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The Effect of Functionalized Organosilane Coupling Agent on the Adhesion Properties of 2 Layer Flexible Copper Clad Laminate  

Park, Jin-Young (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Lim, Jae-Phil (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Kim, Yong-Seok (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Jung, Hyun-Min (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Lee, Jae-Heung (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Ryu, Jong-Ho (ILJIN Copper Foil Co., Ltd., Jochiwon Factory Wolsan Industrial Complex)
Won, Jong-Chan (Information & Electronics Polymer Research Center, Korea Research Institute of Chemical Technology)
Publication Information
Polymer(Korea) / v.33, no.6, 2009 , pp. 525-529 More about this Journal
Abstract
In order to manufacture 2-layer flexible copper clad laminate (FCCL) s having the excellent performance high adhesion properties between copper foil and polyimide film are required. Silane coupling agents with specific functional groups as an adhesion promoter are generally used to enhance the adhesion. In our study, we synthesized a novel silane coupling agent for increasing the adhesive property between copper layer and polyimide layer. The surface morphology of rolled copper foil, as a function of the concentrations of the coated silane coupling agent, was fully characterized. As fabricated 2-layer FCCL, we observed that adhesive properties were changed by the surface morphology and we confirmed that the novel silane coupling agent affects adhesive properties in FCCL with two types of poly (amic acid)s.
Keywords
2-layer FCCL; adhesion; polyimide; silane coupling agent;
Citations & Related Records
Times Cited By KSCI : 2  (Citation Analysis)
Times Cited By Web Of Science : 1  (Related Records In Web of Science)
Times Cited By SCOPUS : 1
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