• Title/Summary/Keyword: Phase Measuring Profilometry

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A study on the nonlinear error correction of the phase measuring profilometry (PMP 형상 측정법에서 비선형 오차보정에 관한 연구)

  • 황용선;강영준;박낙규;백성훈
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.513-516
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    • 2003
  • Phase Measuring Profilometry(PMP) has been developed as one of three dimensional 3-D shape measuring methods. The 3-D profile of an object was calculated from the phase data obtained by the sinusoidal patterns projected on the object. However, in some cases the approximation includes considerable errors. In this paper, the effect on the errors caused by the optical geometry and the calibration procedure in PMP technique are discussed. The errors which occured in the process of calculating the 3-D profile from the phase distribution are investigated theoritically and experimentally.

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A Study on the Phase Measuring Profilometry with Parallel-optical-axes (평행 광축에서의 위상측정 형상측정법에 관한 연구)

  • 정경민;박윤창;박경근
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.6
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    • pp.210-217
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    • 2000
  • Noncontact measuring methodology of 3-dimensional profile using CCD camera are very attractive because of it's high measuring speed and it's high sensitivity. Especially when projecting a grid pattern over the object, the captured image have 3 dimensional information of the object. Projection moire extract 3-D information with another grid pattern in front of CCD camera. However phase measuring profilometry(PMP) obtain similar results without additional grid pattern. In this paper, the projection moire are compared with the PMP mathematically, and it is shown that PMP can generate moire image with simple mathematical computations. Experimental works are also carried out showing the same results. It is shown that using a single gird pattern, moire image can be obtained directly without any mathematical operation when some conditions are satisfied.

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A 3D Measurement System for the Leads of Semiconductor Chips Using Phase Measuring Profilometry (Phase Measuring Profilometry를 이용한 반도체 칩의 Lead 높이 측정 방법)

  • Kim, Young-Doo;Cho, Tai-Hoon
    • Proceedings of the Korea Information Processing Society Conference
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    • 2011.11a
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    • pp.223-226
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    • 2011
  • 반도체 공정에서 부품의 결함을 찾는 것은 완제품의 품질 개선을 위해 중요하다. 현재까지 많은 비전 알고리즘들이 부품의 결함을 찾기 위해 적용되고 있다. 그러나 이런 알고리즘 대부분은 2D 방식의 검사 방식에 머물고 있다. 그러나 이런 2D방식의 검사 방법은 반도체 칩의 Lead나 Pad 그리고 Solder Joint와 같이 3D 정보에 의해 불량 유무를 판결해야 하는 곳에 적용하기 어렵다. 이에 본 논문에서는 PMP(Phase Measuring Profilometry)방법에 의해 반도체 칩의 Lead부분을 검사하기 위한 시스템 구성과 방법을 제안한다.

A study on the phase calibration of the phase measuring profilometry (PMP 형상 측정법의 위상보정에 관한 연구)

  • 이연태;강영준;황용선
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2002.10a
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    • pp.421-424
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    • 2002
  • The 3-D measurement using a sinusoidal grating pattern projection is very attractive because of its high measuring speed and high sensitivity. When a sinusoidal amplitude grating was projected on an object, the surface-height distribution of the object is translated into a phase distribution of the deformed grating image. The phase-acquisition algorithms are so sufficiently simple that high-resolution phase maps using a CCD camera can be generated in a short time. The PMP technique is discussed, and the analysis of the systematic errors, the calibration procedure designed to determined the optimal setting of the measurement parameters is illustrated. Results of measurements and calibrations on the measurement plane objects are described.

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Error compensation in the optical 3D phase measuring profilometry (광위상 3차원 형상 측정법에서의 오차보정)

  • 황용선;강영준;백성훈;박승규;임창환
    • Proceedings of the Optical Society of Korea Conference
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    • 2003.07a
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    • pp.154-155
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    • 2003
  • PMP(Phase Measuring Profilometry)측정법은 투영계와 기록계의 기하학적 구성과 광학계의 정렬적인 문제에 의해서 기본적으로 오차를 가지고 측정된다. 일반적으로 PMP 형상 측정에서 측정면과 광학계의 높이가 피 측정면에 비해서 상당히 큰 경우, CCD 카메라에서 높이 방향으로 측정영역이 작아지게됨으로써 측정위상이 기준면에서의 위치와 높이 방향에 따라서 다르게 나타나고 프로젝터가 측정면에 투영되는 간섭무의의 피치가 다르게 적용된다. (중략)

