• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.275-280
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• 2005

We propose a new approach to greatly simplify the fabrication of conventional nanoimprint lithography (NIL) by combined nanoimprint and photolithography (CNP). We introduce a hybrid mask mold (HMM) made from UV transparent material with a UV-blocking Cr metal layer placed on top of the mold protrusions. We used a negative tone photo resist (PR) with higher selectivity to substrate the CNP process instead of the UV curable monomer and thermal plastic polymer that has been commonly used in NIL. Self-assembled monolayer (SAM) on HMM plays a reliable role for pattern transfer when the HMM is separated from the transfer layer. Hydrophilic $SiO_2$ thin film was deposited on all parts of the HMM, which improved the formation of SAM. This $SiO_2$ film made a sub-10nm formation without any pattern damage. In the CNP technique with HMM, the 'residual layer' of the PR was chemically removed by the conventional developing process. Thus, it was possible to simplify the process by eliminating the dry etching process, which was essential in the conventional NIL method.

• Korean Journal of Crystallography
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• v.2 no.1
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• pp.1-11
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• 1991

When GaAs single crystals are grown by LEC method, a serious problem is that longitudinal twins are often generated. the growth axis is changed from (100) to (221) direction by logitudinal twin. In this experiment, 3 inch GaAs single crystals, slaving (100) uonh axis, were von by LEC method. Striations and edge facets generated during crystal growth, were observed by SPW photo-etching. Relationship between striations and edge facets was studied. Instability of their generation was the cause of goneration of longitudinal twins. The shape of striations was changed with the growth conditions such as crystal diameter and melt volume. In the region of crystal edge: there was the microscopic fluctuation by the instability of melt convection. Edge facets consisting of {111} plane developed well in the region which striation were convex to the melt. Because the angle between striation and {111} edge facet decreased in that region. Longitudinal twins were generated on the crystal surface at the <111> direction which is perpendicular to the growth axis. These were generated by unstable melt convection and propagated in the crystal as crystal grew. Longitudinal twins were generated when regrowth rate was very fast after {111} edge facets were remelted. So, in order to supress the generation of longitudinal twin, abrupt change of melt convection must be prohibited.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.7
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• pp.486-493
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• 2003

Schottky type A $l_{0.33}$G $a_{0.67}$N ultraviolet photodetectors were fabricated on the MOCVD grown AlGaN/ $n^{＋}$-GaN and AlGaN/AlGaN interlayer/ $n^{＋}$-GaN structures. The grown layers have the carrier concentrations of -$10^{18}$, and the mobilities were 236 and 269 $\textrm{cm}^2$/V.s, respectively. After mesa etching by ICP etching system, the Si3N4 layer was deposited for passivation between the contacts and Ti/AL/Ni/Au and Pt were deposited for ohmic and Schottky contact, respectively. The fabricated Pt/A $l_{0.33}$G $a_{0.67}$N Schottky diode revealed a leakage current of 1 nA for samples with interlayer and 0.1$\mu\textrm{A}$ for samples without interlayer at a reverse bias of -5 V. In optical measurement, the Pt/A $l_{0.33}$G $a_{0.67}$N diode with interlayer showed a cut-off wavelength of 300 nm, a prominent responsivity of 0.15 A/W at 280 nm and a UV-visible extinction ratio of 1.5x$10^4./TEX>.

• ETRI Journal
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• v.24 no.4
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• pp.290-298
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• 2002

