• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.23-33
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• 1999

A finite element method was employed fort thermal and stress analyses of an IGBT module of 3-phase full bridge. The effect of material parameters such as substrate material, substrate area, solder thickness on the temperature and stress distributions of the module packages has been investigated. Thermal analysis results have also been compared by setting of boundary conditions such as equivalent heat transfer coefficient or constant temperature at a base metal surface of the package. The increase of ceramic substrate area up to 3 times does little contribution to the reduction(8.9%) of thermal resistance, while contributed a lot to the reduction(60%) of thermal stress. Thicker solder resulted in higher thermal resistance but did slightly reduced thermal stresses. It is revealed by the stress analysis that maximum stress was induced at the region of copper pads which are bonded with ceramic substrate.

• Korean Journal of Materials Research
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• v.18 no.1
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• pp.45-50
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• 2008

Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and $180^{\circ}C$ for 300hrs. The $AlAu_4$ phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, $AuSn_2,\;and\;AuSn_4$ phases formed at interface between the Au stud and Sn. $AuSn_2,\;AuSn_2/AuSn_4$, and AuSn phases dominantly grew as the aging time increased at $120^{\circ}C,\;150^{\circ}C,\;and\;180^{\circ}C$, respectively, while $(Au,Cu)_6Sn_5/Cu_3Sn$ phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at $AlAu_4/Au$, Au/Au-Sn IMC, and $Cu_3Sn/Cu$ interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1035-1040
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• 2010

The research efforts on GaN-based light-emitting diodes (LEDs) keep increasing due to their significant impact on the illumination industry. Surface mount technology (SMT) is widely used to mount the LED packages for practical application. In surface mount soldering both the device body and leads are intentionally heated by a reflow process. We studied on the effects of multiple reflows on microstructural variation and joint strength of the solder joints between the LED package and the substrate. In this study, Pb-free Sn-3.0Ag-0.5Cu solder and a finished pad with organic solderability preservatives (OSP) were employed. A $Cu_6Sn_5$ intermetallic compound (IMC) layer was formed during the multiple reflows, and the thickness of the IMC layerincreased with an increasing number of reflows. The shear force decreased after three reflows. From the observation of the fracture surface after a shear test, partially brittle fractures were observed after five reflows.

• Korean Journal of Optics and Photonics
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• v.19 no.4
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• pp.315-319
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• 2008

We investigate theoretically the power consumption of a notch filter using a thermo-optic long-period grating, which is induced by a heater array consisting of periodic heaters and pads made of metal thin-film. Since the power consumed by the heater array is converted to joule heat that generates the thermo-optic long-period grating, the characteristics of the notch filter are dynamically controlled by adjusting it. The power necessary for appropriate coupling efficiency depends on the parameters of the heater array, which are the width and length of a heater, pad width, and the thickness of the thin-film. We explain an approximate method of analyzing the influence of the parameters on the consumed power. Using the analysis method, we simulate the change of the power depending on the parameters. From the simulation, we suggest a few guidelines on the parameters required to reduce the power.

• Fashion & Textile Research Journal
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• v.25 no.5
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• pp.593-602
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• 2023

This study aimed to facilitate the use of virtual technologies such as sewing, appearance, and material expression in 3D virtual wear programs. For product production and education, we expounded how to express the shoulder shape and silhouette of sleeve-expanded power shoulder jackets. Two designs of sleeve-expanded power shoulder jackets were selected, and virtual jackets were produced using a virtual avatar based on the body dimensions of female subjects in their 20s. The essential purpose of a 3D virtual power shoulder jacket is to express the shoulder angle rise and shoulder width, which are much wider than the avatar's shoulder. Therefore, the virtual pad values were adjusted for the collision and rendering of each thickness. In addition, the position and angle of the virtual pads were controlled through simulation. Appearance similarity was evaluated using photographic data and the virtual jackets. For the set-in sleeve virtual power shoulder jacket, the wrinkle expressions of the torso and sleeve were rated as moderate, and material expression was slightly insufficient. The similarity of some ease and width items of the torso was tightly expressed, and the overall appearance, positions of lines, and details of jackets were rated high, especially at the neck and sleeve shapes. In the case of the kimono virtual power shoulder jacket, the expressions of the torso wrinkles and buttons were slightly lower; however, the overall similarity, basic lines, ease, shoulder and neck details, and material expression of the virtual jackets were highly evaluated.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.45-54
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• 2020

Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• The Journal of Korean Obstetrics and Gynecology
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• v.30 no.4
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• pp.18-44
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• 2017

