• Applied Chemistry for Engineering
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• v.23 no.2
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• pp.157-163
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• 2012

Using six kinds of epoxy acrylates and a conductive carbon black, photosensitive resistor pastes were fabricated and then their developability in alkaline aqueous solution and the resistance values after thermal curing were evaluated. In order to impart the photocurability by UV exposure and the developability on alkaline solution, epoxy acrylate oligomers with carboxyl group, acrylate monomers, a photoinitiator and so forth were used. In addition, an organic peroxide was added into the paste to get a thermally curable composition. As a result, some of the pastes were not developed depending on the kinds of oligomers and, in the developed pastes, the measured resistance showed the different values depending on their compositions, even though they contain the same amount of carbon black. Finally, the optimum oligomer was selected and then, by adjusting the amount of carbon black, the kind of monomer and the curing temperature, the photosensitive resistor paste composition which showed the sheet resistance of about 0.5 $k{\Omega}/sq.$ could be obtained.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Textile Coloration and Finishing
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• v.34 no.3
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• pp.157-164
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• 2022

This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.

• Polymer(Korea)
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• v.28 no.1
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• pp.77-85
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• 2004

It has been widely used ultra high molecular weight polyethylene (UHMWPE) for the biomaterials due to its excellent mechanical properties and biocompatibility. In the case of blend of UHMPE with another polymeric biomaterials, however, UHMWPE might have low blend compatibility due to surface inertness. In this study, in order to improve the mechanical properties of poly(methyl methacrylate) (PMMA) bone cement by means of the impregnation of UHMWPE powder, we developed the novel surface modification method by the mixture of methyl methacrylate (MMA) and xylene. We investigated the variation of composition of MMA/xylene. It was confirmed by the analysis of Fourier transform infrared-attenuated total reflectance, scanning electron microscope, universal transverse mercator, and digital thermometer. The maximum mechanical strength of surface modified UHMWPE powder impregnated PMMA bone cement compound was observed the ratio of 1 : 1 (v/v％) MMA/xylene. Also its curing temperature decreased from 103 $^{\circ}C$ to 58 ∼ 73 $^{\circ}C$ The mechanism of surface modification of UHMWPE powder by the mixture of MMA/xylene has been proposed.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Polymer(Korea)
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• v.30 no.3
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• pp.238-246
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• 2006

The aim of this study is to enhance the flame retardancy by the synergism effect of chlorine and phosphorus groups. The flame-retardant polyurethane coatings containing chlorine and phosphorus compounds were synthesized. After synthesizing the intermediate products of tetramethylene bis (orthophosphate) (TMBO) and neohexanediol trichlorobenzoate (TBA-adduct), the condensation polymerization was performed with four different monomers of two intermediates, 1,4-butanediol, and adipic acid to obtain four-component copolymer(TTBA). The two-component flame-retardant polyurethane coatings (TTBA-10C/HDI-trimer=TTHD-10C, TTBA-20C/HDI-trimer=TTHD-20C, TTBA-30C/HDI trimer=TTHD-30C) were obtained by curing reaction at room temperature with the synthesized TTBAs and hexamethylene diisocyanate (HDI)-trimer as a curing agent. The obtained TTHDs were made into coating samples and used as test samples for various physical properties. The physical properties of the flame-retardant coatings containing chlorine and phosphorus groups were generally inferior to those containing only phosphorus group. Flame retardancy was tested by vortical and horizontal combustion method, and $45^{\circ}$ Meckel burner method. Since the retardancy of flame-retardant coatings containing chlorine and phosphorus groups was better than that containing only phosphorus group, it could be concluded that the retardancy by the synergism effect of chlorine and phosphorus groups exhibited.

• Journal of the Korea Concrete Institute
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• v.15 no.4
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• pp.549-556
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• 2003

Various researches on the application of polymer dispersions to the cement mortar and concrete have been practised in many countries like America, Japan and Germany and so on because of high performance and good modification effect of these. In this study, SBR, Polymer dispersion that widely used in situ is employed that the self-flowability may be induced in the cemen mortar. In order to comprehend and investigate the modification of cement mortar with self-flowability by SBR and properties and fracture mode of adhesive strength in tension of that, experimental parameter was set as SBR solid-Cement ratio(S/C) and Cement:Fine aggregate(C:F) and the experiments such as Unit weight, Flow, Consistency change, Crack resistance and Segregation that inform on the general properties have been done. In addition of that, Adhesion in tension is measured with a view to comprehending the properties and fracture mode in tensile load. Consistency change of cement mortar modified by SBR did grow better as the ratio of SBR solid-Cement increased and was much superior to that of resin based flooring such as polyurethane and epoxy which recorded the loss of consistency in 90min. after mixing. Adhesive strength in tension increased with continuity in the curing age and showed the maximum in case of C:F=1:1 and S/C=20%. As the increase of curing age, the fracture mainly happened in the concrete substrate and the interface between the specimen and concrete substrate.

