Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 1999.11a
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- Pages.27-30
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- 1999
Development of Build up Multi Layer Board Rapid Manufacturing Process Using Screen Printing Technology
스크린인쇄법을 애용한 빌드업다층인쇄회로기판의 쾌속제조공정 기술개발
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