We present, for the first time, a prototype active-matrix field emission display (AMFED) in which an amorphous silicon thin-film transistor (a-Si TFT) and a molybdenum-tip field emitter array (Mo-tip FEA) were monolithically integrated on a glass substrate for a novel active-matrix cathode (AMC) plate. The fabricated AMFED showed good display images with a low-voltage scan and data signals irrespective of a high voltage for field emissions. We introduced a light shield layer of metal into our AMC to reduce the photo leakage and back channel currents of the a-Si TFT. We designed the light shield to act as a focusing grid to focus emitted electron beams from the AMC onto the corresponding anode pixel. The thin film depositions in the a-Si TFTs were performed at a high temperature of above 360°C to guarantee the vacuum packaging of the AMC and anode plates. We also developed a novel wet etching process for $n^+-doped$ a-Si etching with high etch selectivity to intrinsic a-Si and used it in the fabrication of an inverted stagger TFT with a very thin active layer. The developed a-Si TFTs performed well enough to be used as control devices for AMCs. The gate bias of the a-Si TFTs well controlled the field emission currents of the AMC plates. The AMFED with these AMC plates showed low-voltage matrix addressing, good stability and reliability of field emission, and good light emissions from the anode plate with phosphors.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.320-320
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• 2012

III-V 화합물 태양전지는 실리콘, CdTe, CIGS, 염료, 및 유기 등 다른 태양전지에 비해 1sun 상 30% 이상의 고효율을 갖고 있고 앞으로도 계속 증가할 수 있는 가능성을 갖고 있다. 그 이유는 직접천이형 밴드갭, 높은 이동도 등의 고성능 물질특성과 더불어 3족과 5족의 비율을 조절함으로써 같은 결정구조를 갖고 에너지 밴드갭이 다른 물질들을 만들기에 용의하여, 태양전지 스펙트럼의 넓은 영역을 흡수할 수 있는 장점이 있기 때문이다. 그러나, 셀자체의 물질이 실리콘에 비하여 고가이므로, 고성능이 요구되는 우주 인공위성등에 적용이 되었지만, 2000년대 이후로 집광에 적용가능한 태양전지의 연구를 거듭하여 2005년부터는 값싼 프레넬 렌즈를 이용하여 1sun에 비해 500배 해당하는 빛을 셀에 집광하여 보다 효율을 증가시킴으로써 지상발전용에도 적용가능한 셀을 형성하게 되었다. 더불어 태양전지의 효율을 증가시키기 위한 개선된 구조적 변화의 시도도 많이 이루어지고 있다. 최근 보고에 의하면 실리콘 태양전지의 표면에 texture 또는 나노 구조를 주어 높은 흡수율과 낮은 반사율을 갖게 함으로써 효율을 증가시키는 사례가 많아지고, III-V 화합물 태양전지도 texturing에 의해 증가된 효율을 발표한바 있다. 본 연구에서는 태양전지의 효율을 증가시키기 위하여 III-V 화합물 태양전지 표면에 micro-hole array texture 구조를 형성한 후 나노 particle을 이용한 나노 texture 구조를 형성하였다. Photo-lithography와 chemical wet etching으로 micro-hole array texture 구조를 형성하였으며 micro-hole의 직경은 $5{\sim}20{\mu}m$, hole과 hole의 간격은 $3{\sim}15{\mu}m$로 다양하게 변화를 주었다. 형성된 micro-hole array texture 구조위에 수십 nm 크기의 particle을 만들어 chemical wet etching으로 나노 texture 구조를 형성하였다. 태양전지 표면에 texture 구조가 있는 경우와 없는 경우에 각각 효율을 측정, 비교 분석하였다.

• Journal of the Korean Magnetics Society
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• v.25 no.5
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• pp.149-155
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• 2015

The ECR (Electron Cyclotron Resonance) Ar ion milling was manufactured to fabricate the device of thin film. The ECR ion milling system applied to the device etching operated by a power of 600W, a frequency of 2.45 GHz, and a wavelength of 12.24 cm and transferred by a designed waveguide. In order to match one resonant frequency, a magnetic field of 908 G was applied to a cavity inside of ECR. The Ar gas intruded into a cavity and created the discharged ion beam. The surface of target material was etched by the ion beam having an acceleration voltage of 1000 V. The formed devices with a width of $1{\mu}m{\sim}9{\mu}m$ on the GMR-SV (Giant magnetoresistance-spin valve) multilayer after three major processes such as photo lithography, ion milling, and electrode fabrication were observed by the optical microscope.

