• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.379-385
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• 1996

Adhesion of Cu/Cr and Cu/$Cu_xCr_{1-x}$ thin films onto polyimide substrates has been studied. For an adhesion layer, Cr or Cu-Cr alloy films were deposited onto polyimide using DC magnetron sputtering machine. Then Cu was sputter-deposited and finally, Cu was electroplated. Adhesion was evaluated using $90^{\circ}C$ peel test or T-peel test. Plastic deformation of the peeled metal layer was qualitatively measured using XRD technique. It is confirmed that high interfacial fracture energy and large plastic deformation are important to enhance the peel adhesion strength. High peel strength is obtained when the interface is strongly bonded. More ductile film has higher peel strength. In Cu-Cr alloy films, opposite effects of the Cr addition in the alloy film on the peel strength are operative: a beneficial effect of strong interfacial bonding and a negative effect of smaller plastic deformation.

• Korean Journal of Materials Research
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• v.15 no.7
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• pp.458-464
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• Korean Journal of Materials Research
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• v.15 no.1
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• pp.42-46
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• Food Science of Animal Resources
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• v.35 no.3
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• pp.277-285
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• 2015

This study was conducted to investigate the effects of kimchi powder and onion peel extract on the quality characteristics of emulsion sausage manufactured with irradiated pork. The emulsion sausages were formulated with 2% kimchi powder and/or 0.05% onion peel extract. The changes in pH value of all treatments were similar, depending on storage periods. The addition of kimchi powder increased the redness and yellowness of the emulsion sausage. The addition of onion peel extract decreased the thiobarbituric acid reactive substances value of the emulsion sausages prepared with irradiated pork. The volatile basic nitrogen value of the emulsion sausage prepared with kimchi powder was the highest, whereas that of the emulsion sausage prepared with onion peel extract was the lowest. The treatment without kimchi powder or onion peel extract and the treatments prepared with onion peel extract showed lower microbial populations than the other treatment. Sensory evaluations indicated that a higher acceptability was attained when kimchi powder was added to the emulsion sausages manufactured with irradiated pork. In conclusion, our results suggest that combined use of kimchi powder and onion peel extract could improve quality characteristics and shelf stability of the emulsion sausage formulated with irradiated pork during chilled storage.

• Korean Journal of Materials Research
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• v.18 no.9
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• Current Photovoltaic Research
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• v.4 no.2
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• pp.59-63
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• 2016

A key point of a soldering process for photovoltaic (PV) modules is to increase an adhesive strength leading a low resistivity between ribbon and cell. In this study, we intended to optimize a heating condition for the soldering process and characterize the soldered joint via physical and chemical analysis methods. For the purpose, the heating conditions were adjusted by IR lamp power, heating time and hot plate temperature for preheating a cell. Since then the peel test for the ribbon and cell was conducted, consequently the peel strength data shows that there is some optimum soldering condition. In here, we observed that the peel strength was modified by increasing the heating condition. Such a soldering property is affected by a various factors of which the soldered joint, flux and bus bar of the cell are changed on the heating condition. Therefore, we tried to reveal causes determining the soldering property through analyzing the soldered interface.

• Applied Chemistry for Engineering
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• v.10 no.1
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• pp.93-97
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• 1999

In order to lower the surface energy of unsaturated polyester(UPE) resin, small amount of siloxane-ester copolymers were incorporated. The copolymers were synthesized by a condensation polymerization using ethylene glycol and hydroxy termintated polydimethylsiloxane as diols and maleic anhydride and phthalic anhydride as dibasic acids. The modified UPE resin surface was characterized by dynamic contact angle (DCA), peel strength measurements of pressure sensitive adhesives and X-ray photoelectron spectroscopy(ESCA). As the copolymer content in the blend and PDMS content in the copolymer are increased, both advancing and receding contact angles against water are increased. The strength required to peel-off the pressure sensitive adhesive tape from the modified UPE resin decreased dramatically with the addition of the copolymer. ESCA results indicated that polydimethylsiloxane segments are predominated at the outer surface of the modified UPE resin.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.59-64
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• 2022

Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.

• Journal of the Korean Society for Nondestructive Testing
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• v.1 no.1
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• pp.22-31
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• 1981

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.5
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• pp.9-15
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• 2022

Discarded bio-wastes, such as seeds and rinds, cause environmental problems. Multiple studies have recycled bio-wastes as eco-friendly energy sources to solve these problems. This study uses bio-waste to fabricate a mandarin peel powder based triboelectric nanogenerator (MPP-TENG). The MPP-TENG is based on the contact separation mode. It generates an open-circuit voltage and short-circuit current of 156V and 2µA, respectively. In addition, MPP-TENG shows stable operation over continuous 3000s without any deviation in output. Also, the device exhibits maximum power density of 5.3㎼/cm² when connected to a resistance of 100MΩ. In an energy storage capacity test for 1000s, the MPP-TENG stores an energy of 171.6µJ in a 4.7µF capacitor. The MPP-TENG can power 9 blue LEDs and 54 green lettering LEDs. These results confirm that the MPP-TENG can provide a new avenue for eco-friendly energy harvesting device fabrication.