• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.1
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• pp.45-48
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• 2010

An inter-pin skew compensation scheme is proposed, which minimizes the inter-pin skew of parallel interface induced by unequal trace length and loading of printed circuit board (PCB). The proposed scheme measures the inter-pin skew and compensates during power-up with simple hardware. The proposed scheme is applied to 3.2-Gb/s/pin DDR4 SDRAM and implemented in a 0.18 m CMOS process. The inter-pin skew is compensated in 324-cycles of 400-MHz clock and the skew is compensated to be less than 24-ps.

• Journal of Korea Society of Digital Industry and Information Management
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• v.11 no.2
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• pp.11-22
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• 2015

The almost of Web page has been gathered the personal information(Korean resident registration number, name, cell-phone number, home telephone number, E-mail address, home address, etc.) using the membership and log-in. The all most user of Web page are concerned for gathering of the personal information. I-pin is the alternative means of resident registration number and has been used during the last ten-year period in the internet. The accident of I-pin mass illegal issue was happened by hacker at February, 2015. In this paper, we analysis the problems of I-pin system about I-pin mass illegal issue accident and propose a improvement method of it. First, I-pin issue must be processed by the off-line of face certification in spite of user's inconvenience. Second, I-pin use must be made up through second certification of password or OTP. The third, the notification of I-pin use must be sent to the user by the text messaging service of cell-phone or the E-mail. The forth, I-pin must be used an alternative means of Korean resident registration number in Internet. The methods can reduce the problems of I-pin system.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.5
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• pp.484-491
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• 2002

This paper presents the results of a study of voltage-controlled PIN diode attenuators for Ku-band satellite payload and suggests the temperature-compensation method of these attenuators. The PIN diode attenuators are designed using thin-film hybrid techniques. The load resistance for maximum linear characteristics is determined by simulation and measurements. In the case of APD0805, load resistance of 150 $\Omega$ gives attenuator up to 10 dB linear attenuation range per a PIN diode. Also, measurements over temperature of these PIN diode attenuators were performed. From these measurements, designed PIN diode attenuators shows the severe temperature dependency due to forward voltage variation. A temperature compensation method using thermistor is now suggested to compensate the temperature variation of these PIN diode attenuators. This circuit shows good linear characteristics over wide temperature range

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.10
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• pp.889-895
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• 2008

This paper presents a comprehensive mathematical analysis and simulation of trench IGBT with the help of PIN-PNP combinational model. Since trench IGBT is characteristically influenced by PIN diode, it may be almost impossible to analyze the trench IGBT using PNP-MOS modeling methods, even PIN-MOS techniques which neglect the hole current components coming into p-base region. A new PIN-PNP complementary cooperational model is developed in order to make up the drawbacks of existing models. It would allow us to make qualitative analysis as well as simulation about switching and on-state characteristics of 1,700 V trench IGBT. Moreover, if we improve the PIN diode effects through the optimization of trench structure, trench IGBT is expected to be one of the most promising devices in the not only high-voltage but also high speed switching device field.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.7 s.238
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• pp.828-836
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• 2005

Impingement/effusion cooling technique is used for combustor liner or turbine parts cooling in gas turbine engine. In the impingement/effusion cooling system, the crossflow generated in the cooling channel induces an adverse effect on the cooling performance, which consequently affects the durability of the cooling system. In the present study, to reduce the adverse effect of the crossflow and improve the cooling performance, circular pin fins are installed in impingement/effusion cooling system and the heat transfer characteristics are investigated. The pin fins are installed between two perforated plates and the crossflow passes between these two plates. A blowing ratio is changed from 0.5 to 1.5 for the fixed jet Reynolds number of 10,000 and five circular pin fin arrangements are considered in this study. The local heat/mass transfer coefficients on the effusion plate are measured using a naphthalene sublimation method. The results show that local distributions of heat/mass transfer coefficient are changed due to the installation of pin fins. Due to the generation of vortex and wake by the pin fin, locally low heat/mass transfer regions are reduced. Moreover, the pin fin prevents the wall jet from being swept away, resulting in the increase of heat/mass transfer. When the pin fin is installed in front of the impinging let, the blockage effect on the crossflow enhances the heat/mass transfer. However, the pin fin installed just behind the impinging jet blocks up the wall jet, decreasing the heat/mass transfer. As the blowing ratio increases, the pin fins lead to the higher Sh value compared to the case without pin fins, inducing $16\%{\~}22\%$ enhancement of overall Sh value at high blowing ratio of M=1.5.

• Journal of the Semiconductor & Display Technology
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• v.19 no.4
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• pp.18-21
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• 2020

Undetected wafer slip during the lift pin-down motion in semiconductor equipment may affect the center to edge variation, wafer warpage, and pattern misalignment in plasma equipment. Direct measuring of the amount of wafer slip inside the plasma process chamber is not feasible because of the hardware space limitation inside the plasma chamber. In this paper, we demonstrated a practice for the wafer lift pin-up and down motions with respect to the gear ratio, operating voltage, and pulse width modulation to maintain accurate wafer position using remote control linear servo motor with an experimentally designed chamber mockup. We noticed that the pin moving velocity and gear ratio are the most influencing parameters to be control, and the step-wised position control algorithm showed the most suitable for the reduction of wafer slip.

