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A study on the automatic wafer alignment in semiconductor dicing  

김형태 (한양대학교 대학원 정밀기계공학과)
송창섭 (한양대학교 기계공학부)
양해정 (한국산업기술대학교 기계설계학과)
Publication Information
Journal of the Korean Society for Precision Engineering / v.20, no.12, 2003 , pp. 105-114 More about this Journal
Abstract
In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.
Keywords
Automatic alignment; Wafer processing; Semiconductor manufacturing; Dicing machine; Vision inspection; Dual camera;
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1 Cohen, M.S., DeFranze, M.J., Canora, F.J., Cina, M.F., 'Improvement in Index Alignment Method for Laser-Fiber Array Packaging,' IEEE Trans. on Components, Packaging and Manufacturing Technology-Part B, Vol. 17, No. 3, pp. 402-411, 1994   DOI
2 Uchida N.R., Ishibashi, Y.Y., Kikuiri, N,T., Tabata, M.T. and Hirano, R.C., 'A dual grating alignment method insensitive to mask-wafer gap variation,' J. of the JSPE, Vol. 54, No. 10, pp. 123-128, 1988
3 Akiyama, N.Y., 'Precision position detecting technique for alignment mark applied in a step-and-repeat projection aligner (3rd Report),' J. of the JSPE, Vol. 57, No. 5, pp. 75-81, 1991
4 Gruber, M., Hagedorn D., Eckert W., 'Precise and simple optical alignment method for double-sided lithography,' Applied Optics, Vol. 40, No. 28, pp. 5052-5055, 2001   DOI
5 Liao, J.B., M. Wu, H., Baines, R.W., 'A coordinate measuring machine vision system,' Computers in Industry, Vol. 38, No. 3, pp. 239-248, 1999   DOI   ScienceOn
6 Yuan, C.M., Strojwas, A.J., 'Modeling Optical Equipment for wafer Alignment and Line-Width Measurement,' IEEE Trans. on Semiconductor Manufacturing, Vol. 4, No. 2, pp. 99-110, 1991   DOI   ScienceOn
7 Herwig, M., 'Virtual Automation Environments,' Marcel Dekker, Inc., pp. 43-48, 2002
8 Gong, Y.T., 'A method to measure the alignment accoracy on automated visual inspection system,' PH.D. Thesis, Seoul Univ., pp. 10-16, 1993
9 Hong, J.H., Jin, K.H., Kim, K.K., Lee S.H., Choi, B.Y., Lee, Y.J., Lee,S.H.A., 'Study on hign speed. high precision auto-alignment system using vision system,' Proc. of IEEK Fall Conference, Vol. 21, No. 2, pp. 457-459, 1998
10 Han, S.J., Pak, J.H., Pak, H.J., 'Development of Three D.O.F Allignment Stage for Vacuum Environment,' J. of KSPE, Vol. 18, No. 11, pp. 138-147, 2001   과학기술학회마을