• 제목/요약/키워드: Pad thickness

검색결과 197건 처리시간 0.024초

후천성면역결핍증후군 환자에서의 저온 접촉 화상에 의한 삼도 화상의 치료 (Treatment of Third Degree Burn due to Low-Temperature Contact Burn on Acquired Immune Deficiency Syndrome (AIDS) Patient: Low-Temperature Burn on AIDS Patient)

  • 홍석원;최환준;김준혁;이다운
    • 대한화상학회지
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    • 제22권2호
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    • pp.21-24
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    • 2019
  • Incidence of low-temperature contact burn by use of an electric pad is increased recently, especially in depressed sensory. Acquired immune deficiency syndrome patient using antiretroviral agent suffered with sensory depression as side effect. There are many limitations in wounds treatment of these patients. These patients are vulnerable to infection due to their weak immunity, so it is necessary to keep them in a state of isolation when a wound occurs. We report a case of a third degree burn by electric pad with a surface area of approximately 5% of the body surface of a patient who underwent a sensory depression, which is a side effect of antiretroviral drugs used for treatment in patients with AIDS. In this regard, we report the case with literature review, which is safely recovered using negative-pressure wound therapy and split-thickness skin graft.

가변성형 공정에서 탄성 패드의 영향에 관한 수치적 연구 (Numerical Study on Effect of Using Elastic Pads in Flexible Forming Process)

  • 허성찬;서영호;노학곤;구태완;강범수
    • 대한기계학회논문집A
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    • 제34권5호
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    • pp.549-556
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    • 2010
  • 가변성형공정에서는 형상 변형이 가능한 가변금형의 성형면을 고르게 형성하기 위하여 일반적으로 우레탄, 고무 등 같은 탄성체 패드를 가변금형과 소재 사이에 삽입하여 이용한다. 이에 본 연구에서는 이러한 탄성패드가 성형성에 미치는 영향에 대한 조사를 위하여 탄성체의 경도 및 두께를 주요 변수로 고려한 수치해석적 연구를 수행하였다. 탄성패드 소재로는 우레탄을 이용하였으며, 이의 물성 획득을 위한 압축시험을 수행하였고, 초탄성체 재료 모델로 가정하여 가변성형공정해석에 적용하였다. 탄성체의 경도와 두께의 변화에 따른 해석 결과로부터 성형 정확도를 조사하기 위하여 주방향의 단면형상을 비교하였으며, 목적형상에 대한 오차를 비교하였다. 이로부터 가변성형공정에 이용되는 탄성 패드가 적절히 선정되어야 함을 확인하였으며, 패드의 경도 및 두께 선정에 대한 기준을 제안하였다.

BGA 패키지에서 Sn-Ag계 솔더범프와 Ni pad 사이에 형성된 금속간화합물의 분석 (Intermetallic Formation between Sn-Ag based Solder Bump and Ni Pad in BGA Package)

  • 양승택;정윤;김영호
    • 마이크로전자및패키징학회지
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    • 제9권2호
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    • pp.1-9
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    • 2002
  • 실제 BGA패키지에서 Sn-Ag-(Cu) 솔더와 금속패드가 반응하여 생성된 금속간 화합물의 특성을 Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS)f) X-ray Diffractometer (XRD)를 사용하여 분석하였다. EDS로 분석한 결과를 보면 BGA 패키지에서 Sn-Ag-Cu 솔더와 Au/Ni/Cu 금속층간의 반응으로 생성된 금속간화합물은 $(Cu,Ni)_6Sn_5$로 예상되며 . Cu의 편석은 솔더와 Ni 층 사이에서 발견되었다. XRD 분석결과 Cu를 함유하고 있는 Sn-Ag-Cu 솔더와 Ni층 사이에서는 $\eta -Cu_6 Sn_5$ 타입의 금속간화합물이 분석되었으며 Sn-Ag 솔더와 Ni층 사이에서는 $Ni_3$Sn_4$가 분석되었다. 계면에 생성된 금속간화합물은 리플로 회수와솔더내의 Cu의 함량에 따라증가하였다

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남성 요실금 팬티에 관한 연구 (A Study on Male Panties for Urinary Incontinence)