• Journal of Korean Foot and Ankle Society
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• v.19 no.1
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• pp.11-17
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• 2015

Purpose: To report the radiographic and clinical results of 6.5 mm cancellous full threaded buttress screw or Steinmann pin fixation to maintain a reduction of calcaneal posterior facet depression fracture. Materials and Methods: From June 2009 to June 2012, 50 consecutive cases with calcaneal joint depression fracture that underwent open reduction and screw or pin fixation were enrolled in this study. A 6.5 mm cancellous full threaded screw was inserted from the posteroinferior aspect of the calcaneal tuberosity to the posterior facet (group A) or Steinman pin was inserted from the posterosuperior aspect of the calcaneal tuberosity to the calcaneocuboidal joint (group B). Both preoperative and postoperative Bohler and Gissane angles were measured radiographically, and American Orthopaedic Foot and Ankle Society (AOFAS) ankle-hindfoot scale on the final follow-up were assessed. Results: The mean age of patients was 44.1 years, and the mean follow-up period was 27.2 months. According to the Sanders classification, 28 cases were type II and 22 cases were type III. In Sanders type II, Bohler and Gissane angles improved significantly from $10.1^{\circ}$ and $126.2^{\circ}$ preoperatively to $27.2^{\circ}$ and $117.1^{\circ}$, respectively, in the immediate postoperative radiograph, and at the final follow-up, $26.6^{\circ}$ and $118.6^{\circ}$, respectively. In Sanders type III, Bohler and Gissane angles improved significantly from $5.0^{\circ}$ and $129.8^{\circ}$ to $29.9^{\circ}$ and $119.3^{\circ}$, respectively, in the immediate postoperative radiograph, and $26.9^{\circ}$ and $120.2^{\circ}$ at the final follow-up. All cases achieved bony union, and the average period until complete union was 13.3 weeks. AOFAS ankle-hindfoot scale was 82.6 in Sanders type II and 77.3 in Sanders type III at the final follow-up. Conclusion: A 6.5 mm cancellous full threaded buttress screw or Steinman pin fixation is a noninvasive treatment method with a merit of being able to maintain the bearing capacity of the posterior facet comparable to plate fixation.

• Journal of Power System Engineering
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• v.9 no.2
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• pp.57-64
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• 2005

This paper is the study on dry sliding wear behavior of carbon fiber reinforced epoxy matrix composites against lay-up orientation. Tests were investigated on the effect of the lay-up orientation, fiber sliding direction, load and sliding velocity when circumstance keep continuously at $21^{\circ}C$, 60%RH. Pin-on-disk dry sliding wear tests for each experimental condition were carried out with a carbon fiber reinforced plastic pin on stainless steel disk in order to search the friction and wear characteristics. The wear rates and friction coefficients against the stainless steel counterpart were experimentally determined and the wear mechanisms were microscopically observed. The effect on friction and wear behavior are observed differently, according to various conditions. When sliding took place against counterpart, the highest wear resistance and the lowest friction coefficient were observed in the $[0]_{24s}$ lay-up orientation at anti-parallel direction.

• Journal of the Korean Society of Food Science and Nutrition
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• v.43 no.11
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• pp.1742-1748
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• 2014

This study investigated the quality characteristics of commercial rice flour (CRF) and rice flours prepared by different milling methods for sulgidduk. For particle distribution, dried rice flour after the 1st roll mill using a pin mill showed a particle size of greater than $710{\mu}m$, whereas a particle size less than $250{\mu}m$ accounted for 48% of whole rice flour. This proportion was higher than CRF after the 2nd step roll mill. Crude protein, lipid, and ash contents were significantly highest in 1st roll mill samples. For color, roll & pin made up of many small particles showed a high L value. CRF and roll & pin showed significantly higher starch damage and water-holding capacity, whereas pasting temperature, peak viscosity, and setback of RVA pasting characteristics were lower than 1st roll mill. When rice cakes were made from three kinds of rice flour, roll & pin was not significantly different compared to the CRF. However, rice cakes made with 1st roll milled rice flour showed rough crumb and crust. Rice cake made with roll & pin or CRF showed similar characteristics for texture. In the quantitative descriptive analysis, rice cake made with roll & pin showed better appearance, flavor, taste, texture, and overall acceptability than CRF and 1st roll mill. Therefore, rice flour prepared by roll & pin could be applied to sulgidduk with high quality.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.955-962
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• 2005

Power efficiency, lifetime and stable manufacturing processes are the crucial parameters for the success of organic light emitting diodes (OLEDs) in display and lighting applications. Highest power efficiencies of PIN-OLEDs for all principal colours and for bottom and top emission OLED structures have been demonstrated. The PIN structure, which means the incorporation of intentionally doped charge carrier transport layer in a suitable OLED layer setup, lowers the operating voltage to achieve highest power efficiencies. Up to now the n-doping of the electron transport layer has been done by alkali metal co-deposition. This has main draw-backs in terms of manufacturability, since the handling of large amounts of pure Cs is a basic issue in production lines. Here we present in detail results on PIN-OLEDs comprising a newly developed molecular n-dopant. All the previous OLED performance data based on PIN-OLEDs with alkali metal doping could be reproduced and will be further improved in the future. Hence, for the first time, a full manufacturing compatible PIN-OLED is available.