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Acceleration of Phase Measuring Profilometry using GPU (GPU를 이용한 위상 측정법의 가속화)

  • Kim, Ho-Joong;Cho, Tai-Hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.21 no.12
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    • pp.2285-2290
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    • 2017
  • Automation systems are evolving in many areas of industry in recent years. At the same time, the necessity of the height inspection of the object by the 3D measurement is gradually increasing. Among the various 3D measurement methods, this paper discusses phase measuring profilometry(PMP). The PMP is a method of obtaining the height of an object using the phase value of the fringe pattern. Since the PMP is an algorithm requiring a large amount of computation, a method for efficiently solving the problem is needed. In this paper, we propose to use CUDA from NVIDIA to solve this problem. We also propose using pinned memory and streams provided by CUDA. This can greatly improve the measurement speed while maintaining accuracy. Finally, we demonstrate the performance of the proposed method through experiments.

A 3D measurement system based on a double frequency method using Fourier transform profilometry (FTP를 이용한 이중 파장법에 의한 3차원 형상 측정)

  • Koo, Ja-myoung;Cho, Tai-hoon
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.19 no.6
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    • pp.1485-1492
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    • 2015
  • This paper proposes a double frequency method using FTP(Fourier Transform Profilometry) in fringe projection techniques for 3D measurement systems. In fringe projection techniques, fringe pattern images are projected and captured, and then object is measured by analysing phase. PMP(Phase Measuring Profilometry) for analysing phase provides high-resolution and is robust to object's reflection and background intensities. However, the measurement range is narrow due to 2π ambiguity. In order to overcome this problem, a double frequency method is often used. This method can widen the range of measurement while maintaining the high-resolution, but the measurement time is taken about twice due to grab 2 times number of images. The proposed double frequency method using FTP requires an additional image for resolving 2π ambiguity. The proposed method effectively reduces the measurement time while maintaining the same accuracy.

A Study on the Compensation of Thermal Errors for Phase Measuring Profilometry (PMP 형상 측정법의 열 변위 보정에 관한 연구)

  • Kim, Gi-Seung;Park, Yoon-Chang
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.6
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    • pp.598-603
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    • 2019
  • Three-dimensional shape measurement technology is used in various industries. Among them, optical three-dimensional shape measurement techniques based on the optical trigonometry are mainly used in the field of semiconductor product inspection, where large quantities of three-dimensional shape measurements are made daily in factories and fine measurements are also required. The light source and the drive circuit, which are components of three-dimensional measurement equipment based on this optical trigonometry, produce heat generated by prolonged operation, and may be exposed to conditions where the ambient temperature is not constant, resulting in temperature-induced measurement errors. In this study, the compensation method of the Thermal Errors for Phase Measuring Profilometry is proposed. Three-Dimensional Shape Measurement Equipment based on Phase Measuring Profilometry is implemented to measure the height of an object and ambient temperature for 10 Hours, and a regression line was obtained line by making simple linear regression using measured temperature and height values. This regression line was used to correct the error of the height measurement according to the temperature, and thermal error was from 139.88 um(Micrometer) to 13.12 um.

3-D Measurement of LED Packages Using Phase Measurement Profilometry (위상측정법을 이용한 LED Package의 3차원 형상 측정)

  • Koo, Ja-Myoung;Cho, Tai-Hoon
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.1
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    • pp.17-22
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    • 2011
  • LEDs(Light Emitting Diodes) are becoming widely used and increasingly in demand. Quality inspection of the LEDs has become more important. Two-dimensional inspection systems are limited in inspection capability, so threedimensional(3-D) inspection systems are needed. In this paper, a cost-effective and simple 3-D measurement system of LED packages using phase measuring profilometry(PMP) is proposed. The proposed system uses a pico projector to project sinusoidal fringe patterns and to shift phases instead of piezocrystal. It was evaluated using extremely accurate gauge blocks, yielding excellent repeatability of about 12 um(3-sigma). 3-D measurements of various LED packages were performed to demonstrate the applicability and efficiency of the proposed system.