Purpose: The object of this study was to observe the anti-climacterium activity of Gagamguibiondam-tang (GGOT) on ovariectomized (OVX) rats, a well-documented rodent models resembles with women postmenopausal climacterium symptoms, as including cardiovascular diseases, obesity, hyperlipidemia, osteoporosis, organ steatosis and mental disorders. Methods: In this study, anti-climacteric effects were evaluated separated into three categories; 1) anti-obese, 2) anti-uterine atrophy and 3) anti-osteoporotic effects. Five groups were used (8 rats in each group); sham control, OVX control, GGOT 500, 250 and 125 mg/kg administered groups. Twenty-eight days after bilateral OVX surgery, GGOT were orally administered, once a day for 84 days, and then the changes on the body weight and gain during experimental periods, serum estradiol levels, abdominal fat pad and uterus weights with histopathology of abdominal fat pads (total thickness and mean adipocyte diameters) and uterus (total, epithelial and mucosal thickness, percentages of uterine gland regions) for anti-obese and estrogenic effects. In addition, femur, tibia and fourth or fifth lumbar vertebrae (L4 or L5) wet, dry and ash weights, mineral density (BMD), bone strength (failure load), serum osteocalcin and bone specific alkaline phosphatase (bALP) contents, histological and histomorphometrical analyses - bone mass and structure with bone resorption, were monitored for anti-osteoporosis activity. Results: As a result of OVX, noticeable increases of body weight and gains, food and water consumption, weights of abdominal fat pad deposited in dorsal abdominal cavity, serum osteocalcin levels were demonstrated in this experiment with decrease of uterus, femur, tibia and L5 weights, serum bALP and estradiol levels. In addition, marked hypertrophic changes of adipocytes located in deposited abdominal fat pads, uterine disused atrophic changes, decreases of bone mass and structures of femur, tibia and L4 were also observed in OVX control rats with dramatic increases of bone resorption markers, the Ocn and OS/BS at histopathological and histomorphometrical analysis in this study as compared with sham-operated control rats, suggesting the estrogen-deficient climacterium symptoms - obese and osteoporosis were induced by OVX, respectively. However, these estrogen-deficient climacterium symptoms induced by bilateral OVX in rats were significantly inhibited by 84 days of continuous oral treatment of GGOT 500, 250 and 125 mg/kg, respectively. Especially, GGOT 500, 250 and 125 mg/kg showed clear dose-dependent inhibitory activities on the OVX-induced climacterium signs. Conclusion: The results suggest that oral administration of GGOT 500, 250 and 125 mg/kg has clear dose-dependent favorable anti-climacterium effects - estrogenic, anti-obese and anti-osteoporotic activities in OVX rats in this experiment.

• Journal of Korean Society of Forest Science
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• v.96 no.4
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• pp.455-461
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• 2007

This research was processed on morphological and physical characteristics of 'Yongdong' cultivar nuts. (1)Morphological properties of 'Yongdong' cultivar nuts were significantly different from the control, native species, in respect of all properties. (2) 'Yongdong' cultivar nuts showed higher figures than the native species on 9 items of morphological properties (kernel weight, size, length and width of pad on suture and etc.), whereas other 6 items (height of pad on suture, thickness of shell and septem, fragment numbers of isolated kernel, roundness index, and etc.) showed lower figures than those of the control. (3) In physical properties of the nut shells, 'Yongdong' cultivar was superior to the control at all items with the exception of compressive prove distance. Accordingly, it was also verified as effective cultivar of shelled walnut with suture line direction applied the minimum strength. (4) 'Yongdong' cultivar, 21.9 kg, was approximately twice lower than the control, 42.6 kg, on maximum compressive weight. It was demonstrated that the 'Yongdong' cultivar characterized by easily crushing shell by small strength was great in cracking properties. (5) On the study of yield strength, the native species being twice higher than 'Yongdong' cultivar showed the properties of the small elasticity and the shell hardness. While, the suture line of 'Yongdong' cultivar having the lowest yield strength 15.6 kg and 16.0 kg was identified the shell crushed easily. (6) The movement distance of the compressive prove of 'Yongdong' cultivar, 4.2 mm, was longer than that of the control, 2.7 mm. Subsequently, it means that the amount of loss possibly occurring to distribution process was not great, whereby productive value was high. (7) The compressive strength of the suture line of 'Yongdong' cultivar, $9.1kg/cm^2$, was much lower than total average of that $12.4kg/cm^2$. It was also statistically different with other properties. (8)The hardness examination by the compressive position revealed that the suture line of 'Yongdong' cultivar, $149.8kg/cm^2$, was lowest in contrast with the control, $300.9kg/cm^2$.