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http://dx.doi.org/10.6117/kmeps.2022.29.2.059

Effects of Film Stack Structure and Peeling Rate on the Peel Strength of Screen-printed Ag/Polyimide  

Lee, Hyeonchul (STATS ChipPAC Korea LTD.)
Bae, Byeong-Hyun (VITZROTECH Co., Ltd.)
Son, Kirak (DMC Convergence Research Department, Electronics and Telecommunications Research Institute)
Kim, Gahui (School of Materials Science and Engineering, Andong National University)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.29, no.2, 2022 , pp. 59-64 More about this Journal
Abstract
Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of the peeling rate. When EP Cu was peeled at EP Cu/SP-Ag/PI structure, the peel strength continuously increased as peeling rate increased. Considering uniaxial tensile test results of EP Cu/SP-Ag film with respect to loading rate, the increase of 90° plastic bending energy and peel strength was attributed to increased flow stress and toughness. On the other hand, viscoelastic PI film showed little variation of flow stress and toughness with respect to loading rate, which was assumed to result in nearly constant 90° plastic bending energy and peel strength.
Keywords
Printer electronics; peel test; screen-printed Ag; polyimide; peeling rate;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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