  • 이정순
    • 한국의상디자인학회지
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    • 제17권1호
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    • pp.39-52
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    • 2015
  • This study aims to analyze the characteristics of the male products for urinary incontinence by examining the types and characteristics of those registered in KIPO (Korean Industrial Property Office). Additionally, the types and characteristics, especially for the cloth products and the pads, of male panties for urinary incontinence on the market are analyzed. Men in their 60s with minor symptoms were selected as the subjects to evaluate the wearability. The results are as follows. 11 male products for urinary incontinence, registered in KIPO, are structurally different from those for women by having a separate pocket mainly for absorption. There are one disposable type and 7 cloth types, and the cloth panties can be classified as either united or separable type depending on the detachability of pads from the panties. The types of the panties vary according to the position, shape, and size of the attached pads on normal male panties (boxer, briefs, drawers). The fabrics for the urinary incontinence are usually piled in 3 to 5 layers by having the most absorptive layer on the top, the next with deodorizing characteristics, and the bottom with the waterproof fabric as basics with some additional layers of antibiotic or breathable fabrics. From the wearability test, it has been determined that the panties are not distinguishable in external appearance and the fitness is also not a problem since the size varies as the normal panties. It has been evaluated that the fitness of the panties is an important factor since the pad should be worn in any form; the pad sewed in the middle of the panties was evaluated to be more wearable than having a long pad. In case of separable panties, when the pattern and fabric is similar to the functional panties and the options such as the thickness of the pads or detachability are given to the users, it tends to be more satisfactory.

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LTCC기판과 BGA 솔더접합부의 계면반응 및 기계적 특성 (Interfacial Reaction and Mechanical Property of BGA Solder Joints with LTCC Substrate)

  • 유충식;하상수;김배균;장진규;서원찬;정승부
    • 대한금속재료학회지
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    • 제47권3호
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    • pp.202-208
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    • 2009
  • The effects of aging time on the microstructure and shear strength of the Low Temperature Co-fired Ceramic (LTCC)/Ag pad/Electroless Nickel Immersion Gold (ENIG)/BGA solder joints were investigated through isothermal aging at $150^{\circ}C$ for 1000 h with conventional Sn-37Pb and Sn-3Ag-0.5Cu. $Ni_3Sn_4$ intermetallic compound (IMC) layers was formed at the interface between Sn-37Pb solder and LTCC substrate as-reflowed state, while $(Ni,Cu)_3Sn_4$ IMC layer was formed between Sn-3Ag-0.5Cu solder and LTCC substrate. Additional $(Cu,Ni)_6Sn_5$ layer was found at the interface between the $(Ni,Cu)_3Sn_4$ layer and Sn-3Ag-0.5Cu solder after aging at $150^{\circ}C$ for 500 h. Thickness of the IMC layers increased and coarsened with increasing aging time. Shear strength of both solder joints increased with increasing aging time. Failure mode of BGA solder joints with LTCC substrate after shear testing revealed that shear strength of the joints depended on the adhesion between Ag metallization and LTCC. Fracture mechanism of Sn-37Pb solder joint was a mixture of ductile and pad lift, while that of Sn-3Ag-0.5Cu solder joint was a mixture of ductile and brittle $(Ni,Cu)_3Sn_4$ IMC fracture morphology. Failure mechanisms of LTCC/Ag pad/ENIG/BGA solder joints were also interpreted by finite element analyses.

자동차용 마찰재에 사용되는 흑연과 마그네시아에 따른 전이막과 마찰특성에 관한 연구 (The Effects of Graphite and Magnesium Oxide in Automotive Friction Materials on Friction and Formation of Transfer Film)

  • 배은갑;윤장혁;장호
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2002년도 제35회 춘계학술대회
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    • pp.226-234
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    • 2002
  • A systematic study of the role of transfer films on friction properties was performed with various temperatures in the brake system. An NAO friction material specimens containing 9 ingredients were tested using a pad-on-disk type friction tester A new method of measuring the transfer film thickness was developed by considering the electrical resistance of the transfer film using a 4-point probe technique. The properties of transfer film such as surface morphology and film distribution vaied according to the relative amount of graphite and magnesium oxide. By using SEM, it was possible to obtain information about the chemical composition of the transfer film. Results showed that there detected a threshold value of the relative amount of a two active materials to maintain a certiain thickness of a transfer film. Results also showed that formation of friction layer generated on the friction surface was strongly affected by chemical action of two ingredients during sliding due to chemical reaction of solid lubricants at different interface temperature. The results suggested that no apparent relationship between transfer film thickness and the average friction coefficient was founded and friction characteristics were affected more by the property of the solid lubricant and abrasive in the material.

