• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2011.05a
• /
• pp.184-185
• /
• 2011

In this study, in order to obtain a high reflectivity for the LED lead frame, tin dip coating and tin plating were conducted respectively, and wettability of LED lead frame with tin solder also was tested by wetting balance tester. A Cu sheet was plated in Cu brighten electroplating bath and followed by immersion in a Sn electro-less plating bath [1]. On the other hand, in the dip coating process, a Cu sheet was dipped into molten tin. In the progress of wetting test, besides wetting balance curve, the maximum measured force($F_m$), the maximum withdrawal force($F_w$) and zero-cross time($t_0$) were obtained in various temperatures. With the maximum withdrawal force, the surface tension was calculated at different temperatures. The Cu sheet plated with bright Cu and Sn show a silver bright property while that of Cu dipped with Sn possessed a high reflectance density of 1.34GAM at $270^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.97-104
• /
• 2016

In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.

• Journal of the Korean Society of Clothing and Textiles
• /
• v.23 no.5
• /
• pp.694-702
• /
• 1999

By using commercial available electromagnetic interference (EMI) shielding fabrics, EMI shielding effectiveness(SE) and the physical properties were investigated. Thirteen specimens were chosen six fabrics were non-electrolytic plated with Cu, six plated with Cu+Ni and one plated with Ni, SE was measured by RF Impedance Analyzer HP4291A(Hewlett Co, Ltd)at the frequency of 100MHz-1.8GHz. The results showed that the commercial EMI shielding fabrics provided SE values over 30dB at the frequency of 100MHz-1.8GHz. Fabrics plated with Cu showed more effective shielding than those plated with Ni. The thickness of coating and fabric count were also influential factors on SE. Tensile properties were acceptable for lining fabrics but water vapor transport properties indicated that the better treatment condition were suggested to improve comfort properties.

• Korean Journal of Metals and Materials
• /
• v.50 no.8
• /
• pp.563-568
• /
• 2012

The wetting property and reflectivity of Sn-3.5Ag solder which was dip coated on a LED lead frame were investigated. The wettability of molten solder on Cu substrate was evaluated by the wetting balance tester, and surface tension was calculated from maximum withdrawal force and withdrawal time. Temperature of the molten solder in a bath was varied in the range of $250-290^{\circ}C$. With increasing temperature, the surface tension decreased a little. The reflectivity of Sn-3.5Ag coated on a substrate became a little lower than the highest current LED lead frame reflectivity.

• Korean Chemical Engineering Research
• /
• v.45 no.2
• /
• pp.124-132
• /
• 2007

This work investigated a fabrication way of stable platinized Ti electrode and evaluated the electrochemical characteristics of the Sn-modified platinized Ti electrode in nitrate solution. A Pt electro-plating way to form some open special clearances within the Pt coating layer on etched Ti substrate was very important to remove effectively the residual contaminate due to plating solution out of the fabricated electrode surface and to maximize the actual electrode surface area contacting solution. Both boiling and electro-cleaning processes of the fabricated electrode was essential to obtain a stable platinized-Pt electrode with reproducible and stable surface property which was necessary for the correct evaluation of Sn coverage on the electrode. The electro-cleaning caused a morphology change of the platinized Ti electrode surface with some downy hair-like polyps formed during the deposition disappearing, which made the electrode stable. The Sn-modified platinized Ti electrode in this work showed the best electro-activity for nitrate reduction, when it was fabricated through the Pt electro-plating of about 30 minutes.

