• Journal of the Semiconductor & Display Technology
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• v.22 no.2
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• pp.81-86
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• 2023

Recently, there has been an increased demand for light-emitting diode (LED) due to the growing emphasis on environmental protection. However, the use of GaN-based sapphire in LED manufacturing leads to the generation of defects, such as dislocations caused by lattice mismatch, which ultimately reduces the luminous efficiency of LEDs. Moreover, most inspections for LED semiconductors focus on evaluating the luminous efficiency after packaging. To address these challenges, this paper aims to detect defects at the wafer stage, which could potentially improve the manufacturing process and reduce costs. To achieve this, image processing and deep learning-based defect detection techniques for Sapphire Epi-Wafer used in Green LED manufacturing were developed and compared. Through performance evaluation of each algorithm, it was found that the deep learning approach outperformed the image processing approach in terms of detection accuracy and efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.37-45
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• 2004

Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and $13 wt.\%$P). A reaction between Sn penetrated through the channels among $Ni_3Sn_4$ IMCs and the P-rich layer ($Ni_3P$) of the Ni(P) film formed a $Ni_3SnP$ layer. Thickening of the $Ni_3SnP$ layer led to $Ni_3Sn_4$ spatting. After $Ni_3Sn_4$ spatting, the Ni(P) film directly contacted the molten solder and the $Ni_3P$ phase further transformed into a $Ni_2P$ phase. During the crystallization process, some cracks formed in the Ni(P) film to release tensile stress accumulated from volume shrinkage of the film.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.11-15
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• 2001

In this paper, hermetic sealing technology was studied for wafer level packaging of the RF-MEMS devices. With the flip-chip bonding method. this non-conductive B-stage epoxy sealing will be profit to the MEMS device sealing. It will be particularly profit to the RF-MEMS device sealing. B-stage epoxy can be cured by 2-step and hermetic sealing can be obtained. After defining 500 $\mu\textrm{m}$-width seal-lines on the glass cap substrate by screen printing, it was pre-baked at $90^{\circ}C$ for about 30 minutes. It was, then, aligned and bonded with device substrate followed by post-baked at $175^{\circ}C$ for about 30 minutes. By using this 2-step baking characteristic, the width and the height of the seal-line could be maintained during the sealing process. The height of the seal-line was controlled within $\pm$0.6 $\mu\textrm{m}$ in the 4 inches wafer and the bonding strength was measured to about 20MPa by pull test. The leak rate, that is sealing characteristic of the B-stage epoxy, was about $10^{-7}$ cc/sec from the leak test.

• Korean Journal of Organic Agriculture
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• v.27 no.4
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• pp.437-452
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• 2019

The HACCP evaluation standards for the meat packaging plant are divided into general scale HACCP evaluation standard and small scale HACCP evaluation standard. There are 69 evaluation items in the general scale HACCP evaluation criteria, of which 54 items in the prerequisite management and 15 items in the HACCP management are included. The number of small scale HACCP evaluation items are 20 and about 29% of the general scale HACCP evaluation items. This may not be enough to produce a safety livestock products for the purpose of implementing the HACCP system due to the nature of the meat packaging plant, which does not show much difference in the production process or method of product depending on the scale. To improve the small scale HACCP evaluation standard, the importance of each item was compared with the small scale HACCP evaluation based on the rate of non-compliance and the severity levels in the general scale HACCP evaluation items. As a result of the study, 8 items were derived from the prerequisites management, 2 items were derived from the HACCP management, and some similar evaluation items were grouped together. Finally, 10 items were added to the 20 items of the existing small scale HACCP evaluation items. In this study, study on the safety management of domestic livestock products are continuously carried out, so that it is possible to provide safety livestock products to consumers and contributes to securing competitiveness of domestic livestock industry.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.111-119
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• 2005

Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

• Journal of Food Hygiene and Safety
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• v.32 no.2
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• pp.114-122
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• 2017

