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Development of Three Dimensions Laser Direct Patterning System

3차원 레이저 다이렉트 패터닝 시스템 개발

  • 백병만 (한국기계연구원 광응용기계연구실, 국민대학교 자동차공학전문대학원) ;
  • 이제훈 (한국기계연구원 나노시스템연구본부, 광응용기계연구실) ;
  • 신동식 (한국기계연구원 광응용기계연구실) ;
  • 이건상 (국민대학교 기계시스템공학부)
  • Received : 2011.10.06
  • Accepted : 2011.11.16
  • Published : 2012.02.15

Abstract

The purpose of this study is on the development of 3-D conductive pattern fabrication system using laser. For development 3-D direct patterning system, we used the dynamic focusing, the laser power stabilizer and the auto aligning techniques. These technologies are already used commercially. However operation and control integrated system for 3-D direct patterning are not yet developed. The objective of this paper is to introduce laser direct structuring and develop the operating and integration system. Also we implemented new application of laser direct structuring.

Keywords

References

  1. Lee, S. J., Kim, J. S., Shin, B. C., Kim, D. W., and Cho, M. W., 2010, "Development of a LDI System for the Maskless Exposure Process and Energy Intensity Analysis of Single Laser Beam," KSMTE, Vol. 19, No. 6, pp. 834-840.
  2. Lee, J., H., Suh, J., Shon, H., K., and Shin, D. S., 2006, "Ultra-short Pulse Laser Applications of Micromachining", KSMTE, Vol. 15, No. 1, pp. 834-840.
  3. Paik, B. M., Lee, J. H., Shin, D. S., and Lee, K. S., 2009, "A Study on Formation of Conductive Pattern on Polymer Using LDS," KSLP, Vol. 12, No. 4, pp. 6-11.
  4. Hon, K K. B., Li, L., and Hutchings, I. M., 2008, "Direct Writing Technology," Advances and developments CIRP Annals - Manufacturing Technology, Vol. 57, No. 2, pp. 601-620. https://doi.org/10.1016/j.cirp.2008.09.006
  5. Huske, M., Kickelhain, J., Muller, J., and Eber, G., 2001, "Laser Supported Activation and Additive Metallization of Thermoplastic for 3D-MIDS," Proceeding of the 3rd LANE 2001. pp. 1-12.
  6. Thomas, L., Soeren, H., and Bertram, S., 2009, "A Multilayer Process for Fine-pitch Assemblies on Molded Interconnect Devices (MIDs)," Circuit World, Vol. 35, No. 2, pp. 23-29. https://doi.org/10.1108/03056120910953286
  7. Islam, A., 2008, Two Component Micro Injection Moulding for Moulded Interconnect Devices, A Thesis for a Doctorate, Tchnical University of Denmark, Denmrk
  8. LPKF Laser & Electronics AG, n.d., viewed 1 August 2011, .
  9. Eugene, H., 2002, Optic, Addison Wesley Longman, Inc, United States.

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