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http://dx.doi.org/10.3740/MRSK.2008.18.1.045

Effect of Thermal Aging on Intermetallic Compound Growth Kinetics of Au Stud Bump  

Lim, Gi-Tae (School of Materials Science and Engineering, Andong National University)
Lee, Jang-Hee (School of Materials Science and Engineering, Andong National University)
Kim, Byoung-Joon (School of Materials Science and Engineering, Seoul National University)
Lee, Ki-Wook (R&D Center Amkor Technology Korea Inc.)
Lee, Min-Jae (R&D Center Amkor Technology Korea Inc.)
Joo, Young-Chang (School of Materials Science and Engineering, Seoul National University)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Korean Journal of Materials Research / v.18, no.1, 2008 , pp. 45-50 More about this Journal
Abstract
Microstructural evolution and the intermetallic compound (IMC) growth kinetics in an Au stud bump were studied via isothermal aging at 120, 150, and $180^{\circ}C$ for 300hrs. The $AlAu_4$ phase was observed in an Al pad/Au stud interface, and its thickness was kept constant during the aging treatment. AuSn, $AuSn_2,\;and\;AuSn_4$ phases formed at interface between the Au stud and Sn. $AuSn_2,\;AuSn_2/AuSn_4$, and AuSn phases dominantly grew as the aging time increased at $120^{\circ}C,\;150^{\circ}C,\;and\;180^{\circ}C$, respectively, while $(Au,Cu)_6Sn_5/Cu_3Sn$ phases formed at Sn/Cu interface with a negligible growth rate. Kirkendall voids formed at $AlAu_4/Au$, Au/Au-Sn IMC, and $Cu_3Sn/Cu$ interfaces and propagated continuously as the time increased. The apparent activation energy for the overall growth of the Au-Sn IMC was estimated to be 1.04 eV.
Keywords
intermetallic compound; growth kinetics; Kirkendall void; au stud bump; activation energy;
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