• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.289-296
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• 1999

The integration of the LSI has been greatly improved and the circuit patters on the LSI are becoming finer line and pitch. The high-density electronic packaging technology is improved. In order to realize the high-density packaging technology, the density of the circuit wiring of the printed circuit boards have also been more dense. The build-up process multilayer printed circuit board technology have a lot of vias, possibilities of the finer conductor wirings and have a freedom of capabilities of wiring design. The build-up process printed circuit boards have the wiring rules which are the pattern width: $100-20\mu\textrm{m}$, the via hole diameter: $100-50\mu\textrm{m}$. There three kinds of build-up processes as far materials and hole drilling. In this paper, the recent technology trends of the build-up printed circuit board technologies are described.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.22 no.2
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• pp.227-235
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• 2024

After the permanent shut down of Kori Unit 1, various decommissioning activities will be implemented, including decontamination, segmentation, waste management, and site restoration. During the decommissioning period, waste management is among the most important activities to ensure that the process proceeds smoothly and within the expected timeframe. Furthermore, the radioactive waste generated during the operation should be sent to a disposal facility to complete the decommissioning project. Square and cylindrical concrete re-package drums were generated during the 1980s and 1990s. The square, containing boron concentrates, and cylindrical, containing spent resin, concrete re-package drums have been stored in a radioactive waste storage building. Homogeneous radioactive waste, including boron concentrates, spent resin, and sludge, should be solidified or packaged in high-integrity containers (HICs). This study investigates the sequential segmentation process for the separation of contaminated and non-contaminated regions, the re-packaging process of segmented or crushed cement-solidified boron concentrate, and re-packaging in HICs. The conceptual design evaluates the re-packaging plan for the segmented and crushed cement-solidified waste using HICs, which is acceptable in a disposal facility, and the quantity of generated HICs from the treatment process.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.53-58
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• 2013

An innovative packaging solution, Flip Chip with Copper (Cu) Column bond on lead (BOL) Enhanced Process (fcCuBE$^{(R)}$) delivers a cost effective, high performance packaging solution over typical bond on capture pad (BOC) technology. These advantages include improved routing efficiency on the substrate top layer thus allowing conversion functionality; furthermore, package cost is lowered by means of reduced substrate layer count and removal of solder on pad (SOP). On the other hand, as electronic packaging technology develops to meet the miniaturization trend from consumer demand, reliability testing will become an important issue in advanced technology area. In particular, electromigration (EM) of flip chip bumps is an increasing reliability concern in the manufacturing of integrated circuit (IC) components and electronic systems. This paper presents the results on EM characteristics on BOL and BOC structures under electrical current stressing in order to investigate the comparison between two different typed structures. EM data was collected for over 7000 hours under accelerated conditions (temperatures: $125^{\circ}C$, $135^{\circ}C$, and $150^{\circ}C$ and stress current: 300 mA, 400 mA, and 500 mA). All samples have been tested without any failures, however, we attempted to find morphologies induced by EM effects through cross-sectional analysis and investigated the interfacial reaction characteristics between BOL and BOC structures under current stressing. EM damage was observed at the solder joint of BOC structure but the BOL structure did not show any damage from the effects of EM. The EM data indicates that the fcCuBE$^{(R)}$ BOL Cu column bump provides a significantly better EM reliability.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.2
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• pp.29-36
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• 2008

In this paper, mechanical reliability issues of copper through-wafer interconnections are investigated numerically and experimentally. A hermetic wafer level packaging for MEMS devices is developed. Au-Sn eutectic bonding technology is used to achieve hermetic sealing, and the vertical through-hole via filled with electroplated copper for the electrical connection is also used. The MEMS package has the size of $1mm{\times}1mm{\times}700{\mu}m$. The robustness of the package is confirmed by several reliability tests. Several factors which could induce via hole cracking failure are investigated such as thermal expansion mismatch, via etch profile, and copper diffusion phenomenon. Alternative electroplating process is suggested for preventing Cu diffusion and increasing the adhesion performance of the electroplating process. After implementing several improvements, reliability tests were performed, and via hole cracking as well as significant changes in the shear strength were not observed. Helium leak testing indicated that the leak rate of the package meets the requirements of MIL-STD-883F specification.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.57-65
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• 2003

