• Applied Chemistry for Engineering
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• v.29 no.4
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• pp.484-487
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• 2018

In this paper, the optical and electrical properties of ytterbium films were studied for water vapor transmission rate (WVTR) analysis of encapsulation films used in organic electronic devices. Ytterbium thin films show a wide range of light transmittance (70-10%) and resistivity ($6.0-0.16m{\Omega}{\cdot}cm$) depending on various film thicknesses (20-100 nm). The Yb thin films were oxidized with moisture and its transmittance and resistance changed in real time. As a result, the WVTR of parylene and aluminum nitride (AlN) laminated thin encapsulation film was measured to be $4.3{\times}10^{-3}g/m^2{\cdot}day$ with the 25 nm thick ytterbium thin film.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.136-139
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• 2002

Previous valves have initial gap problem, high voltage or high pressure problem. In this paper, various micro valves with free floating structure have been fabricated and tested to solve the initial gap and high pressure problems. The paper presents how to etch Parylene-C which is a valve cap material without A1 mask layer. The maximum flow-rate of fabricated micro valve is$118{\mu\ell}$/min with $370{\mu}m$ orifice size and the leakage at the initial and reverse pressure is not observed.

• Journal of Information Display
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• v.7 no.3
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• pp.27-30
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• 2006

This paper presents a comprehensive study on threshold voltage $(V_{th})$ control of organic thin-film transistors (OTFTs) with dual-gate structure. The fabrication of dual-gate pentacene OTFTs using plasma-enhanced atomic layer deposited (PEALD) 150 nm thick $Al_{2}O_{3}$ as a bottom gate dielectric and 300 nm thick parylene or PEALD 200 nm thick $Al_{2}O_{3}$ as both a top gate dielectric and a passivation layer was investigated. The $V_{th}$ of OTFT with 300 nm thick parylene as a top gate dielectric was changed from 4.7 V to 1.3 V and that with PEALD 200 nm thick $Al_{2}O_{3}$ as a top gate dielectric was changed from 1.95 V to -9.8 V when the voltage bias of top gate electrode was changed from -10 V to 10 V. The change of $V_{th}$ of OTFT with dual-gate structure was successfully investigated by an analysis of electrostatic potential.

• Transactions on Electrical and Electronic Materials
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• v.4 no.5
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• pp.15-18
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• 2003

The Cd$\_$1-x/Zn$\_$x/Te film was produced by thermal evaporation for the flat-panel X-ray detector. The crystal structure and the surface morphology of poly crystalline Cd$\_$1-x/Zn$\_$x/Te film were examined using XRD and SEM, respectively. The leakage current and X-ray sensitivity of the fabricated films were measured to analyze the X-ray response characteristic of Zn in a polycrystalline CdZnTe thin film. The leakage current and the output charge density of Cd$\_$0.7/Zn$\_$0.3/Te thin film were measured to 0.3 1nA/$\textrm{cm}^2$ and 260 pC/$\textrm{cm}^2$ at an applied voltage of 2.5 V/$\mu\textrm{m}$, respectively. Experimental results showed that the increase of Zn doping rates in Cd$\_$1-x/Zn$\_$x/Te detectors reduced the leakage current and improved the X-ray sensitivity significantly. The leakage current was drastically diminished by the formation of thin parylene layer in the Cd$\_$0.7/Zn$\_$0.3/Te detector.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.345-345
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• 2007

본 연구는 x선 영상검출기 적용을 위한 $HgI_2$ 필름의 누설전류 특성 향상을 위한 연구로서, $HgI_2$기반의 다양한 물질을 이용하여 다층구조 방식으로 제작된 필름의 누설전류 특성평가 및 제작된 다층구조의 상부전극물질의 변화에 따른 누설전류 특성을 평가하였다. $HgI_2$기반 다층구조의 제작 물질은 Parylene, $PbI_2$, a-Se을 사용하여 시편(parylene/ITO, ITO/$HgI_2/PbI_2$/ITO, ITO/$HgI_2$/a-Se/ITO)을 제작하였으며, 필름 제작공정은 Screen print, PVD공정으로 다층구조 필름을 제작하였다. 또 한, 다층구조로 제작된 필름에 상부 전극물질은 Au, In, ITO를 사용하여 누설전류의 특성을 평가하였다. 측정 장치로 DC Power Supply(556H. EG&G : 50~200V), X 선 발생장치(Toshiba KXO-50N), 차폐체 (Al 및 Cu), Oscilloscope (LeCroy, LC334AM, USA), Electrometer (Keithley, 6517), Ion chamber 2060 (Radical Co.)을 이용하여, 제작된 $HgI_2$기반 다층구조 sample의 누설전류 특성을 실험하였다. 이 결과로 다층구조에 제작된 물질 및 상부전극에 따른 누설전류의 특성을 평가하였다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.05a
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• pp.1051-1054
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• 2000

We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2＊0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5＊2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.506-508
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• 2005

In general, organic TFTs are comprised of four components: gate electrode, gate dielectric, organic active semiconductor layer, and source and drain contacts. The TFT current, in turn, is typically determined by channel length and width, carrier field effect mobility, gate dielectric thickness and permittivity, contact resistance, and biasing conditions. More recently, a number of techniques and processes have been introduced to the fabrication of OTFT circuits and displays that aim specifically at reduced fabrication cost. These include microcontact printing for the patterning of metals and dielectrics, the use of photochemically patterned insulating and conducting films, and inkjet printing for the selective deposition of contacts and interconnect pattern. In the fabrication of organic TFTs, microcontact printing has been used to pattern gate electrodes, gate dielectrics, and source and drain contacts with sufficient yield to allow the fabrication of transistors. We were fabricated a pentacene OTFTs on flexible PEN film. Au/Cr was used for the gate electrode, parylene-c was deposited as the gate dielectric, and Au/Cr was chosen for the source and drain contacts; were all deposited by ion-beam sputtering and patterned by microcontact printing and lift-off process. Prior to the deposition of the organic active layer, the gate dielectric surface was treated with octadecyltrichlorosilane(OTS) from the vapor phase. To complete the device, pentacene was deposited by thermal evaporation and patterned using a parylene-c layer. The device was shown that the carrier field effect mobility, the threshold voltage, the subthreshold slope, and the on/off current ratio were improved.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.973-974
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• 2004

We report the fabrication of flexible plastic ITO substrates and the measurement of oxidant permeation through the substrates. The plastic ITO substrates are composed of multiple organic and inorganic thin films. The organic thin films are deposited by vapor polymerization and the inorganic films are deposited by ion beam sputtering. In order to estimate the oxidant permeation rate, the pure Ca film is formed on the substrates and the amount of CaO produced by the oxidation of Ca is measured.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.27-30
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• 2002

Photoconductor for direct detection flat-panel imager present a great materials challenge, since their requirements include high X -ray absorption, ionization and charge collection, low leakage current and large area deposition. Selenium is practical material. But it needs high thickness and high voltage in selenium for high ionization rate. We report comparative studies of detector sensitivity. One is an a-Se with $70{\mu}m$ thickness on glass. The other has hybrid layer of depositting ZnS phosphor with $100{\mu}m$ on a-Se. The leakage current of hybrid is similar to it of a-Se, but photocurrent is lager than a-Se. Both of them have high spatial resolution, but hybrid has higher sensitivity than a-Se at comparable bias voltage.