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초미세 금속 박판 홀 어레이 가공 (Fabrication of Ultra Small Size Hole Array on Thin Metal Foil)

  • 임성한;손영기;오수익
    • 소성∙가공
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    • 제15권1호
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    • pp.9-14
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    • 2006
  • In the present research, the simultaneous punching of ultra small size hole of $2\~10\;{\mu}m$ in diameter on flat rolled thin metal foils was conducted with elastic polymer punch. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of 1.5fm in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The process set-up is similar to that of the flexible rubber pad farming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions. The effects of the wafer die hole dimension and heat treatment of the workpiece on ultra small size hole formation of the thin foil were discussed. The process condition such as proper die shape, pressure, pressure rate and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole away in a one step operation.

Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System

  • Lee, Sang-Ho;Kang, Young-Jae;Park, Jin-Goo;Kwon, Pan-Ki;Kim, Chang-Il;Oh, Chan-Kwon;Kim, Soo-Myoung;Jhon, Myung-S.;Hur, Se-An;Kim, Young-Jung;Kim, Bong-Ho
    • Transactions on Electrical and Electronic Materials
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    • 제7권4호
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    • pp.163-166
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    • 2006
  • The dishing and the erosion were evaluated on the tungsten CMP process with conventional and new developed slurry. The tungsten thin film was polished by orbital polishing equipment. Commercial pattern wafer was used for the evaluation. Both slurries were pre tested on the oxide region on the wafer surface and the removal rate was not different very much. At the pattern density examination, the erosion performance was increased at all processing condition due to the reduction of thickness loss in new slurry. However, the dishing thickness was not remarkably changed at high pattern density despite of the improvement at low pattern density. At the large pad area, the reduction of dishing thickness was clearly found at new tungsten slurry.

미세 홀 어레이 펀칭 가공 (Punching of Micro-Hole Array)

  • 손영기;오수익;임성한
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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    • pp.193-197
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    • 2005
  • This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.

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A Simple Strategy in Avulsion Flap Injury: Prediction of Flap Viability Using Wood's Lamp Illumination and Resurfacing with a Full-thickness Skin Graft

  • Lim, Hyoseob;Han, Dae Hee;Lee, Il Jae;Park, Myong Chul
    • Archives of Plastic Surgery
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    • 제41권2호
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    • pp.126-132
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    • 2014
  • Background Extensive degloving injuries of the extremities usually result in necrosis of the flap, necessitating comprehensive skin grafting. Provided there is a sufficient tool to evaluate flap viability, full-thickness skin can be used from a nonviable avulsed flap. We used a Wood's lamp to determine the viability of avulsed flaps in the operation field after intravenous injection of fluorescein dye. Methods We experienced 13 cases during 16 months. Fifteen minutes after the intravenous injection of fluorescein dye, the avulsed skin flaps were examined and non-fluorescent areas were marked under Wood's lamp illumination. The marked area was defatted for full-thickness skin grafting. The fluorescent areas were sutured directly without tension. The non-fluorescent areas were covered by defatted skin. Several days later, there was soft tissue necrosis within the flap area. We measured necrotic area and revised the flap. Results Among all the cases, necrotic area was 21.3% of the total avulsed area. However, if we exclude three cases, one of a carelessly managed patient and two cases of the flaps were inappropriately applied, good results were obtained, with a necrotic area of only 8.4%. Eight patients needed split-thickness skin grafts, and heel pad reconstruction was performed with free flap. Conclusions A full-thickness skin graft from an avulsed flap is a good method for addressing aesthetic concerns without producing donor site morbidity. Fluorescein dye is a useful, simple, and cost-effective tool for evaluating flap viability. Avulsed flap injuries can be managed well with Wood's lamp illumination and a full-thickness skin graft.