Browse > Article
http://dx.doi.org/10.7317/pk.2014.38.6.774

Synthesis and Curing Behaviors of Polyisoimide Oligomers with Ethynyl End Groups  

Choi, Seok Woo (School of Chemical Engineering, Sungkyunkwan University)
Kim, Bo Ock (School of Chemical Engineering, Sungkyunkwan University)
Kim, Ji-Heung (School of Chemical Engineering, Sungkyunkwan University)
Nam, Sung Woo (School of Chemical Engineering, Sungkyunkwan University)
Jeon, Boong Soo (School of Chemical Engineering, Sungkyunkwan University)
Kim, Young Jun (School of Chemical Engineering, Sungkyunkwan University)
Publication Information
Polymer(Korea) / v.38, no.6, 2014 , pp. 774-781 More about this Journal
Abstract
Acetylenic or phenylethynyl end-capped polyisoimide oligomers ($M_w$ 2500 g/mol, 5000 g/mol) based upon 4,4'-diamino diphenyl ether (4,4'-ODA)/4,4'-oxydiphthalic anhydride (ODPA) and 4,4'-ODA/3,3',4,4'-benzophenone tetracarboxylic acid dianhydride (BTDA) were synthesized by using 4-ethynylaniline (4-EA) or 4-phenylethynyl phthalic anhydride (4-PEPA) as an end capper. The incorporation of ethynyl groups were confirmed by FTIR spectroscopy. The isomerization temperature was influenced by molecular weight as well as the backbone structure of polyisoimides oligomers. Thus, polyisoimide oligomers with molecular weight of 2500 g/mol was found to be imidized at temperature $10^{\circ}C$ lower than that for the oligomers with molecular weight of 5000 g/mol. The crosslinking reaction of ethynyl groups occurred at a higher temperature than that for the isoimide/imide isomerization reaction. These two reactions were totally or partially overlapped on the DSC thermograms for the polyisoimide oligomer end-capped with 4-EA. Kinetics of thermal imidization and crosslinking reactions for the 4,4'-ODA/ODPA polyisoimide oligomers end-capped with 4-PEPA were investigated by performing dynamic DSC experiments at heating rate of $10^{\circ}C/min$. The activation energy and pre-exponential factors were 141 kJ/mol and $1.45{\times}10^{13}min^{-1}$ for the imidization reaction and 177 kJ/mol and $2.90{\times}10^{13}min^{-1}$ for the crosslinking reaction, respectively.
Keywords
polyisoimide; polyimide; ethynyl; curing; kinetics;
Citations & Related Records
연도 인용수 순위
  • Reference
1 T. Seckin, N. Kivilcim, and S. Koytepe, Polym.-Plast. Technol., 52, 1368 (2013).   DOI
2 Y. Zhang, J. Shen, Q. Zhang, Z. Xu, Yeung, W. K. Kelvin, and C. Yi, Sci. Adv. Mater., 6, 44 (2014).   DOI
3 A. Pasahan, "Sensor Application of Polyimide", in High Performance Polymers-Polyimides Based: From Chemistry to Applications, M. J. M. Abadie, Editor, InTech, Rijeka, Croatia, p 199 (2012).
4 Y. J. Kim, T. E. Glass, G. D. Lyle, and J. E. McGrath, Macromolecules, 26, 1344 (1993).   DOI   ScienceOn
5 M. Ree, D. Y. Yoon, and W. Volksen, J. Polym. Sci.; Part B: Polym. Phys., 29, 1203 (1991).
6 L. W. Frost and J. Kesse, J. Polym. Sci.; Part A: Polym. Chem., 11, 609 (1967).
7 Y. J. Kim, J. H. Kim, and J. C. Won, High Perform. Polym., 17, 19 (2005).
8 Y. Echigo, S. Okamoto, and N. Miki, J. Polym. Sci.; Part A: Polym. Chem., 35, 3335 (1997).   DOI
9 H. Seino, O. HAba, M. Ueda, and A. Mochizuki, Polymer, 40, 551(1999).   DOI
10 A. Mochizuki, K. YAmada, M. Ueda, and R. Yokota, Chem. Lett., 4, 333 (1997).
11 K. Kurita, Y. Suzuki, T. Enari, M. Kikuchi, S. Nishimura, and S. Ishii, Macromolecules, 28, 1801 (1995).   DOI
12 B. Liu, M. Ji, F. Lin, and S. Yang, High Perform. Polym., 25, 225 (2013).   DOI
13 C. Gong, Q. Luo, Y. Li, M. Giotto, N. E. Cipollini, Y. Zhiwei, R. A. Weiss, and D. A. Scola, J. Polym. Sci.; Part A: Polym. Chem., 48, 3950 (2010).   DOI
14 M. E. Wright, D. A. Schorzman, and A. M. Berman, Macromolecules, 35, 6550 (2002).   DOI
15 Y. J. Kim, G. I. Son, and J. H. Kim, Polym. Int., 51, 379 (2002).   DOI
16 R. W. Snyder and C. W. Sheen, Appl. Spectrosc., 42, 655 (1988).   DOI   ScienceOn
17 H. E. Kissinger, Anal. Chem., 29, 1702 (1957).   DOI
18 J. H. Flynn and L. A. Wall, J. Polym. Sci.; Part C: Polym. Lett., 4, 323 (1996).
19 F. W. Mercer, V. N. Reddy, and M. T. Mckenzie, High Perform. Polym., 7, 237 (1995).   DOI