• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.27-30
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.45-48
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• 1999

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.04a
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• pp.39-64
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• 2003

• Journal of the Microelectronics and Packaging Society
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• v.25 no.1
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• pp.23-28
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• 2018

Under the 4th Industrial Revolution, implementation of Smart Factory in the field of surface mounting is an emerging issue. In the field of surface mounting, many researches are going on in line with these changes. Among them, we analyzed the method of optimizing the solder printing process which is a core process and the influence of the external factors affecting the printing efficiency. In this analysis, the Big Data provided by the SPI Machine was used to approach the statistical method, and the possibility of predicting the result through simulation with reliable results was confirmed. I hope this study contributes a little to the Smart Factory implementation.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.14 no.7
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• pp.2938-2956
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• 2020

Objective image quality assessment (IQA) models have been developed by effective features to imitate the characteristics of human visual system (HVS). Actually, HVS is extremely sensitive to color degradation and complex texture changes. In this paper, we firstly reveal that many existing full reference image quality assessment (FR-IQA) methods can hardly measure the image quality with contrast and masking texture changes. To solve this problem, considering texture masking effect, we proposed a novel FR-IQA method, called Texture and Color Quality Index (TCQI). The proposed method considers both in the masking effect texture and color visual perceptual threshold, which adopts three kinds of features to reflect masking texture, color difference and structural information. Furthermore, random forest (RF) is used to address the drawbacks of existing pooling technologies. Compared with other traditional learning-based tools (support vector regression and neural network), RF can achieve the better prediction performance. Experiments conducted on five large-scale databases demonstrate that our approach is highly consistent with subjective perception, outperforms twelve the state-of-the-art IQA models in terms of prediction accuracy and keeps a moderate computational complexity. The cross database validation also validates our approach achieves the ability to maintain high robustness.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.41 no.2
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• pp.55-63
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• 2009

This study was performed to evaluate the heavy metal contents in various packaging board. Domestic and foreign OCC (old corrugated containers) and old duplex boards were used as raw materials. Tests were made for the printed and unprinted parts of the sample. Heavy metal contents of old food packaging boards made from virgin pulp fibers were also evaluated. The contents of heavy metals including lead (Pb), cadmium (Cd), barium (Ba), arsenic (As), antimony (Sb), selenium (Se), and mercury (Hg) were determined using ICP-AES (Inductively Coupled Plasma - Atomic Emission Spectrometer), and CV-AAS (Cold vapor-atomic absorption spectrometer) after digesting the samples in a microwave oven. The contents of heavy metals contained in domestic packaging board were higher than those in overseas samples, and OCC showed higher contents of heavy metals than old duplex boards. Printed parts gave greater heavy metal contents than unprinted parts. Results indicate that recycling of paper and paperboard products increases the heavy metal contamination of the paper packaging products and this derives mostly from the heavy metals contained in printing inks. Recycling processes that decrease heavy metals in recycled fibers and new printing inks that contains less heavy metals should be developed to solve the problem associated with the heavy metals in packaging paper products.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.9 no.1
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• pp.1-6
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• 2003

The partitioning behavior of five printing ink solvents was studied in various cookie ingredients before and after baking which had different water content and different structure. Solvents were ethyl acetate, hexane, isopropanol, methyl ethyl ketone, and toluene which represent different characteristic functional groups. Gas chromatography (G.C.) was used to measure partitioning values at $25^{\circ}C$ on each raw and baked cookie ingredients. Baking condition of cookie ingredients was $260^{\circ}C$ for 10 min. In cookie ingredients, decreases in water content generally affected Kp of polar solvents, but did not affect that of the non-polar solvents. However, as water content decreased in the cookie ingredient, the Kp of the non-polar and polar solvents showed mixed results.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.2
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• pp.47-50
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• 2019

Migration behavior of printing ink solvents on three types of chocolates with different fat content and fat compositions (different crystallinity) was investigated. Even though chocolate cream (29%) has lower fat content (29%) than that of chips (48%), it showed higher degree of migration. However, with increasing temperature, degree of migration was depended on mainly fat content. This result indicated that degree of migration was mainly affected by crystallinity at below melting point of chocolate, but the effect was diminshed as the temperature was close to melting temperature.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.1
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• pp.9-16
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• 2021

The present study was conducted to accomplish management efficiency by preparing preemptive measures for consumer dissatisfaction and overcome risks caused by Global Warming through studies of model cases in packaging. Through this study, we made it possible to find a way for companies to prepare for Global warming and consumer dissatisfaction. By contributing to eco-friendly packaging, we are trying to preemptively respond to recent major issues through packaging. Through this experiment, we tried to measure the degree of penetration of Plodia interpunctella H. larva into the insect repellent film produced by printing Ink containing a natural repellent. The control experiment was conducted with an untreated LDPE film to which no insect repellent was applied. The numbers decreased from 17 to 7 when the film was processed with repellent to show experimental results verifying effects of repellent by decrease in 10 (58.8% Decrease). Such results show that it is safe when the film is unfolded but in the case where the film is folded, the Plodia interpunctella H. punches through the film to lead to consumer dissatisfaction and it suggests that this can bring on risks to corporate management. Considering that most of the film is folded in the case of PE bag packaging, the direction which the corporations should take in terms of preparing for climate change countermeasures and consumer dissatisfaction has been clarified. Due to it receiving satisfactory results in safety rest results for printing film applied with pest repellent as well as the Quality analysis to test repellent contents of repellent film, it is certain that the importance of repellent method in packaging will increase in preparing for consumer dissatisfaction and actions against climate change henceforth.