure $TiO_2$ sol showed the highest optical absorption in the ultraviolet light region, and other $TiO_2$ sols containing $Cr^{3+},\;Fe^{3+}\;and\;Ni^{2+}$ showed higher optical absorption than pure sol in the visible light region. According to the experiments for removal of a gas-phase benzene, the pure $TiO_2$ film showed the highest photo dissociation rate in the ultraviolet light region, but in artificial sunlight the photo dissociation rate of $TiO_2$ coated films containing $Cr^{3+},\;Fe^{3+}\;and\;Ni^{2+}$ was measured higher together with the increase of optical absorption by doping.