• JSTS:Journal of Semiconductor Technology and Science
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• 제10권1호
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• pp.45-48
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• 2010

An inter-pin skew compensation scheme is proposed, which minimizes the inter-pin skew of parallel interface induced by unequal trace length and loading of printed circuit board (PCB). The proposed scheme measures the inter-pin skew and compensates during power-up with simple hardware. The proposed scheme is applied to 3.2-Gb/s/pin DDR4 SDRAM and implemented in a 0.18 m CMOS process. The inter-pin skew is compensated in 324-cycles of 400-MHz clock and the skew is compensated to be less than 24-ps.

• 디지털산업정보학회논문지
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• 제11권2호
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• pp.11-22
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• 2015

The almost of Web page has been gathered the personal information(Korean resident registration number, name, cell-phone number, home telephone number, E-mail address, home address, etc.) using the membership and log-in. The all most user of Web page are concerned for gathering of the personal information. I-pin is the alternative means of resident registration number and has been used during the last ten-year period in the internet. The accident of I-pin mass illegal issue was happened by hacker at February, 2015. In this paper, we analysis the problems of I-pin system about I-pin mass illegal issue accident and propose a improvement method of it. First, I-pin issue must be processed by the off-line of face certification in spite of user's inconvenience. Second, I-pin use must be made up through second certification of password or OTP. The third, the notification of I-pin use must be sent to the user by the text messaging service of cell-phone or the E-mail. The forth, I-pin must be used an alternative means of Korean resident registration number in Internet. The methods can reduce the problems of I-pin system.

• 한국전자파학회논문지
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• 제13권5호
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• pp.484-491
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• 2002

본 연구에서는 Ku-대역 위성통신 중계기에 사용되는 전압제어형 PIN 다이오드 감쇄기를 설계, 제작, 측정하고 이 감쇄기의 온도 특성 변화를 보상하기 위한 온도보상회로를 제안하였다. PIN 다이오드 감쇄기는 박막 하이브리드 기술을 이용하여 설계되었으며 PIN 다이오드 감쇄기를 전압제어형으로 사용할 경우 최대 선형 특성을 얻을 수 있는 부하 저항(R$_{L}$)의 값을 Simulation 및 실험에 의해 결정되었다. 최적의 부하 저항값은 사용한 PIN 다이오드의 특성에 의해 달라지며, 본 논문에서 사용한 APD-0805의 경우 150$\Omega$의 부하저항으로 PIN 다이오드 한 개에 10 dB 까지 선형 감쇄범위를 얻을 수 있었다. 또한 부하 저항을 포함한 PM 다이오드 감쇄기의 온도 특성을 측정하였고, 측정결과 관찰된 PIN 다이오드 감쇄기가 전압제어형으로 사용되어질 경우의 가장 큰 단점인 온도 특성의 심각한 변화를 보상할 수 있는 온도보상회로를 제안하였다. 제안된 온도보상회로를 갖는 PIN 다이오드 감쇄기는 동작온도에 대해 선형적인 특성을 보이며 동작온도 범위에 걸쳐 0.6 dB 이하의 오차만을 가짐을 확인하였다.

• 한국전기전자재료학회논문지
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• 제21권10호
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• pp.889-895
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• 2008

This paper presents a comprehensive mathematical analysis and simulation of trench IGBT with the help of PIN-PNP combinational model. Since trench IGBT is characteristically influenced by PIN diode, it may be almost impossible to analyze the trench IGBT using PNP-MOS modeling methods, even PIN-MOS techniques which neglect the hole current components coming into p-base region. A new PIN-PNP complementary cooperational model is developed in order to make up the drawbacks of existing models. It would allow us to make qualitative analysis as well as simulation about switching and on-state characteristics of 1,700 V trench IGBT. Moreover, if we improve the PIN diode effects through the optimization of trench structure, trench IGBT is expected to be one of the most promising devices in the not only high-voltage but also high speed switching device field.

• 대한기계학회논문집B
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• 제29권7호
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• pp.828-836
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• 2005

Impingement/effusion cooling technique is used for combustor liner or turbine parts cooling in gas turbine engine. In the impingement/effusion cooling system, the crossflow generated in the cooling channel induces an adverse effect on the cooling performance, which consequently affects the durability of the cooling system. In the present study, to reduce the adverse effect of the crossflow and improve the cooling performance, circular pin fins are installed in impingement/effusion cooling system and the heat transfer characteristics are investigated. The pin fins are installed between two perforated plates and the crossflow passes between these two plates. A blowing ratio is changed from 0.5 to 1.5 for the fixed jet Reynolds number of 10,000 and five circular pin fin arrangements are considered in this study. The local heat/mass transfer coefficients on the effusion plate are measured using a naphthalene sublimation method. The results show that local distributions of heat/mass transfer coefficient are changed due to the installation of pin fins. Due to the generation of vortex and wake by the pin fin, locally low heat/mass transfer regions are reduced. Moreover, the pin fin prevents the wall jet from being swept away, resulting in the increase of heat/mass transfer. When the pin fin is installed in front of the impinging let, the blockage effect on the crossflow enhances the heat/mass transfer. However, the pin fin installed just behind the impinging jet blocks up the wall jet, decreasing the heat/mass transfer. As the blowing ratio increases, the pin fins lead to the higher Sh value compared to the case without pin fins, inducing $16\%{\~}22\%$ enhancement of overall Sh value at high blowing ratio of M=1.5.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• 대한족부족관절학회지
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• 제19권1호
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• pp.11-17
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• 2015

