• KSII Transactions on Internet and Information Systems (TIIS)
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• v.14 no.7
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• pp.2938-2956
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• 2020

Objective image quality assessment (IQA) models have been developed by effective features to imitate the characteristics of human visual system (HVS). Actually, HVS is extremely sensitive to color degradation and complex texture changes. In this paper, we firstly reveal that many existing full reference image quality assessment (FR-IQA) methods can hardly measure the image quality with contrast and masking texture changes. To solve this problem, considering texture masking effect, we proposed a novel FR-IQA method, called Texture and Color Quality Index (TCQI). The proposed method considers both in the masking effect texture and color visual perceptual threshold, which adopts three kinds of features to reflect masking texture, color difference and structural information. Furthermore, random forest (RF) is used to address the drawbacks of existing pooling technologies. Compared with other traditional learning-based tools (support vector regression and neural network), RF can achieve the better prediction performance. Experiments conducted on five large-scale databases demonstrate that our approach is highly consistent with subjective perception, outperforms twelve the state-of-the-art IQA models in terms of prediction accuracy and keeps a moderate computational complexity. The cross database validation also validates our approach achieves the ability to maintain high robustness.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.35-41
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• 2022

In the era of Fifth-Generation (5G), technology requirements such as Artificial Intelligence (AI), Cloud computing, automatic vehicles, and smart manufacturing are increasing. For high efficiency of electronic devices, research on high-intensity circuits and packaging for miniaturized electronic components is important. A solder paste which consists of small solder powders is one of common solder for high density packaging, whereas an electroplated solder has limitation of uniformity of bump composition. Researches are underway to improve wettability through the addition of nanoparticles into a solder paste or the surface finish of a substrate, and to suppress the formation of IMC growth at the metal pad interface. This paper describes the principles of improving the wettability of solder paste and suppressing interfacial IMC growth by addition of nanoparticles.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.17-29
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• 2023

In this paper, a method for evaluating the reliability of solder joints is introduced, as they play a crucial role in packaging technology due to the miniaturization and high-performance requirements of electronic device. Firstly, properties of solder based on various alloy compositions and solder types are described, followed by an analysis of solder joint structures in different packages. Next, the influence of solder alloy composition and microstructure on the thermal and mechanical properties of solder is analyzed, and solder creep behavior is briefly introduced. Subsequently, analytical techniques considering creep models and fatigue models for reliability evaluation are presented, and various ways to improve the reliability of solder joints are discussed. This study is expected to provide valuable information for evaluating and enhancing the reliability of solder joints in the semiconductor packaging technology field.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.1-5
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• 1999

To improve freshness maintenance function of food containers, many methods have been applied. Most of the methods utilize absorption properties of porous ceramics powders. However, this kind of methods was appeared to be a non-realistic one because of the short effective periods of the produce and reduced die life due to the ceramic powders mixed in the raw materials. Other methods, e.g., CA or MA, need more study for practical application bemuse of the high cost in process. In addition to this, different method should be applied depends on foods. In this paper, a new technology based on information templation was applied in making a food preservation film. It has been known recently that water memorizes informations and this information could be tempelated to other materials through appropriate pretest. One of the participating company developed this process to template informations to PE materials unitizing water as an information rallier. Food packaging film was made using this PE chips. Experimental results of freshness maintenance test of foods showed that it is effective. Results and disussions are reported in this paper.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.2
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• pp.109-115
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• 2013

Glass bottle lightness index has been used as a guideline for the lightness of glass bottle. In this study, we developed a glass bottle lightness index (L) by modifying Emhart's lightness index. Domestic and foreign glass bottle products were collected in Korean market and classified into two groups, returnable bottle and one way glass bottle. Emptied glass bottle weight and volume were measured and written product's content volume were recorded to calculate the L value. Based on L value, 'acceptable' and 'optimum' criteria for design guideline of glass bottle were established for both returnable and one way glass bottles. Many of one way glass bottles failed to meet acceptable criteria (L=1.0), while returnable glass bottles mostly satisfied acceptable range (L=1.4). Few of one way glass bottles were even heavier than returnable glass bottles. Generally lightness index (L) of small size drink glass bottles (100 ml) were above 1.0, while these of juice glass bottles (180 ml) were close to acceptable criteria. Most foreign sauce glass bottles met the acceptable level, however most domestic souse glass bottles failed to satisfy acceptable criteria. A few foreign beer glass bottles satisfied optimum criteria, while most domestic beer glass bottles were acceptable level. Our results reveal that domestic glass bottles are mostly heavier than foreign glass bottles. In this paper, we suggest the use glass bottle lightness index as a design guideline for material resource reduction of glass bottle for Korean food and beverage industries.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.11-18
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• 2022

