한국생산제조학회지 (Journal of the Korean Society of Manufacturing Technology Engineers)

  • 제21권1호
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  • Pages.116-122
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  • 2012
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  • 2508-5093(pISSN)
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  • 2508-5107(eISSN)
한국생산제조학회 (The Korean Society of Manufacturing Technology Engineers)
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3차원 레이저 다이렉트 패터닝 시스템 개발

Development of Three Dimensions Laser Direct Patterning System

  • 백병만 (한국기계연구원 광응용기계연구실, 국민대학교 자동차공학전문대학원) ;
  • 이제훈 (한국기계연구원 나노시스템연구본부, 광응용기계연구실) ;
  • 신동식 (한국기계연구원 광응용기계연구실) ;
  • 이건상 (국민대학교 기계시스템공학부)
  • 투고 : 2011.10.06
  • 심사 : 2011.11.16
  • 발행 : 2012.02.15
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초록

The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.

키워드

참고문헌

  1. Lee, S. J., Kim, J. S., Shin, B. C., Kim, D. W., and Cho, M. W., 2010, "Development of a LDI System for the Maskless Exposure Process and Energy Intensity Analysis of Single Laser Beam," KSMTE, Vol. 19, No. 6, pp. 834-840.
  2. Lee, J., H., Suh, J., Shon, H., K., and Shin, D. S., 2006, "Ultra-short Pulse Laser Applications of Micromachining", KSMTE, Vol. 15, No. 1, pp. 834-840.
  3. Paik, B. M., Lee, J. H., Shin, D. S., and Lee, K. S., 2009, "A Study on Formation of Conductive Pattern on Polymer Using LDS," KSLP, Vol. 12, No. 4, pp. 6-11.
  4. Hon, K K. B., Li, L., and Hutchings, I. M., 2008, "Direct Writing Technology," Advances and developments CIRP Annals - Manufacturing Technology, Vol. 57, No. 2, pp. 601-620. https://doi.org/10.1016/j.cirp.2008.09.006
  5. Huske, M., Kickelhain, J., Muller, J., and Eber, G., 2001, "Laser Supported Activation and Additive Metallization of Thermoplastic for 3D-MIDS," Proceeding of the 3rd LANE 2001. pp. 1-12.
  6. Thomas, L., Soeren, H., and Bertram, S., 2009, "A Multilayer Process for Fine-pitch Assemblies on Molded Interconnect Devices (MIDs)," Circuit World, Vol. 35, No. 2, pp. 23-29. https://doi.org/10.1108/03056120910953286
  7. Islam, A., 2008, Two Component Micro Injection Moulding for Moulded Interconnect Devices, A Thesis for a Doctorate, Tchnical University of Denmark, Denmrk
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피인용 문헌

  1. Basic Research For The 3DCD (3D Circuit Devices) vol.31, pp.12, 2014, https://doi.org/10.7736/KSPE.2014.31.12.1061
  2. Conductivity Pattern Manufacture Technology of Solid Surface Compound Polymer Material vol.65, pp.3, 2016, https://doi.org/10.5370/KIEEP.2016.65.3.224
  3. Fabrication of 3D-Printed Circuit Device using Direct-Write Technology vol.15, pp.2, 2016, https://doi.org/10.14775/ksmpe.2016.15.2.001
  4. A Study of LASER Machining Error Based on the Threshold for Distributing the Machining Stage and Mirror Movement vol.27, pp.6, 2012, https://doi.org/10.7735/ksmte.2018.27.6.479
  5. Astigmatic Autofocus for Large Area Direct Laser Writing vol.29, pp.4, 2012, https://doi.org/10.7735/ksmte.2020.29.4.267
  6. High Density Patterning Using Laser on ABS Film with Heat Dissipation Layer vol.37, pp.9, 2012, https://doi.org/10.7736/jkspe.019.152