Purpose: To report the radiographic and clinical results of 6.5 mm cancellous full threaded buttress screw or Steinmann pin fixation to maintain a reduction of calcaneal posterior facet depression fracture. Materials and Methods: From June 2009 to June 2012, 50 consecutive cases with calcaneal joint depression fracture that underwent open reduction and screw or pin fixation were enrolled in this study. A 6.5 mm cancellous full threaded screw was inserted from the posteroinferior aspect of the calcaneal tuberosity to the posterior facet (group A) or Steinman pin was inserted from the posterosuperior aspect of the calcaneal tuberosity to the calcaneocuboidal joint (group B). Both preoperative and postoperative Bohler and Gissane angles were measured radiographically, and American Orthopaedic Foot and Ankle Society (AOFAS) ankle-hindfoot scale on the final follow-up were assessed. Results: The mean age of patients was 44.1 years, and the mean follow-up period was 27.2 months. According to the Sanders classification, 28 cases were type II and 22 cases were type III. In Sanders type II, Bohler and Gissane angles improved significantly from $10.1^{\circ}$ and $126.2^{\circ}$ preoperatively to $27.2^{\circ}$ and $117.1^{\circ}$, respectively, in the immediate postoperative radiograph, and at the final follow-up, $26.6^{\circ}$ and $118.6^{\circ}$, respectively. In Sanders type III, Bohler and Gissane angles improved significantly from $5.0^{\circ}$ and $129.8^{\circ}$ to $29.9^{\circ}$ and $119.3^{\circ}$, respectively, in the immediate postoperative radiograph, and $26.9^{\circ}$ and $120.2^{\circ}$ at the final follow-up. All cases achieved bony union, and the average period until complete union was 13.3 weeks. AOFAS ankle-hindfoot scale was 82.6 in Sanders type II and 77.3 in Sanders type III at the final follow-up. Conclusion: A 6.5 mm cancellous full threaded buttress screw or Steinman pin fixation is a noninvasive treatment method with a merit of being able to maintain the bearing capacity of the posterior facet comparable to plate fixation.

• 동력기계공학회지
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• 제9권2호
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• pp.57-64
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• 2005

This paper is the study on dry sliding wear behavior of carbon fiber reinforced epoxy matrix composites against lay-up orientation. Tests were investigated on the effect of the lay-up orientation, fiber sliding direction, load and sliding velocity when circumstance keep continuously at $21^{\circ}C$, 60%RH. Pin-on-disk dry sliding wear tests for each experimental condition were carried out with a carbon fiber reinforced plastic pin on stainless steel disk in order to search the friction and wear characteristics. The wear rates and friction coefficients against the stainless steel counterpart were experimentally determined and the wear mechanisms were microscopically observed. The effect on friction and wear behavior are observed differently, according to various conditions. When sliding took place against counterpart, the highest wear resistance and the lowest friction coefficient were observed in the $[0]_{24s}$ lay-up orientation at anti-parallel direction.

• 한국식품영양과학회지
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• 제43권11호
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• pp.1742-1748
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• 2014

본 연구는 시판용 쌀가루와 제분공정을 달리한 쌀가루들의 품질 특성을 비교한 후 설기떡 제조에 적합한 쌀가루 가공공정을 제안하고자 하였다. 입도분포는 1st roll로 제분한 후 건조하였을 때 $710{\mu}m$ 초과의 쌀가루만을 건식제분기인 pin mill에 적용한 roll & pin에서 $250{\mu}m$ 이하의 작은 입도가 약 48%를 차지하여 CRF(2nd step roll mill)에 비해 높은 비율을 나타내었다. 일반성분은 1단계의 제분만을 거친 1st roll에서 단백질, 지방, 회분 함량이 높았고, CRF와 roll & pin은 유의적으로 낮은 값을 나타내었다. 색도는 작은 입자의 분포 비율이 많은 roll & pin에서 L값이 높았으며, 손상전분, 물결합력은 CRF와 roll & pin이 유의적으로 높게 나타났다. RVA 호화특성은 CRF와 roll & pin의 호화개시온도, 최고점도 및 노화 정도를 반영하는 setback 값 또한 1st roll에 비해 낮았다. 또한 위 3가지의 쌀가루(CRF, 1st roll, roll & pin)를 이용하여 제조한 설기떡의 외관 관찰에서 CRF와 roll & pin의 경우 큰 차이를 나타내지 않았으나 1st roll의 경우 거친 내상 및 외상을 확인할 수 있었다. 조직감에서는 roll & pin으로 제조한 쌀가루의 설기떡과 CRF로 제조한 설기떡은 유사한 것으로 나타났다. 정량적 묘사분석 결과 외관, 향, 맛, 질감 및 전반적 기호도에서 roll & pin이 CRF나 1st roll에 비해 높은 값을 나타내었다. 따라서 설기떡의 제조 시 건식제분인 roll & pin으로 제조한 쌀가루가 현재 상용화되어 있는 습식제분법인 2 step roll mill보다 제분공정을 간편화한 우수한 설기떡을 제조할 수 있으리라 사료된다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.II
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• pp.955-962
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• 2005

Power efficiency, lifetime and stable manufacturing processes are the crucial parameters for the success of organic light emitting diodes (OLEDs) in display and lighting applications. Highest power efficiencies of PIN-OLEDs for all principal colours and for bottom and top emission OLED structures have been demonstrated. The PIN structure, which means the incorporation of intentionally doped charge carrier transport layer in a suitable OLED layer setup, lowers the operating voltage to achieve highest power efficiencies. Up to now the n-doping of the electron transport layer has been done by alkali metal co-deposition. This has main draw-backs in terms of manufacturability, since the handling of large amounts of pure Cs is a basic issue in production lines. Here we present in detail results on PIN-OLEDs comprising a newly developed molecular n-dopant. All the previous OLED performance data based on PIN-OLEDs with alkali metal doping could be reproduced and will be further improved in the future. Hence, for the first time, a full manufacturing compatible PIN-OLED is available.