In this study, we carry out reliability tests and investigate the failure mechanisms of the anodically bonded wafer level vacuum packaging (WLVP) MEMS gyroscope sensor. There are three failure mechanisms of WLVP: leakage, permeation and out-gassing. The leakage is caused by small dimension of the leak channel through the bonding interface and internal defects. The larger bonding width and the use of single crystalline silicon can reduce the leak rate. Silicon and glass wafer itself generates a large amount of outgassing including $H_2O$, $C_3H_5$, $CO_2$, and organic gases. Epi-poly wafer generates 10 times larger amount of outgassing than SOI wafer. The sandblasting process in the glass increases outgassing substantially. Outgassing can be minimized by pre-baking of the wafer in the vacuum oven before bonding process. An optimum pre-baking temperature of the wafers would be between $400^{\circ}C$ and $500^{\circ}C$.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.26 no.3
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• pp.165-171
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• 2020

Maintaining steady and low temperature during distribution process is a key technique to inhibit microbial growth, one of the most important factors in determining the shelf life. It is possible to provide high-quality fresh products to consumers only when precise and adequate temperature control is guaranteed throughout the entire distribution process for fresh seafood. This study investigated the shelf-life of packaged fresh flounder (Paralichthys Olivaceus) in order to learn the feasibility of super-chilled distribution of fresh seafood. To estimate the shelf life, weight, number of bacteria such as E. coli, pH, sensory test and volatile basic nitrogen were investigated. As a result of the study, the difference in shelf life of 6 days at the super-chilling temperature (0±1℃) and 1 day at the general refrigeration temperature (8±2℃) (based on volatile base nitrogen) showed the market possibility of super-chilling distribution. Through additional empirical studies such as packaging methods and economic feasibility, it is expected to promote commercialization of super-chilling containers and packaging system developed in the future and secure customer reliability.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.21 no.1
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• pp.27-34
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• 2015

Heating patterns depending on the packaging materials were examined in order to investigate the causes of thermal deformation of packages used for ready-to-eat foods for microwave heating due to the non-uniformity of microwaves. Physical properties including tensile strength, heat-resistance and elongation of four different CPP grades were compared. High retortable CPP had higher sealing strength and heat resistance compared to the conventional CPPs. All CPP samples tested were proved to have melting temperatures around $160^{\circ}C$. However, they were all thermally deformed by microwave heating due to a limited penetration of microwave and non-uniform heating within the spicy sauce of high viscosity contained high salt, especially on the above the filling line and sealing edge of pouches. When the laminated stand-up pouches composed of G-PET/PET/PET/CPP and G-PET/PET/NY/CPP were retorted and microwaved, significant deformations were noticed in both samples after retorting. Besides, pouches contained titanium dioxide showed more intense thermal deformation than the control. When the $10{\mu}m$ aluminium foil was affixed on the pouch, small thermal deformation was observed only in the bottom layer. More studies are required to prevent the thermal deformation of packaging materials used for RTE foods during microwave heating by developing the technologies to increase the thermal stability of CPP layer and the modification of packaging design to modify the microwave access into the package.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.183-192
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• 2022

With the growth of the packaging industry, demand on the packaging printing comes in various forms. Customers' orders are diversifying and the standards for quality are increasing. Offset printing is mainly used in the packaging printing since it is easy to print in large quantities. However, productivity of the offset printing decreases when printing various order. This is because it takes time to change colors for each printing unit. Therefore, scheduling that minimizes the color replacement time and shortens the overall makespan is required. By the existing manual method based on workers' experience or intuition, scheduling results may vary for workers and this uncertainty increase the production cost. In this study, we propose an automated scheduling method of parallel offset printing process for packaging printing. We decompose the original problem into assigning and sequencing orders, and ink arrangement for printing problems. Vehicle routing problem and assignment problem are applied to each part. Mixed integer programming is used to model the problem mathematically. But it needs a lot of computational time to solve as the size of the problem grows. So guided local search algorithm is used to solve the problem. Through actual data experiments, we reviewed our method's applicability and role in the field.

• Korean Journal of Oriental Medicine
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• v.18 no.3
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• pp.87-93
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• 2012

Objectives : The present study is to verify whether the deformation of ear acupuncture needle tips that are currently on the market is caused during the process of initial packaging. Methods : Ear acupuncture needles distributed from three different companies were collected to measure the size of the groove on the transparent plate which is used in for the intial packaging. Then the tolerance range for off-centered tips, which represent the range of the groove size that is safe from damaging the needle tip, was determined based on the vertical length measured from tip to handle. 200 ear acupuncture needles were dipped in alcohol and scanned to confirm the position of the needles. Stereo-microscope was used to observe the needle tips that were located outside the tolerance range. Results : The increased number of ear acupuncture needle tips placed outside the tolerance range were seen from in the order of C company, A company and B company. The increased deformation of the needle tips caused by initial packaging was observed in the order of A company, C company and B company. Conclusion : Only the ear acupuncture needles from B company showed the strong correlation between needle tip deformation and initial packaging. It has been observed that the deformation of the ear acupuncture needles is mainly due to manufacturing process, not the packaging process.