• Title/Summary/Keyword: Phase-change memory

Search Result 175, Processing Time 0.034 seconds

Experimental training of shape memory alloy fibres under combined thermomechanical loading

  • Shinde, Digamber;Katariya, Pankaj V;Mehar, Kulmani;Khan, Md. Rajik;Panda, Subrata K;Pandey, Harsh K
    • Structural Engineering and Mechanics
    • /
    • v.68 no.5
    • /
    • pp.519-526
    • /
    • 2018
  • In this article, experimental training of the commercial available shape memory alloy fibre (SMA) fibre under the combined thermomechanical loading is reported. SMA has the ability to sense a small change in temperature (${\geq}10^{\circ}C$) and activated under the external loading and results in shape change. The thermomechanical characteristics of SMA at different temperature and mechanical loading are obtained through an own lab-scale experimental setup. The analysis is conducted for two types of the medium using the liquid nitrogen (cold cycle) and the hot water (heat cycle). The experimental data indicate that SMA act as a normal wire for Martensite phase and activated behavior i.e., regain the original shape during the Austenite phase only. To improve the confidence of such kind of behavior has been verified by inspecting the composition of the wire. The study reveals interesting conclusion i.e., while SMA deviates from the equiatomic structure or consist of foreign materials (carbon and oxygen) except nickel and titanium may affect the phase transformation temperature which shifted the activation phase temperature. Also, the grain structure distortion of SMA wire has been examined via the scanning electron microscope after the thermomechanical cycle loading and discussed in details.

A Low Power Phase-Change Random Access Memory Using A Selective Data Write Scheme (선택적 데이터 쓰기 기법을 이용한 저전력 상변환 메모리)

  • Yang, Byung-Do
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.44 no.1
    • /
    • pp.45-50
    • /
    • 2007
  • This paper proposes a low power selective data write (SDW) scheme for a phase-change random access memory (PRAM). The PRAM consumes large write power because large write currents are required during long time. At first, the SDW scheme reads a stored data during write operation. And then, it writes an input data only when the input and stored data are different. Therefore, it can reduce the write power consumption to a half. The 1K-bit PRAM test chip with $128{\times}8bits$ is implemented with a $0.8{\mu}m$ CMOS technology with a $0.8{\mu}m$ GST cell.

The Least-Dirty-First CLOCK Replacement Policy for Phase-Change Memory based Swap Devices (PCM 기반 스왑 장치를 위한 클럭 기반 최소 쓰기 우선 교체 정책)

  • Yoo, Seunghoon;Lee, Eunji;Bahn, Hyokyung
    • Journal of KIISE
    • /
    • v.42 no.9
    • /
    • pp.1071-1077
    • /
    • 2015
  • In this paper, we adopt PCM (phase-change memory) as a virtual memory swap device and present a new page replacement policy that considers the characteristics of PCM. Specifically, we aim to reduce the write traffic to PCM by considering the dirtiness of pages when making a replacement decision. The proposed policy tracks the dirtiness of a page at the granularity of a sub-page and replaces the least dirty page among the pages not recently used. Experimental results show that the proposed policy reduces the amount of data written to PCM by 22.9% on average and up to 73.7% compared to CLOCK. It also extends the lifespan of PCM by 49.0% and reduces the energy consumption of PCM by 3.0% on average.

Nano-Scale Observation of Nanomaterials by In-Situ TEM and Ultrathin SiN Membrane Platform

  • An, Chi-Won
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.02a
    • /
    • pp.657-657
    • /
    • 2013
  • In-situ observations of nano-scale behavior of nanomaterials are very important to understand onthe nano-scale phenomena associated with phase change, atomic movement, electrical or optical properties, and even reactions which take place in gas or liquid phases. We have developed on the in-situ experimental technologies of nano-materials (nano-cluster, nanowire, carbon nanotube, and graphene, et al.) and their interactions (percolation of metal nanoclusters, inter-diffusion, metal contacts and phase changes in nanowire devices, formation of solid nano-pores, melting behavior of isolated nano-metal in a nano-cup, et al.) by nano-discovery membrane platform [1-4]. Between two microelectrodes on a silicon nitride membrane platform, electrical percolations of metal nano-clusters are observed with nano-structures of deposited clusters. Their in-situ monitoring can make percolation devices of different conductance, nanoclusters based memory devices, and surface plasmonic enhancement devices, et al. As basic evidence on the phase change memory, phase change behaviors of nanowire devices are observed at a nano-scale.