N-nitrosamines can be produced in the process of heating, processing, storage and packaging. Migration specifications for N-nitrosamines exist only for rubber baby bottle nipples, which are regulated by the Ministry of Food and Drug Safety (MFDS). There is no regulation for other food contact substances (FCS) and studies on N-nitrosamines migration from FCS are rather limited. A pilot study showed an increase in N-nitrosamines contents when cooking instant noodles. Thus, the migration from the packaging was suspected and it was necessary to monitor the migration of N-nitrosamines from food packaging materials and to examine the change in N-nitrosamines contents when cooking instant foods. Three N-nitrosamines, NDMA (N-nitrosodimethtlamine), NDEA (N-nitrosodiethylamine), NDBA (N-nitrosodibutylamine), were analyzed in migration test solutions from plastics such as polyethylene, polypropylene and polystyrene, papers and aluminium containers. In all test solutions, N-nitrosamines were detected less than method quantitation limits (MQLs). Food samples were also investigated to ensure that there is no effect from food contact substances when cooking instant foods. In retort sauces such as curry, black soybean sauce and tomato sauce, NDMA concentration was ranged from 0.54 to $3.81{\mu}g/kg$, but there were no significant differences between unheated and heated samples. However, the NDMA contents were significantly increased in most of the instant noodle samples tested when cooked (p < 0.05). No effects from the food contact substances or cooking water was observed. Only when the seasoning powder and noodles were cooked together was NDMA detected. Individual components (noodle, seasoning powder or dried vegetable) or other combinations such as noodles and dried vegetables did not generate N-nitrosamines. Therefore, it is speculated that NDMA may be formed from the precursors in noodles and seasoning powders when they are solubilized in a medium of water.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.1-12
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• 2021

Here, we introduce a laser-induced graphene synthesis technology and its applications for the electric/electronic device manufacturing process. Recently, the micro/nanopatterning technique of graphene has received great attention for the utilization of these new graphene structures, which shows progress developments at present with a variety of uses in electronic devices. Some examples of practical applications suggested a great potential for the tunable graphene synthetic manners through the control of the laser set-up, such as a selection of the wavelength, power adjustment, and optical techniques. This emerging technology has expandability to electric/electronic devices combined together with existed micro-packaging technology and can be integrated with the new processing steps to be applied for the operation in the fields of biosensors, supercapacitors, electrochemical sensors, etc. We believe that the laser-induced graphene technology introduced in this paper can be easily applied to portable small electronic devices and wearable electronics in the near future.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.37-42
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• 2022

Recently, the semiconductor package structures are becoming thinner and more complex. As the thickness decrease, interfacial delamination due to material mismatch can be further maximized, so the reliability of interface is a critical issue in industry field. Especially, the polymers, which are widely used in semiconductor packaging, are significantly affected by the temperature and moisture. Therefore, in this study, the delamination prediction at the interface of package structure was performed through finite element analysis considering the moisture absorption and desorption under the various temperature conditions. The material properties such as diffusivity and saturated moisture content were obtained from moisture absorption test. The hygro-swelling coefficients of each material were analyzed through TMA and TGA after the moisture absorption. The micro-shear test was conducted to evaluate the adhesion strength of each interface at various temperatures considering the moisture effect. The finite element analysis of interfacial delamination was performed that considers both deformation due to temperature and moisture absorption. Consequently, the interfacial delamination was successfully predicted in consideration of the in-situ moisture desorption and temperature behavior during the reflow process.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.1
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• pp.30-36
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• 1999

Physical analysis of some composite films of outer packaging at process cheeses in Korea is as following. In comparison with four composite films, tensile strength is $72.2{\mu}PET/PVDC/PE/AL-vac/PE\;film\;MD9.55kg/15mm,\;TD8.95kg/15mm>79.3{\mu}PET/PVDC/L-LDPE\;film\;MD5.37kg/15mm,\;TD5.01kg/15mm>96.9{\mu}PE/PVDC/PE\;film\;MD5.42kg/15mm,\;TD4.73kg/15mm>61.6{\mu}PVDC/PE/AL-vac/CPS\;film\;MD4.65kg/15mm,\;TD4.22kg/15mm$. Water vapor transmission is $72.2{\mu}PET/PVDC/PE/AL-vac/PE\;film\;0.41g/m^2{\cdot}24hr>79.3{\mu}PET/PVDC/L-LDPE\;film\;3.77g/m^2{\cdot}24hr>96.9{\mu}PE/PVDC/PE\;film\;3.81g/m^2{\cdot}24hr>61.6{\mu}PVDC/PE/AL-vac/4.91g/m^2{\cdot}24hr$. Gas transmission $O_2:N_2:CO_2$ is $72.2{\mu}PET/PVDC/PE/AL-vac/PE\;film\;1.81:0.74:4.2cc/m^2{\cdot}24hr{\cdot}atm>79.3{\mu}PET/PVDC/L-LDPE\;film\;13.4:6.4:34.2cc/m^2{\cdot}24hr{\cdot}atm>96.9{\mu}PE/PVDC/PE\;film\;15.3:7.1:42.0cc/m^2{\cdot}24hr{\cdot}atm>61.6{\mu}PVDC/PE/AL-vac/CPS\;film\;25.3:12.5:59.3cc/m^2{\cdot}24hr{\cdot}atm$ each other. And for preservation this were sealed to filths $N_2,\;CO_2$ gas or defilling ai (vacuum type) in the packaging and reserved less than $10^{\circ}C$ at refrigerator.