• Polymer(Korea)
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• v.38 no.6
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• pp.774-781
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• 2014

Acetylenic or phenylethynyl end-capped polyisoimide oligomers ($M_w$ 2500 g/mol, 5000 g/mol) based upon 4,4'-diamino diphenyl ether (4,4'-ODA)/4,4'-oxydiphthalic anhydride (ODPA) and 4,4'-ODA/3,3',4,4'-benzophenone tetracarboxylic acid dianhydride (BTDA) were synthesized by using 4-ethynylaniline (4-EA) or 4-phenylethynyl phthalic anhydride (4-PEPA) as an end capper. The incorporation of ethynyl groups were confirmed by FTIR spectroscopy. The isomerization temperature was influenced by molecular weight as well as the backbone structure of polyisoimides oligomers. Thus, polyisoimide oligomers with molecular weight of 2500 g/mol was found to be imidized at temperature $10^{\circ}C$ lower than that for the oligomers with molecular weight of 5000 g/mol. The crosslinking reaction of ethynyl groups occurred at a higher temperature than that for the isoimide/imide isomerization reaction. These two reactions were totally or partially overlapped on the DSC thermograms for the polyisoimide oligomer end-capped with 4-EA. Kinetics of thermal imidization and crosslinking reactions for the 4,4'-ODA/ODPA polyisoimide oligomers end-capped with 4-PEPA were investigated by performing dynamic DSC experiments at heating rate of $10^{\circ}C/min$. The activation energy and pre-exponential factors were 141 kJ/mol and $1.45{\times}10^{13}min^{-1}$ for the imidization reaction and 177 kJ/mol and $2.90{\times}10^{13}min^{-1}$ for the crosslinking reaction, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.29-35
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• 2017

In this paper, we investigated a manufacturing process of metal micro-wire interconnection on submillimeter diameter catheter. Over the years, flexible electronic researches have focused on flexible plane polymer substrate and micro electrode manufacturing on its surface. However, a curved polymer substrate, such as catheter, is very important for medical application. Among many catheters, importance of submillimeter diameter steerable catheter is increasing to resolve the several limitations of neurosurgery. Steering actuators have been researched for realizing the steerable catheter, but there is no research about practical wiring for driving these actuators. Therefore we developed a new manufacturing process for metal micro-wire interconnection on submillimeter diameter catheter. We designed custom jigs for alignment of the metal micro-wires on the submillimeter diameter catheter. An UV curing system and commercial products were used to reduce the manufacturing time and cost; Au micro-wire, UV curable epoxy, UV lamp, and submillimeter diameter catheter. The assembled catheter was characterized by using an optical microscope, a resistance meter, and a universal testing machine.

• Polymer(Korea)
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• v.24 no.3
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• pp.389-398
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• 2000

Transparent, abrasion resistant coatings with 4~13 ${\mu}{\textrm}{m}$ thickness were prepared by spin-coating on polycarbonates with organic/inorganic hybrid solutions, followed by UV curing and heat treatment at 12$0^{\circ}C$ for 12 hours. The coating solutions were composed of inorganic phase and organic phase in 0:100, 20:80, 30:70, 50:50, 80:20 wt% ratios, respectively, mixed with photoinitiator, senaitizer and surfactant. The inorganic phase was formed by sol-gel reaction of TEOS and silane coupling agent MPTMS in 1 : 2 or 2 : 1 molar ratios, the organic phase consisted of difunctional urethane acrylate oligomeric resin, multifunctional acrylate TMPTA and HDDA in 4 : 3 : 3 wt% ratio. The coating systems were investigated by FT-IR, $^{29}$ Si-NMR spectra. In addition, TGA/DSC for thermal analysis and SEM, AFM observation for coated surface were examined. Gererally, the homogeneity of phases, the surface smoothness of coating and abrasion resistance were improved with the higher content of inorganic component. Namely, coating system with below 10 $\AA$ surface roughness and T$_{g}$ of 15$0^{\circ}C$ showed only 10% decrease in light transmittance after abrasion test, whereas uncoated polycarbonate substrate exhibited 46% decrease..