  • PDF

A Study on Change of Texture During Thermal Cycling in Cu-Zn-AI Shape Memory Alloy (Cu-Zn-AI 형상기억 합금의 열사이클에 따른 집합조직의 변화에 관한 연구)

  • Hong, D.W.;Park, Y.K.
    • Journal of the Korean Society for Heat Treatment
    • /
    • v.5 no.3
    • /
    • pp.179-185
    • /
    • 1992
  • The shape memory effect results from the martensite transfomation of each individual grain. Thus it is necessary to study the texture and its variation. In this study the change of texture during thermal cycling and it's effect on shape memory ability are investigated. The major component of the rolling texture in the parent phase is identified (001) [110], and minor components are (112) [110], (111) [112], {hkl}<100> fiber texture is developed at $45^{\circ}$ from rolling direction. In the case of martensite phase, it is estimated that the major component is (011) [100] and the minor components are (105) [501], (010) [101] and (100) [001]. According to thermal cycling. severity of texture, especially (001) [110] component in parent phase and (011) [100] component in martensite phase are increased. The shape memory ability is increased with increase of thermal cycles and also increased as the direction of specimen approach to $45^{\circ}$ from rolling direction. After first thermal cycling the temperature of transformation can be define clearly and Ms and As are raised by thermal cycling.

  • PDF

Si-Containing Nanostructures for Energy-Storage, Sub-10 nm Lithography, and Nonvolatile Memory Applications

  • Jeong, Yeon-Sik
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.08a
    • /
    • pp.108-109
    • /
    • 2012
  • This talk will begin with the demonstration of facile synthesis of silicon nanostructures using the magnesiothermic reduction on silica nanostructures prepared via self-assembly, which will be followed by the characterization results of their performance for energy storage. This talk will also report the fabrication and characterization of highly porous, stretchable, and conductive polymer nanocomposites embedded with carbon nanotubes (CNTs) for application in flexible lithium-ion batteries. It will be presented that the porous CNT-embedded PDMS nanocomposites are capable of good electrochemical performance with mechanical flexibility, suggesting these nanocomposites could be outstanding anode candidates for use in flexible lithium-ion batteries. Directed self-assembly (DSA) of block copolymers (BCPs) can generate uniform and periodic patterns within guiding templates, and has been one of the promising nanofabrication methodologies for resolving the resolution limit of optical lithography. BCP self-assembly processing is scalable and of low cost, and is well-suited for integration with existing semiconductor manufacturing techniques. This talk will introduce recent research results (of my research group) on the self-assembly of Si-containing block copolymers for the achievement of sub-10 nm resolution, fast pattern generation, transfer-printing capability onto nonplanar substrates, and device applications for nonvolatile memories. An extraordinarily facile nanofabrication approach that enables sub-10 nm resolutions through the synergic combination of nanotransfer printing (nTP) and DSA of block copolymers is also introduced. This simple printing method can be applied on oxides, metals, polymers, and non-planar substrates without pretreatments. This talk will also report the direct formation of ordered memristor nanostructures on metal and graphene electrodes by the self-assembly of Si-containing BCPs. This approach offers a practical pathway to fabricate high-density resistive memory devices without using high-cost lithography and pattern-transfer processes. Finally, this talk will present a novel approach that can relieve the power consumption issue of phase-change memories by incorporating a thin $SiO_x$ layer formed by BCP self-assembly, which locally blocks the contact between a heater electrode and a phase-change material and reduces the phase-change volume. The writing current decreases by 5 times (corresponding to a power reduction of 1/20) as the occupying area fraction of $SiO_x$ nanostructures varies.