• Journal of the Korean Vacuum Society
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• v.20 no.1
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• pp.63-69
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• 2011

In this study, we report on the novel lithographic patterning method to fabricate organic thin film field effect transistors (OTFTs) based on photo and e-beam lithography with well-known silicon technology. The method is applied to fabricate pentacene-based organic field effect transistors. Owing to their solubility, sub-micron sized patterning of P3HT and PEDOT has been well established via micromolding in capillaries and inkjet printing techniques. Since the thermally deposited pentacene cannot be dissolved in solvents, other approach was done to fabricate pentacene FETs with a very short channel length (~30 nm), or in-plane orientation of pentacene molecules by using nanometer-scale periodic groove patterns as an alignment layer for high-performance pentacene devices. Here, we introduce $Al_2O_3$ film grown via atomic layer deposition method onto pentacene as a passivation layer. $Al_2O_3$ passivation layer on OTFTs has some advantages in preventing the penetration of water and oxygen and obtaining the long-term stability of electrical properties. AZ5214 and ma N-2402 were used as a photo and e-beam resist, respectively. A few micrometer sized lithography patterns were transferred by wet and dry etching processes. Finally, we fabricated micron sized pentacene FETs and measured their electrical characteristics.

• Journal of the Korean Vacuum Society
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• v.6 no.2
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• pp.103-108
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• 1997

Silicon field emitter arrays (FEAs) have been fabricated by a novel method employing a two-step tip etch and a spin-on-glass (SOG) etch-back process using double layered thermal/tetraethylortho-silicate (TEOS) oxides as a gate dielectric. A partial etching was performed by coating a low viscous photo resist and $O_2$ plasma ashing on order to form the double layered gate dielectric. A small gate aperture with low gate leakage current was obtained by the novel process. The hight and the end radius of the fabricated emitter was about 1.1 $\mu\textrm{m}$ and less than 100$\AA$, respectively. The anode emission current from a 256 tips array was turned-on at a gate voltage of 40 V. Also, the gate current was less than 0.1% of the anode current.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• Restorative Dentistry and Endodontics
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• v.22 no.1
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• pp.61-75
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• 1997

The bond strengths of composite resin to tooth dentin vary with the methods of cavity preparation and surface treatment. Recent developments in techniques of dentinal surface treatment have renewed interest in microabrasive as a means of tooth preparation, The purpose of this study was to determine the effects of a new method of cavity preparation on the bond of composite resin to dentin. Freshly extracted 144 healthy human third molars were used in this study. The dentin surfaces prepared with #600 SiC abrasive paper were divided into control and air abrasion groups according to the method of dentin surface preparation using different combinations of delivery pressure, time, and acid etching. The shear bond strengths were measured after the composite resin (Clearfil Photo Bright) was bonded to prepared dentin surfaces by light-curing using a dentin bonding system (All-bond 2), In addition, the average surface roughness was measured to investigate the effect of differently prepared dentin surfaces on the shear bond strengths. The surface changes of prepared dentin and the debonded dentin surfaces were observed with SEM (S-2300, Hitachi Co., Japan). The following results from this-study were obtained ; 1. There was no significant difference of shear bond strengths according to the changes of delivery pressure and time. 2. The shear bond strengths were lower than the control in the air abraded-only groups, but those of the additional acid-etched groups were higher than the control. 3. The shear bond strengths to all air-abraded surfaces were increased by acid etching. 4. The correlation between shear bond strengths and surface roughness was not certain, although the mean surface roughness of all air-abraded surfaces has increased evidently while it has slightly decreased for additional acid etching. 5. On SEM examination, the dentinal tubules were almost occluded in the air abraded-only groups, but those were opened in the additional acid-etched groups. 6. The debonded surfaces were showed adhesive failure mode in the air abraded- only groups, while those were showed mainly the mixed and cohesive failure mode in the additional acid-etched groups. These results suggest that the layer produced during cavity preparation or surface treatment with air abrasion must be removed for maximum bond strength of composite resin to dentin.