Recently, as flexible electronic device-related technologies have received worldwide attention, the development of wiring and bonding technologies using liquid metals is required in order to improve problems such as formability in the manufacturing process of flexible devices and performance and durability in the bending state. In response to these needs, various studies are being conducted to use gallium and gallium-based alloys (eutectic Ga-In and eutectic Ga-In-Sn, etc.) liquid metals, with low viscosity and excellent electrical conductivity without toxicity, as low-temperature bonding materials. In this paper, the latest research trends of low-temperature bonding technology using gallium and gallium-based alloys are summarized and introduced. These technologies are expected to become important base technologies for practical use in the fields of manufacturing flexible electronic devices and low-temperature bonding in microelectronic packages in the future.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.2
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• pp.81-85
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• 2013

The stored-product insects have been a serious problem during the entire process of distribution on the food industry. Especially, the Indian meal moth (Plodia interpunctella) is one of stored-product insects which causes harm through penetrating into the food packaging. The objective of this study was to develop the anti-insect packaging material with fennel (Foeniculum vulgare) oil (FO). The FO has been selected for insecticidal substance against P. interpunctella, which was tested by fumigant toxicity assay. An anti-insect sachet was prepared by FO and filterpaper placed in a small paper bag. Repellent test was performed to evaluate the repellent activity of anti-insect sachet. In addition, the controlled release of FO from the anti-insect sachet was determined at $28^{\circ}C$ by gas chromatography (GC). It was demonstrated that FO was an effective substance against P. interpunctella. The mortality of FO was 56% at 800 mg/0.5 L in 120 h. In repellent test, the FO sachet showed effective repellency against P. interpunctella. The developed anti-insect sachet could be a promising source for insect repellent materials in food packaging.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.19-25
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• 2008

In this paper, the front end module (FEM) was proposed for 2.4GHz WLAN band by LTCC multilayer application. The FEM was composed of power amplifier IC, switch IC, and LTCC module. LTCC module consists of output matching circuit and lowpass filter as Tx part, bandpass filter as Rx part. Design of output matching circuit for LTCC was used matching parameter from output matching circuit based on lumped circuit on the PCB board. The dielectric constant of LTCC substrate is 9. The substrate was composed of total 26 layers with each 30um thickness. Ag paste was used for the internal pattern as the conductor material. The size of the module is $4.5mm{\times}3.2mm{\times}1.4mm$. The fabricated FEM showed the gain of 21dB, ACPR of less than -31dBc first side lobe and Less than -59dBc second side lobe and the output power of 23Bm at P1dB.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.1
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• pp.43-49
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• 2023

This study reports on the preparation of sodium caseinate-cardanol (CasNa/CL)-based papers coated with different amounts of bentonite (BN) for use as a sustainable packaging material. Their chemical and morphological structures, mechanical properties, water vapor permeability, surface properties, and antioxidant activity of coated papers was assessed as a function of the BN content. The drying of the CasNa/CL coated papers led to the formation of pinholes on their surfaces owing to the presence of trapped water resulting from the difference in the drying rate between the external surface and the inside of the coated layers. Increasing the BN content reduced the pinholes on surface of CasNa/CL/BN coated papers and highly decreased the water vapor transmittance rate of the papers from 387.3±1.9 g/m²·day to 269.25±4.5 g/m²·day. Free radical scavenging assays indicated the addition of CL to the CasNa exhibited the antioxidant activity and antioxidant activity of CasNa/CL/BN did not changed as increase of BN contents. The improved water vapor barrier property and antioxidant activity of CasNa/CL/BN coated papers can be promised for various packaging applications.