• 한국전기전자재료학회논문지
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• 제19권9호
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• 한국기계가공학회지
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• 제18권3호
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• pp.49-58
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• 2019

Automatic transmissions are standard equipment in most automotive vehicles because they provide smooth speed shifting and a compact design with multiple speed ratios. Their structure consists mainly of planetary gear sets as power-transmitting devices and brakes and clutches as shifting devices. Several forward and one reverse speed ratios are achieved by actuating shifting devices to connect gears, input and output shafts, and the transmission case. In the development of a new transmission, kinematic configurations reflecting the transmission concept design are required, and the ability of the new concept design to be assembled without any interference among the connections must be demonstrated. In this study, an assemblability analysis of the kinematic configurations of a Ravigneaux-type automatic transmission was conducted with an assemblable example of an 8-speed Ravigneaux-type automatic transmission.

• Transactions on Electrical and Electronic Materials
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• 제14권2호
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• pp.63-66
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• 2013

This paper describes the highly productive process technologies of microprobe arrays, which were used for a probe card to test a Dynamic Random Access Memory (DRAM) chip with fine pitch pads. Cantilever-type microprobe arrays were fabricated using conventional micro-electro-mechanical system (MEMS) process technologies. Bonding material, gold-tin (Au-Sn) paste, was used to bond the Ni-Co alloy microprobes to the ceramic space transformer. The electrical and mechanical characteristics of a probe card with fabricated microprobes were measured by a conventional probe card tester. A probe card assembled with the fabricated microprobes showed good x-y alignment and planarity errors within ${\pm}5{\mu}m$ and ${\pm}10{\mu}m$, respectively. In addition, the average leakage current and contact resistance were approximately 1.04 nA and 0.054 ohm, respectively. The proposed highly productive microprobes can be applied to a MEMS probe card, to test a DRAM chip with fine pitch pads.

• 제어로봇시스템학회논문지
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• 제14권3호
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• pp.236-241
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• 2008

This paper presents a method to recognize the plane regions for movement of walking robots. When the autonomous agencies using stereo camera or laser scanning sensor is under unknown 3D environment, the mobile agency has to detect the plane regions to decide the moving direction and perform the given tasks. In this paper, we propose a very fast method for plane detection using normal vector of a triangle by 3 vertices defined on a small circular region. To reduce the effect of noises and outliers, the triangle rotates with respect to the center position of the circular region and generates a series of triangles with different normal vectors based on different three points on the boundary of the circular region. The vectors for several triangles are normalized and then median direction of the normal vectors is used to test the planarity of the circular region. The method is very fast and we prove the performance of algorithm for real range data obtained from a stereo camera system.

• 한국기계가공학회지
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• 제18권11호
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• pp.24-34
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• 2019

An automotive automatic transmission is a popular power-transmitting device in passenger vehicles, as it provides various speed ratios for diverse driving conditions with easy manipulation and smooth gear shifting. The transmission is mainly composed of input and output shafts, planetary gear sets, brakes/clutches, and housing, and it yields multiple forward gears and one reverse gear by actuating the shifting devices of the brakes and clutches. In developing a new transmission, kinematic configurations of a transmission, which presents a brief structure and actuation schemes for speed ratios, need to be checked to determine if the structure can be assembled in a layout. It is impossible for a transmission concept having any interference in connecting main components to be developed further in the design process, since connection interference leads to failure of a layout design in the 2-D plane. In this research, an analysis of the assemblability of a front-wheel drive automatic transmission is carried out on an example concept design by applying the vertex addition algorithm based on graph theory.

• 지질공학
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• 제15권2호
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• pp.201-212
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• 2005

입체사진을 이용하여 암반절취면의 지질구조를 측정하기 위하여, 계획된 입체사진을 획득할수 있는 사진기 시스템과 사진을 분석 할 수 있는 s/w가 제작되었다. 제작된 시스템의 효율성을 검증하기 위하여 단일 건설사면에서 컴퍼스와 사진으로 측정된 25개의 자료를 비교한 결과, 2배의 표준편차 범위에서 주향은 $5.25\pm4.53$, 경사는 $3.18\pm3.17$의 오차로 서로 일치하였다. 동일 구조면을 사진으로 20회 반복 측정한 결과는 동일 오차범위에서 $8.2\pm3.4$, 경사가 $6.6\pm3.4$의 오차를 보였다. 이 결과는 암반구조의 측정에서 일반적으로 허 용되는 10도 이내의 오차범위 이므로 제작된 시스템의 현장적용 가능성을 입증하고 있다. 제작된 시스템을 현재 도로공사가 진행중인 5개의 사면에 적용하여 컴퍼스와 사진측정 기법의 결과를 투영망에 점기하여 비교한 결과, 두 방법에 의한 측정결과가 매우 유사함이 입증되었다. 사진측정의 경우는 접근이 용이하지 못한 절취면의 지질구조를 측정할 수 있으므로 지질조사의 신뢰도를 높일 수 있으며 조사의 시간을 단축할 수 있는 효과를 기대할 수 있다.