  • PDF

Effects of Mo Content on Surface Characteristics of Dental Ni-Ti Alloys (치과용 Ni-Ti합금의 표면특성에 미치는 Mo함량의 영향)

  • Han-Cheol Choe;Jae-Un Kim;Sun-Kyun ark
    • Corrosion Science and Technology
    • /
    • v.22 no.1
    • /
    • pp.64-72
    • /
    • 2023
  • Ni-Ti shape memory alloy for dental nerve treatment devices was prepared by adding Mo to Ni-Ti alloy to improve flexibility and fatigue fracture characteristics and simultaneously increase corrosion resistance. Surface properties of the alloy were evaluated. Microstructure analysis of the Ni-Ti-xMo alloy revealed that the amount of needle-like structure increased with increasing Mo content. The shape of the precipitate showed a pattern in which a long needle-like structure gradually disappeared and changed into a small spherical shape. As a result of XRD analysis of the Ni-Ti-xMo alloy, R-phase structure appeared as Mo was added. R-phase and B2 structure were mainly observed. As a result of DSC analysis, phase transformation of the Ti-Ni-Mo alloy showed a two-step phase change of B2-R-B19' transformation with two exothermic peaks and one endothermic peak. As Mo content increased, R-phase formation temperature gradually decreased. As a result of measuring surface hardness of the Ti-Ni-Mo alloy, change in hardness value due to the phase change tended to decrease with increasing Mo content. As a result of the corrosion test, the corrosion potential and pitting potential increased while the current density tended to decrease with increasing Mo content.

A Study on the Thermal, Electrical Characteristics of Ge-Se-Te Chalcogenide Material for Use in Phase Change Memory

  • Nam, Ki-Hyun;Chung, Hong-Bay
    • Transactions on Electrical and Electronic Materials
    • /
    • v.9 no.6
    • /
    • pp.223-226
    • /
    • 2008
  • $Ge_1Se_1Te_2$ chalcogenide amorphous materials was prepared by the conventional melt-quenching method. Samples were processed bye-beam evaporator systems and RF-sputtering systems. Phase change characteristics were analyzed by measuring glassification temperature, crystallization temperature and density of bulk material. The thermal characteristics were measured at the temperature between 300 K and 700 K, and the electrical characteristics were studied within the range from 0 V to 3 V. The obtained results agree with the electrothermal model for Phase-Change Random Access Memory.

Electrolyte Mechanizm Study of Amorphous Ge-Se Materials for Memory Application (Ge-Se의 스위칭 특성 향상을 위한 Sb-doping에 관한 연구)

  • Nam, Ki-Hyun;Chung, Hong-Bay
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.06a
    • /
    • pp.69-69
    • /
    • 2009
  • In other to progress better crystallization transition and long phase-transformation data of phase-change memory (PRAM), we investigated about the effect of Sb doping and Ag ions percolating into Ge-Se-Te phase-change material. Doped Sb concentrations was determined each of 10 wt%, 20 wt% and 30 wt%. As the Sb-doping concentration was increased, the resistivity decreased and the crystallization temperature increased. Ionization of Ag was progressed by DPSS laser (532 nm) for 1 hour. The resistivity was more decreased and the crystallization temperature was more increased in case of adding Ag layer under Sh-(Ge-Se-Te) thin film. At the every condition of thin films included Ag layer more stable states were indicated compare with just Sh-doped Ge-Se-Te thin films.

  • PDF

The study about phase phase change material at nano-scale using c-AFM method (c-AFM 기술을 이용한 나노급 상변화 소자 특성 평가에 대한 연구)

  • Hong, Sung-Hoon;Lee, Heon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2010.06a
    • /
    • pp.57-57
    • /
    • 2010
  • In this study, nano-sized phase change materials were evaluated using nanoimprint lithography and c-AFM technique. The 200nm in diameter phase change nano-pillar device of GeSbTe, AgInSbTe, InSe, GeTe, GeSb were successfully fabricated using nanoimprint lithography. And the electrical properties of the phase change nano-pillar device were evaluated using c-AFM with pulse generator and voltage source.

  • PDF