• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 추계학술대회 논문집
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• pp.131-132
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• 2009

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1455-1458
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• 2008

Amorphous silicon (a-Si:H) thin-film transistors (TFTs) are fabricated on flexible organic polymer foil substrates. As-fabricated performance, electrical bias-stability at elevated temperatures, electrical response under mechanical flexing, and prolonged mechanical stability of the TFTs are studied. TFTs made on plastic at ultra low process temperatures of $150^{\circ}C$ show initial electrical performance like TFTs made on glass but large gate-bias stress instability. An abnormal saturation of the instability against operation temperature is observed.

• 폴리머
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• 제33권6호
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• pp.525-529
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• 2009

우수한 성능의 2층 연성동박적층판(이하 FCCL)을 제조하기 위해서는 동박과 폴리이미드 사이에서 높은 접착력이 요구된다. 이를 위해 이종 재료로 인한 두 계면 사이의 접착력을 향상시키기 위해서는 일반적으로 기능성 실란커플링제가 사용된다. 본 연구에서는 압연동박과 폴리이미드 사이의 접착력 향상과 이미드화를 위한 고온의 열처리 조건에서도 안정한 새로운 형태의 실란커플링제를 합성하였다. 또한, 합성된 실란커플링제를 압연동박에 처리하였을 때, 표면처리제의 농도에 따른 표면변화를 관찰하였으며, 이로 인해 발생되는 접착력 변화를 확인하기 위해서 2층 FCCL을 제조하여 $90^{\circ}$ peel test를 통해 관찰하였다. 그리고, 두 종류의 폴리이미드를 이용한 FCCL에서 실란 커플링제가 접착력에 미치는 영향을 확인하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.217-218
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• 2007

Aluminum 분말과 고분자를 혼합하여 고분자-금속 복합재료(polymer-metal composite)를 만들어 copper foil과 기판의 접착력을 평가하였다. Tape casting 방법을 이용하여 sheet 만들고 vacuum lamination으로 PCB(Printed Circuit Board)기판을 제조한 후 포토공정으로 peel strength pattern을 형성하였으며, 본 연구에서는 최적의 aluminum 조건을 찾기 위하여 압력, 온도, copper foil의 표면 상태와 silane 표면 코팅에 따른 aluminum-polymer복합재료의 peel strength의 변화를 확인하였다. 최적의 조건은 silane 표면 코팅 처리를 한 aluminum 분말로 $210^{\circ}C$에서 $9.7kg/cm^2$ 압력으로 matte면의 돌기 크기가 크며, 응집이 잘 되어있는 copper foil을 사용하여 13.89N의 우수한 peel strength를 구현 할 수 있었다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집C
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• pp.498-501
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• 2001

Blanking is one of the most frequently used processes in sheet metal forming. In this paper, attention is paid to the blanking simulation of aluminium foil with $20{\mu}m$ thickness which is used an anode in lithium-ion polymer battery. In order to study the shearing mechanism for the metallic foil, finite element analysis with Crockroft and Latham fracture criterion was performed. The objective of the present work is to evolve a methodology to obtain the optimum punch-die clearance for a given aluminium foil by the simulation of the blanking process using a general purpose FEM code.

• 한국정밀공학회지
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• 제33권3호
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• pp.231-234
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• 2016

Pouch film is manufactured by laminating aluminum foil, polyamide film and polypropylene film with an adhesive or extrusion resin. However, a surface treatment is required for the aluminum because bonding does not occur easily between the aluminum foil and the polymer film. Thus, for this study, surface treatment experiments were performed in order to confirm the effect on adhesion strength. First, a variety of surface treatment solutions were coated on aluminum foil, and contact angle and surface morphology analysis was carried out for the surface-treated aluminum. For lamination of the surface-treated aluminum foil with polyamide film, a polyurethane base adhesive was prepared for the adhesive strength test specimens. The adhesive strength between the aluminum foil and the polyamide film of the resulting specimens was measured (UTM). With such an experiment, it was possible to evaluate the effect on adhesive strength of the various surface treatments.

• 폴리머
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• 제36권3호
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• pp.268-274
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• 2012

실란 커플링제를 사용하여 알루미나 나노 입자의 표면을 처리하였다. 표면을 개질한 나노 입자를 in-mold decoration(IMD) 포일의 경질 코팅 층에 도입하여 표면 경도 및 내마모성을 중심으로 도막의 물성 변화를 평가하였다. 전자빔(electron beam, EB) 조사가 IMD 포일을 구성하는 color layer 및 anchor layer에 미치는 영향을 색도변화와 cross-cut tape 시험을 통하여 평가하였다. 또한 EB 조사 온도에 따른 경화 거동을 표면 물성 변화 평가 및 Fourier transform infrared(FTIR) spectroscopy 관찰을 통해 정량적으로 분석함으로써 EB 경화 공정의 실용화에 필요한 데이터베이스를 구축하였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.19-25
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• 2000

Dielectric polymer films produced from benzocyclobutene (BCB) formulations (CYCLOTENE＊ family resins) are known to possess many desirable properties for microelectronic applications; for example, low dielectric constant and dissipation factor, low moisture absorption, rapid curing on hot plate without reaction by-products, minimum shrinkage in curing process, and no Cu migration issues. Recently, BCB-based products for thick film applications have been developed, which exhibited excellent dissipation factor and dielectric constant well into the GHz range, 0.002 and 2.50, respectively. Derived from these properties, the applications are developed in: bumping/wafer level packaging, Ga/As chip ILD, optical waveguide, flat panel display, and lately in BCB-coated Cu foil for build-up board. In this paper, we review the relevant properties of BCB, then the application areas in bumping/wafer level packaging and BCB-coated Cu foil for build-up board.

• ETRI Journal
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• 제39권6호
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• pp.874-879
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• 2017

This paper challenges the fabrication of a thin film energy storage device on a flexible polymer substrate specifically by replacing most commonly used metal foil current collectors with coated current collectors. Mass-manufacturable spray-coating technology enables the fabrication of two different half-cell electric double layer capacitors (EDLC) with a spray-coated silver paste current collector and a Ni foil current collector. The larger specific capacitances of the half-cell EDLC with the spray-coated silver current collector are obtained as 103.86 F/g and 76.8 F/g for scan rates of 10 mV/s and 500 mV/s, respectively. Further, even though the half-cell EDLC with the spray-coated current collector is heavier than that with the Ni foil current collector, smaller Warburg impedance and contact resistance are characterized from Nyquist plots. For the applied voltages ranging from -0.5 V to 0.5 V, the spray-coated thin film energy storage device exhibits a better performance.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.914-917
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• 2005

The paper proposes a new sonic resonance test for a dynamic elastic constant measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI)and Euler-Bernoulli equation. Previous measurement technique of dynamic elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The TA-ESPI dynamic elastic constant measurement technique is able to give high accurate elastic modulus of materials through a simple experiment and analysis.