• Journal of Powder Materials
• /
• v.27 no.1
• /
• pp.25-30
• /
• 2020

Recently, the amount of heat generated in devices has been increasing due to the miniaturization and high performance of electronic devices. Cu-graphite composites are emerging as a heat sink material, but its capability is limited due to the weak interface bonding between the two materials. To overcome these problems, Cu nanoparticles were deposited on a graphite flake surface by electroless plating to increase the interfacial bonds between Cu and graphite, and then composite materials were consolidated by spark plasma sintering. The Cu content was varied from 20 wt.% to 60 wt.% to investigate the effect of the graphite fraction and microstructure on thermal conductivity of the Cu-graphite composites. The highest thermal conductivity of 692 W m^-1K^-1 was achieved for the composite with 40 wt.% Cu. The measured coefficients of thermal expansion of the composites ranged from 5.36 × 10^-6 to 3.06 × 10^-6K^-1. We anticipate that the Cu-graphite composites have remarkable potential for heat dissipation applications in energy storage and electronics owing to their high thermal conductivity and low thermal expansion coefficient.

• Korean Journal of Metals and Materials
• /
• v.49 no.12
• /
• pp.937-944
• /
• 2011

Studies have been carried out in order to reduce fuel-cladding chemical interaction (FCCI) behavior of metallic fuel in sodium-cooled fast reactors (SFR) using an electroplating technique. A $20{\mu}m$ thick Cr layer has been plated by the electrochemical method in the Sargent bath over the HT9 (12Cr-1Mo) clad material and diffusion couple tests of the U-10Zr metallic fuel as well as the rare earth alloy (70Ce-29La) have been conducted. The results show that the Cr plating can prevent FCCI behavior along the fuel-clad interface. However, cracks developed through the thickness during plating, which resulted in the migration of some fuel constituents. Variation of bath temperature, application of pulse current, and post heat treatment have been conducted to control such cracks. We found out that some conditions like the pulse current and the post heat treatment enhanced the layer property by reducing the internal cracks and improving the diffusion couple test.

• Current Photovoltaic Research
• /
• v.4 no.4
• /
• pp.140-144
• /
• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• Corrosion Science and Technology
• /
• v.10 no.4
• /
• pp.131-135
• /
• 2011

The demands of high-strength steel have been steadily increased to reduce the weight of vehicles. Although the TRIP steel has been the promising candidate material for the purpose, high strength hinders the application due to the susceptibility to hydrogen delayed fracture in the corrosive environment. Moreover, the testing method was not specified in the ISO standards. In this work, the test method to evaluate the susceptibility of hydrogen delayed fracture was studied by slow strain rate testing technique. The four test experimental parameters were studied : strain rate, hydrogen charging time, holding time after hydrogen charging, and holding time after cadmium plating. The steel was fractured by hydrogen in case the strain rate was in the range of $1{\times}10^{-4}{\sim}5{\times}10^{-7}/sec$. It was confirmed that the slow strain rate test is effective method to evaluate the susceptibility to hydrogen delayed fracture. The holding time over 24 hrs after hydrogen charging, nullified the hydrogen effect, that is, the specimen was no more susceptible to hydrogen after 24 hrs even though the specimen was fully hydrogen-charged. Moreover, cadmium electroplating could not prevent from diffusing out the hydrogen from the steel in the experiment. The effective experimental procedures were discussed.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.3
• /
• pp.447-451
• /
• 1999

Silver has the highest electrical conductivity of all metals and consequently this property is an attractive feature which makes it a leading candidate for use in electronic devices. The research conducted was focused primarily on the development of a process for obtaining a deposited silver-coating onto alumina, for applications related to electrical-conducting devices and, ancillarily, catalysts. Alumina balls and plane substrates were utilized for the investigation. The coating process employed an aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives-an activator which would be expected to promote good deposition-characteristics onto the (dielectric) substrate and an inhibitor which would obviate homogeneous reduction (precipitation) of silver was observed when the activator-containing silver-electrolyte reductant constituents were combined. However, the silver-electrolyte/reductant system with inhibitor could be employed (at 8$0^{\circ}C$) to achieve a viable (subject to future research optimization) coating on alumina. The influence of the processing temperature on the deposition process was delineated during the course of the research. The morphology of the deposited-silver on the alumina balls was assessed by SEM imaging. A tape-peel test was employed, with the plane substrates, to semi-quantitatively characterize the adhesion to the alumina.