• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2006.11a
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• pp.119-123
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• 2006

The ionic-polymer-metal-composite actuators have the best merit for bio-mimetic locomotion because of their large bending performance. Especially, they have the advantage for mimicking a fish-like motion because IPMCs are useful to be actuated in water. So we have developed IPMC actuators with multiple electrodes for realization of biomimetic motion. Generally, the IPMC actuator has been fabricated in electroless plating technique, while it needs very long fabrication time and shows poor repeatability in the actuation performance owing to the variables in chemical fabrication process. Therefore, the novel fabrication methods were investigated by combining electroless plating and electroplating techniques capable of patterning precisely. On the whole, two different methods were compared and analyzed with similar thickness level of Platinum electrodes. Present results show that mixing chemical reduction and electroplating can be a promising candidate for electrode patterning.

• Journal of Biomedical Engineering Research
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• v.30 no.2
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• pp.103-112
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• 2009

Neuron-on-a-Chip technology is based on advanced neuronal culture technique, surface micropatterning, microelectrode array technology, and multi-dimensional data analysis techniques. The combination of these techniques allowed us to design and analyze live biological neural networks in vitro using real neurons. In this review article, two underlying technologies are reviewed: Microelectrode array technology and Neuronal patterning technology. There are new opportunities in the fusion of these technologies to apply them in neurobiology, neuroscience, neural prostheses, and cell-based biosensor areas.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.824-831
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• 2014

In this study, structural variations and overlay errors caused by multiple patterning lithography techniques to print narrow parallel metal interconnects are investigated. Resistance and capacitance parasitic of the six lines of parallel interconnects printed by double patterning lithography (DPL) and triple patterning lithography (TPL) are extracted from a field solver. Wide parameter variations both in DPL and TPL processes are analyzed to determine the impact on signal propagation. Simulations of 10% parameter variations in metal lines show delay variations up to 20% and 30% in DPL and TPL, respectively. Monte Carlo statistical analysis shows that the TPL process results in 21% larger standard variation in delay than the DPL process. Crosstalk simulations are conducted to analyze the dependency on the conditions of the neighboring wires. As expected, opposite signal transitions in the neighboring wires significantly degrade the speed of signal propagation, and the impact becomes larger in the C-worst metals patterned by the TPL process compared to those patterned by the DPL process. As a result, both DPL and TPL result in large variations in parasitic and delay. Therefore, an accurate understanding of variations in the interconnect parameters by multiple patterning lithography and adding proper margins in the circuit designs is necessary.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.4
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• pp.124-130
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• 2008

Automatic layout decomposition techniques have been developed for double patterning technology (DPT). As CMOS manufacturing process scales down to 45nm and below, lithography resolution needs to be improved. DPT has been proposed to enhance the limitation of conventional lithography, by decomposing the layout design into two masks to relax the minimum spacing requirement. However, it is not always possible to decompose a layout into two masks. We have developed new automatic stitching techniques to resolve this problem. Experimental results show that the suggested techniques are promising in decomposing layouts for DPT.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.1
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• pp.116-122
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• 2012

The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1273-1275
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• 2005

The influence of oxygen plasma and octadecyltrichlorosilane (OTS) treatment of $SiO_2$ on the patterning of poly(3,4-ethylenedioxythiophene)/poly(4-styrenesulfonate) (PEDOT:PSS) is presented. A significant difference in surface energies between plasma treated and OTS treated $SiO_2$ was noted. Such heterogeneous surface energy guides PEDOT:PSS to wet and spread on the wettable region and to dewet and retract from other regions.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.1
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• pp.83-90
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• 2014

EHD (electro-hydro-dynamics) patterning was performed under atmospheric pressure at room temperature in a single step. The drop diameter smaller than nozzle diameter and applied high viscosity conductive ink in EHD patterning method provide a clear advantage over the piezo and thermal inkjet printing techniques. The micro electrode pattern was printed by continuous EHD patterning method using 3-type control parameters (input voltage, patterning speed, nozzle pressure). High viscosity (1000cps) conductive ink with 75wt% of silver nanoparticles was used. EHD cone type nozzle having an internal diameter of $50{\mu}m$ was used for experimentation. EHD jetting mode by input voltage and applied 1st order linear regression in stable jet mode was analyzed. The stable jet was achieved at the amplitude of 1.4~1.8 kV. $10{\mu}m$ micro electrode pattern was created at optimized parameters (input voltage 1.6kV, patterning speed 25mm/sec and nozzle pressure -2.3kPa).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.199-204
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• 2007

Hot embossing, one of Nanoimprint Lithography(NIL) techniques, has been getting attention as an alternative candidate of next generation patterning technologies by the advantages of simplicity and low cost compared to conventional photolithographies. A typical hot embossing usually, however, takes more than ten minutes for one cycle of the process because of a long thermal cycling. Over the last few years a number of studies have been made to reduce the cycle time for hot embossing or similar patterning processes. The target of this research is to develop an induction heating apparatus for heating a metallic micro patterning mold at very high speed with the large-area uniformity of temperature distribution. It was found that a 0.5 mm-thick nickel mold can be heated from $25^{\circ}C$ to $150^{\circ}C$ within 1.5 seconds with the temperature variation of ${\pm}5^{\circ}C$ in 4-inch diameter area, using the induction heating apparatus.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.2
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• pp.158-162
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• 2001

In this report, a new process for patterning of YBaCuO thin films, ICP(inductively coupled plasma) method, is described by comparing with existing wet etching method. Two 100㎛ wide and 2mm long YBaCuO striplines on LaAlO$_3$ substrates have been fabricated using two patterning techniques. And the properties were compared with the critical temperature and the SEM photography. Then, the critical temperatures of two samples were about 88 K, but the cross section of sample using ICP method was shaper than that using the wet etching method. ICP method can be used as a good etching technique process for patterning of YBaCuO superconductor.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.6
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• pp.36-40
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• 2009

Development of maskless lithography techniques can provide a potential solution for the photomask cost issue. Furthermore, it could open a market for small scale manufacturing applications. Since femtosecond lasers have been found suitable for processing of a wide range of materials with sub-micrometer resolution, it is attractive to use this technique for maskless lithography. As a femtosecond laser has recently been developed, both of high power and high photon density are easily obtained. The high photon density results in photopolymerization of photoresist whose absorption spectrum is shorter than that of the femtosecond laser. The maskless lithography using the two-photon absorption (TPA) makes micro structures. In this paper, we present a femtosecond laser direct write lithography for submicron PR patterning, which show great potential for future application.