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http://dx.doi.org/10.5764/TCF.2022.34.3.157

Improvement of Heat Resistant of Adhesion between m-Aramid Sheet and Metal Materials using Epoxy/Phenolic Resin  

Kang, Chan Gyu (Department of Civil Safety Environmental Engineering, Hankyong National University)
Chae, Ju Won (Startex)
Choi, Seung Jin (HANYANG ECO TEX Co., Ltd, Research & Development Department)
Lee, Ji Su (Department of Fiber System Engineering, Yeungnam University)
Kim, Sam Soo (Department of Fiber System Engineering, Yeungnam University)
Lee, Sang Oh (Department of Clothing and Fashion, Yeungnam University)
Lee, Jaewoong (Department of Fiber System Engineering, Yeungnam University)
Publication Information
Textile Coloration and Finishing / v.34, no.3, 2022 , pp. 157-164 More about this Journal
Abstract
This study tried to analyze the heat resistance properties by blending epoxy and phenolic resin in a certain ratio, and to analyze the adhesive properties at the time of metal-polymer hetero-adhesion by applying Epoxy-phenolic resin between a silicon steel sheet and m-aramid sheet, the viscosity, adhesive peel strength, and adhesive cross section were measured using a rotational rheometer, a tensile tester(UTM), and a field emission scanning electron microscopy(FE-SEM). The thermal stability and heat resistance were confirmed by measuring the mass loss according to the temperature increase using Thermogravimetric analysis(TGA). After blending with epoxy and Phenolic resin(1:0.25 ratio) curing at 110℃ for 10 min, high adhesive strength was improved more than 40% compared to the adhesive strength using epoxy alone. When the space between the silicon steel sheet and m-aramid sheet, which is created during curing of the E-P blend, is cured with a slight weight, it is possible to control the empty space and improve adhesion.
Keywords
hetero-adhesion; epoxy; phenolic resin; m-aramid sheet; silicon steel sheet;
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