• Title/Summary/Keyword: Pattern inspection

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Development of an Accuracy-improved Vision Inspection System for BGA Solder Ball (정확도를 향상시킨 BGA 솔더볼 외관검사 기법 개발)

  • Huh, Kyung-Moo
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.47 no.6
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    • pp.80-85
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    • 2010
  • BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

Fuzzy Syntactic Pattern Recognition Approach for Extracting and Classifying Flaw Patterns from and Eddy-Current Signal Waveform

  • Kang, Soon-Ju
    • Journal of Electrical Engineering and information Science
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    • v.2 no.4
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    • pp.59-65
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    • 1997
  • In this paper, a general fuzzy syntactic method for recognition of flaw patterns and for the measurement of flaw characteristic parameters for a non-destructive inspections signal, called eddy-current, is presented. Solutions are given to the subtasks of primitive pattern selection, signal to symbol transformation, pattern grammar formulation, and event-synchronous flaw pattern extraction based on the grammars. Fuzzy attribute grammars are used as the model for the pattern grammar because of their descriptive power in the face of uncertain constraints caused by nose or distortion in the signal waveform, due to their ability to handle syntactic as well as semantic information. This approach has been implemented and the performance of eh resultant system has been evaluated using a library of law patterns obtained from steam generator tubes in nuclear power plants by an eddy current-based non-destructive inspection method.

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Feature Impact Evaluation Based Pattern Classification System

  • Rhee, Hyun-Sook
    • Journal of the Korea Society of Computer and Information
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    • v.23 no.11
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    • pp.25-30
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    • 2018
  • Pattern classification system is often an important component of intelligent systems. In this paper, we present a pattern classification system consisted of the feature selection module, knowledge base construction module and decision module. We introduce a feature impact evaluation selection method based on fuzzy cluster analysis considering computational approach and generalization capability of given data characteristics. A fuzzy neural network, OFUN-NET based on unsupervised learning data mining technique produces knowledge base for representative clusters. 240 blemish pattern images are prepared and applied to the proposed system. Experimental results show the feasibility of the proposed classification system as an automating defect inspection tool.

A study on the Precision Pattern Measurement Based on Gradient Transition Vector (그라디언트 변이 벡터 기반 패턴 측정에 관한 연구)

  • Kim, Gyung Bum
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.3
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    • pp.45-50
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    • 2021
  • The adjustment of lens magnification can make the degree of precision in pattern measurement be improved, but several problems such as high cost, smaller field of view and stage error accumulation are followed. In this paper, a method for precisely measuring patterns is proposed based on gradient transition vector, in order to solve these problems. The performance of our method is evaluated using pattern images with several directions. Also, it is compared with previous methods based on edge and gray-level moment. It is judged that the proposed method outperforms consistent pattern width results, and so could be applied to automation processes for measurement and inspection of precise and complexed patterns in IT, BT industry products.

The Neural-Network Approach to Recognize Defect Pattern in LED Manufacturing

  • Chen, Wen-Chin;Tsai, Chih-Hung;Hsu, Shou-Wen
    • International Journal of Quality Innovation
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    • v.7 no.3
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    • pp.58-69
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    • 2006
  • This paper presents neural network-based recognition system for automatic light emitting diode (LED) inspection. The back-propagation neural network (BPNN) is proposed and tested. The current-voltage (I-V) characteristic data of LED from the inspection process is used for the network training and testing. This study selects 300 random samples as network training and employs 100 samples as network testing. The experimental results show that if the classification work is done well, the accuracy of recognition is 100%, and the testing speed of the proposed recognition system is almost one half faster than the traditional inspection system does. The proposed neural-network approach is successfully demonstrated by real data sets and can be effectively developed as a recognition system for a practical application purpose.

Development of Real-Time Under Vehicle Inspection System Engine by Image Identification Event (영상 판독 이벤트 신호로 제어되는 실시간 차량하부 검사 시스템 엔진 개발)

  • Jeon, Ji-Hye;Yang, Ji-Hee;Jang, Ji-Woong;Park, Goo-Man
    • Journal of Satellite, Information and Communications
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    • v.10 no.3
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    • pp.16-21
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    • 2015
  • In this paper, we presented Under Vehicle Inspection System by comparing two image signals. Two signals are generated by license plate number and under-vehicle pattern recognition. The test shows reliable precision within real-time of 2.8sec, which can be applicable commercially. In the future, more research will be conducted to enhance the precision by automatic image balance in many challenging situations.

A study on the automatic wafer alignment in semiconductor dicing (반도체 절단 공정의 웨이퍼 자동 정렬에 관한 연구)

  • 김형태;송창섭;양해정
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.12
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    • pp.105-114
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    • 2003
  • In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.

A Study on The Visual Inspection of Fabric Defects (시각 장치를 이용한 직물 결함 검사에 관한 연구)

  • Kyung, Kye-Hyun;Ko, Myoung-Sam;Lee, Sang-Uk;Lee, Bum-Hee
    • Proceedings of the KIEE Conference
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    • 1988.07a
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    • pp.959-962
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    • 1988
  • This paper describes an automatic visual inspection system for fabric defects based on pattern recognition techniques. The inspection for fabric defects can be separated into three sequences of operations which are the detection of fabric defects[1], the classification of figures of fabric defects, and the classification of fabric defects. Comparing projections of defect-detected images with the predefined complex, the classification accuracy of figures of fabric defects was found to be 95.3 percent. Employing the Bayes classifier using cluster shade in SGLDM and variance in decorrelation method as features, the classification accuracy of regional figure defects was found to be 82.4 percent. Finally, some experimental results for line and dispersed figures of fabric defects are included.

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Development of Remocon Appearance Inspection System Using Automated Machine Vision (자동화된 머신비전을 이용한 리모컨 외관 검사 시스템 개발)

  • Kang, Su-Min;Park, Se-Hyuk;Huh, Kyung-Moo
    • Proceedings of the IEEK Conference
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    • 2006.06a
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    • pp.389-390
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    • 2006
  • The goal of this paper is automation of a remocon inspection process using machine vision system. This system prevents error that is occurred by physical and spirit condition of human. Also this system has been developed to raise the reliability of remocon inspection. This system has been developed only using PC, CCD Camera and Visual C++ for universal workplaces. The performance of this system is an accuracy improvement of $2{\sim}3[%]$ and a processing time reduction of about 100[ms] against existing pattern matching method.

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PCB Defects Detection using Connected Component Classification (연결 성분 분류를 이용한 PCB 결함 검출)

  • Jung, Min-Chul
    • Journal of the Semiconductor & Display Technology
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    • v.10 no.1
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    • pp.113-118
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    • 2011
  • This paper proposes computer visual inspection algorithms for PCB defects which are found in a manufacturing process. The proposed method can detect open circuit and short circuit on bare PCB without using any reference images. It performs adaptive threshold processing for the ROI (Region of Interest) of a target image, median filtering to remove noises, and then analyzes connected components of the binary image. In this paper, the connected components of circuit pattern are defined as 6 types. The proposed method classifies the connected components of the target image into 6 types, and determines an unclassified component as a defect of the circuit. The analysis of the original target image detects open circuits, while the analysis of the complement image finds short circuits. The machine vision inspection system is implemented using C language in an embedded Linux system for a high-speed real-time image processing. Experiment results show that the proposed algorithms are quite successful.